Product Specifications
The XC6VHX380T-2FF1923I features robust technical specifications that set it apart in the FPGA market:
Core Architecture:
- Logic Cells: 380,000 system gates providing extensive programmable logic capacity
- Speed Grade: -2 for optimized performance and timing characteristics
- Package Type: FF1923 (Fine-pitch Ball Grid Array) with 1923 pins
- Operating Grade: Industrial temperature range (-40ยฐC to +100ยฐC)
Memory and DSP Capabilities:
- Integrated Block RAM for high-speed data storage and buffering
- Dedicated DSP48E1 slices for signal processing applications
- Advanced memory controllers supporting various memory interfaces
- High-speed transceivers for multi-gigabit serial communication
I/O and Connectivity:
- Extensive user I/O pins for flexible system integration
- Multiple high-speed serial transceivers
- Support for various I/O standards including LVDS, SSTL, and HSTL
- Advanced clocking resources with multiple clock management tiles
The XC6VHX380T-2FF1923I incorporates Xilinx’s 40nm process technology, delivering exceptional power efficiency while maintaining high performance standards essential for modern FPGA applications.
Price
Pricing for the XC6VHX380T-2FF1923I varies based on quantity, distribution channel, and market conditions. Contact authorized Xilinx distributors for current pricing information and volume discounts. The XC6VHX380T-2FF1923I represents a premium investment in high-performance FPGA technology, with pricing reflecting its advanced capabilities and industrial-grade specifications.
Factors affecting XC6VHX380T-2FF1923I pricing include:
- Order quantity and volume pricing tiers
- Lead times and availability
- Regional market variations
- Special packaging or testing requirements
Documents & Media
Comprehensive technical documentation supports the XC6VHX380T-2FF1923I implementation:
Technical Documentation:
- Product datasheet with complete electrical and timing specifications
- User guide detailing configuration and programming procedures
- Package and pinout information for PCB design
- Power consumption analysis and thermal considerations
Design Resources:
- Reference designs and application notes
- Software development tools and IP cores
- Simulation models and timing analysis tools
- Programming and configuration guides
Support Materials:
- Errata documents and known issues
- Migration guides from previous FPGA generations
- Best practices for XC6VHX380T-2FF1923I implementation
- Video tutorials and training materials
All documentation for the XC6VHX380T-2FF1923I is available through Xilinx’s official support channels and authorized distribution partners.
Related Resources
The XC6VHX380T-2FF1923I ecosystem includes comprehensive development tools and related products:
Development Tools:
- Vivado Design Suite for synthesis, implementation, and debugging
- ISE Design Suite legacy support for established design flows
- ChipScope Pro analyzer for real-time debugging
- System Generator for DSP applications
Compatible Products:
- Other Virtex-6 HXT series FPGAs for scalable solutions
- Xilinx Zynq SoCs for ARM+FPGA integration
- Memory interfaces and controllers
- High-speed connector solutions
Third-Party Support:
- Board-level products featuring the XC6VHX380T-2FF1923I
- IP core libraries from Xilinx partners
- Design services and consulting support
- Training and certification programs
The XC6VHX380T-2FF1923I benefits from Xilinx’s extensive partner ecosystem, ensuring comprehensive support throughout the product lifecycle.
Environmental & Export Classifications
The XC6VHX380T-2FF1923I meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant for lead-free manufacturing
- REACH regulation compliance for chemical safety
- Conflict minerals reporting compliance
- Environmental management system certifications
Export Control Classifications:
- Export Control Classification Number (ECCN) as designated by US Department of Commerce
- International Traffic in Arms Regulations (ITAR) status
- Regional export restriction compliance
- End-use and end-user verification requirements
Quality Standards:
- ISO 9001 manufacturing quality standards
- Automotive qualification standards where applicable
- Military and aerospace certifications for defense applications
- Extended temperature range validation
Packaging and Handling:
- Moisture sensitivity level (MSL) specifications
- ESD protection requirements during handling
- Storage and shipping environmental conditions
- Lead-free soldering process compatibility
The XC6VHX380T-2FF1923I undergoes rigorous testing and qualification processes to ensure reliability in demanding applications while maintaining full compliance with international environmental and export regulations.
The XC6VHX380T-2FF1923I represents Xilinx’s commitment to delivering high-performance FPGA solutions for next-generation applications requiring exceptional processing power, connectivity, and reliability.
