Product Specifications
The XC6VHX380T-2FF1923E delivers outstanding performance with its comprehensive feature set:
Core Architecture:
- Logic Cells: 380,000 equivalent logic cells providing extensive processing capability
- CLB Slices: 59,280 configurable logic block slices for flexible design implementation
- Block RAM: 1,344 Kb total block RAM capacity for efficient data storage and buffering
- DSP Slices: 864 DSP48E1 slices enabling high-speed digital signal processing operations
Memory and Processing:
- Distributed RAM: 14,820 Kb distributed RAM for fast access memory requirements
- Speed Grade: -2 speed grade ensuring optimal timing performance for critical applications
- Maximum User I/O: 1,200 user I/O pins supporting extensive connectivity options
Package Details:
- Package Type: FF1923 Fine-Pitch Ball Grid Array (FBGA)
- Pin Count: 1923 pins in compact form factor
- Operating Temperature: Extended commercial temperature range
- Voltage: Multiple I/O voltage standards supported (1.2V, 1.5V, 1.8V, 2.5V, 3.3V)
The XC6VHX380T-2FF1923E features advanced transceiver technology with integrated GTX transceivers capable of supporting high-speed serial communication protocols up to 6.6 Gbps per channel.
Price
XC6VHX380T-2FF1923E pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing information:
- Sample Quantities: Available for prototyping and evaluation purposes
- Production Volumes: Competitive pricing tiers for volume orders
- Lead Time: Standard lead times apply; expedited delivery options available
- Lifecycle Status: Active product with full manufacturer support
For the most current XC6VHX380T-2FF1923E pricing and availability, consult official Xilinx distributors or authorized electronics component suppliers.
Documents & Media
Essential documentation and resources for the XC6VHX380T-2FF1923E:
Technical Documentation:
- Datasheet: Complete electrical characteristics and specifications
- User Guide: Comprehensive implementation guidelines and best practices
- Package Information: Detailed pinout diagrams and mechanical drawings
- Migration Guide: Instructions for upgrading from previous FPGA generations
Development Resources:
- Reference Designs: Proven application examples and starter projects
- IP Cores: Pre-verified intellectual property blocks for rapid development
- Application Notes: Detailed implementation guidance for specific use cases
- Errata Documents: Known issues and recommended workarounds
Software Tools:
- Vivado Design Suite: Latest development environment compatibility
- ISE Design Suite: Legacy tool support for existing projects
- ChipScope Pro: Integrated debugging and analysis capabilities
All XC6VHX380T-2FF1923E documentation is available through the official Xilinx support portal and authorized distributor websites.
Related Resources
Development Boards and Kits:
- Evaluation Boards: Purpose-built platforms featuring the XC6VHX380T-2FF1923E
- Development Kits: Complete systems including software, cables, and documentation
- Reference Platforms: Industry-standard development environments
Compatible Products:
- Memory Interfaces: DDR3, DDR2, QDR-II+ SRAM compatibility
- Connectivity Solutions: PCIe, Ethernet, USB interface support
- Power Management: Recommended power supply and regulation circuits
Training and Support:
- Technical Training: Comprehensive courses on Virtex-6 architecture and implementation
- Design Services: Professional consulting and development assistance
- Community Forums: Peer-to-peer support and knowledge sharing platforms
Third-Party Solutions:
- IP Providers: Certified third-party IP cores optimized for the XC6VHX380T-2FF1923E
- Design Services: Professional implementation and optimization services
- Testing Solutions: Specialized test equipment and methodologies
Environmental & Export Classifications
The XC6VHX380T-2FF1923E meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS Compliant: Lead-free manufacturing process meeting European Union directives
- REACH Compliant: Substance registration requirements satisfied
- Halogen-Free: Environmentally responsible material composition
- MSL Rating: Moisture Sensitivity Level classification for proper handling
Operating Conditions:
- Temperature Range: -40ยฐC to +100ยฐC junction temperature
- Humidity: Standard industrial humidity tolerance
- Shock and Vibration: MIL-STD specifications compliance
- Altitude: Standard atmospheric pressure operation
Export Classifications:
- ECCN: Export Control Classification Number designation
- Country of Origin: Manufacturing location documentation
- HTS Code: Harmonized Tariff Schedule classification
- Export Licensing: Applicable restrictions and requirements
Quality Standards:
- ISO 9001: Quality management system certification
- Automotive Grade: AEC-Q100 qualification available for automotive variants
- Industrial Grade: Extended temperature and reliability specifications
- Medical Grade: IEC 60601 compliance for medical applications
The XC6VHX380T-2FF1923E undergoes rigorous testing and qualification processes to ensure reliable operation in demanding industrial, aerospace, and communications applications while maintaining full compliance with international environmental and export regulations.
