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XC6VHX380T-1FFG1923C FPGA: High-Performance Virtex-6 HXT Series Programmable Logic Device

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Core Architecture

  • Device Family: Virtex-6 HXT Series
  • Logic Cells: 380,000 system gates
  • Speed Grade: -1 (fastest speed grade available)
  • Package Type: FFG1923 (Fine-Pitch Ball Grid Array)
  • Pin Count: 1,923 pins
  • Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)

Memory and DSP Resources

  • Block RAM: Up to 1,064 blocks (18Kb each)
  • Total Memory: 19.1 Mb of fast block RAM
  • DSP48E1 Slices: 864 dedicated DSP slices
  • Maximum User I/O: 720 pins
  • Differential I/O Pairs: 360 pairs

Performance Characteristics

  • System Clock Speed: Up to 600 MHz
  • High-Speed Serial Connectivity: Up to 24 GTX transceivers
  • Data Rates: Up to 6.6 Gbps per transceiver
  • Power Consumption: Optimized for high-performance applications
  • Configuration Memory: External configuration required

Advanced Features

  • PCI Express: Integrated endpoint and root port support
  • Memory Controllers: Built-in DDR3 SDRAM controller
  • Clock Management: Advanced clock management tiles (CMTs)
  • Partial Reconfiguration: Dynamic partial reconfiguration capability

2. Price

The XC6VHX380T-1FFG1923C typically ranges from $8,000 to $15,000 USD depending on quantity, supplier, and market conditions. Pricing varies based on:

  • Order Quantity: Volume discounts available for large orders
  • Lead Time: Standard vs. expedited delivery options
  • Distributor: Authorized Xilinx distributors vs. independent suppliers
  • Market Availability: Supply chain conditions affect pricing

Contact authorized distributors for current pricing and availability. Educational and volume pricing options may be available for qualifying customers.

3. Documents & Media

Technical Documentation

  • Product Data Sheet: Comprehensive electrical and mechanical specifications
  • User Guide: Virtex-6 FPGA Configuration User Guide (UG360)
  • PCB Design Guide: Package and pinout information for board layout
  • Power Estimation Tools: XPE (Xilinx Power Estimator) spreadsheets

Development Resources

  • Vivado Design Suite: Latest Xilinx development environment
  • ISE Design Suite: Legacy development tools (14.7 final version)
  • Reference Designs: Example projects and application notes
  • IP Cores: Licensed intellectual property blocks

Package Information

  • Mechanical Drawings: Detailed package dimensions and specifications
  • Thermal Data: Junction-to-case thermal resistance specifications
  • Assembly Guidelines: BGA mounting and soldering recommendations

4. Related Resources

Development Boards

  • ML605 Evaluation Board: Virtex-6 FPGA development platform
  • Custom Carrier Boards: Third-party development solutions
  • Prototyping Platforms: Various evaluation and development kits

Compatible Devices

  • XC6VHX380T Speed Variants: -2FFG1923C and -3FFG1923C options
  • Memory Solutions: Compatible DDR3, QDR-II+, and RLDRAM-II devices
  • Configuration Devices: Platform Flash, SPI Flash memory options

Software Tools

  • Vivado HLS: High-level synthesis for C/C++ to FPGA
  • SDK: Software development kit for embedded processors
  • ChipScope Pro: On-chip debugging and analysis
  • System Generator: Model-based design for DSP applications

Technical Support

  • Xilinx Forums: Community-driven technical discussions
  • Application Notes: Detailed implementation guides
  • Webinars: Regular technical training sessions
  • Field Application Engineers: Direct technical support

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliant: Lead-free manufacturing process
  • REACH Regulation: European chemical safety compliance
  • Conflict Minerals: Compliant with Section 1502 requirements
  • ISO 14001: Environmental management system certified

Export Control Information

  • ECCN Classification: 3A001.a.7 (US Export Administration Regulations)
  • HTS Code: 8542.33.0001 (Harmonized Tariff Schedule)
  • Country of Origin: Manufactured in various Xilinx facilities
  • Export Restrictions: Subject to US export control regulations

Quality Standards

  • Automotive Grade: AEC-Q100 qualified versions available
  • Military Grade: Extended temperature range options
  • Quality System: ISO 9001 certified manufacturing
  • Reliability Testing: Comprehensive qualification and reliability data

Package Marking

  • Device Marking: XC6VHX380T-1FFG1923C clearly marked
  • Lot Traceability: Full manufacturing traceability
  • Date Code: Manufacturing date and facility information
  • Handling Precautions: ESD sensitive device markings

The XC6VHX380T-1FFG1923C represents the pinnacle of FPGA technology, combining massive logic capacity with high-speed connectivity for the most demanding applications. Its comprehensive feature set and robust design make it ideal for next-generation electronic systems requiring exceptional performance and flexibility.