Product Specifications
Core Architecture
- Device Family: Virtex-6 HXT
- Logic Cells: 380,000 system gates
- Package Type: FF1924 (Fine-pitch Ball Grid Array)
- Speed Grade: -1 (Standard performance)
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
Key Features
The XC6VHX380T-1FF1924I incorporates advanced 40nm CMOS technology, providing exceptional power efficiency and performance density. The device features integrated high-speed transceivers, dedicated DSP slices, and abundant block RAM resources, making it ideal for applications requiring intensive parallel processing and high-bandwidth data movement.
Memory and DSP Resources
- Block RAM: Up to 1,064 KB of distributed memory
- DSP48E1 Slices: 384 dedicated multiply-accumulate units
- Configuration Memory: 128 Mb total configuration data
- I/O Standards: Support for multiple voltage standards including LVDS, SSTL, and HSTL
Connectivity Options
- High-Speed Serial Transceivers: Up to 24 GTX transceivers
- Data Rates: Support for speeds up to 6.6 Gbps per channel
- User I/O: Maximum of 540 user I/O pins
- Clock Management: Advanced clock management tiles with phase-locked loops
Price
The XC6VHX380T-1FF1924I is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities and industrial-grade specifications. Contact authorized Xilinx distributors for current pricing information, volume discounts, and availability. Pricing varies based on order quantity, delivery requirements, and regional market conditions.
For budget planning purposes, enterprise customers should expect pricing consistent with high-end Virtex-6 family devices. Educational and research institutions may qualify for special academic pricing programs.
Documents & Media
Technical Documentation
- Product Data Sheet: Comprehensive electrical and timing specifications
- User Guide: Detailed implementation and configuration instructions
- Package and Pinout Information: Complete pin assignments and mechanical drawings
- Power Consumption Guidelines: Thermal management and power estimation tools
Development Resources
- Vivado Design Suite: Compatible with latest Xilinx development tools
- IP Core Libraries: Access to verified intellectual property blocks
- Reference Designs: Pre-validated application examples and templates
- Simulation Models: SPICE and behavioral models for system-level design
Application Notes
Technical application notes covering clock domain crossing, high-speed serial design, and DSP algorithm implementation are available through the Xilinx support portal.
Related Resources
Development Boards
Several evaluation and development platforms support the XC6VHX380T-1FF1924I, including specialized boards for communications infrastructure and signal processing applications. These platforms provide immediate access to device capabilities and accelerate prototype development.
Design Tools
The XC6VHX380T-1FF1924I integrates seamlessly with Xilinx’s comprehensive design flow, including synthesis, place-and-route, and timing analysis tools. Advanced debugging capabilities through ChipScope Pro enable real-time system verification.
Training and Support
Xilinx offers extensive training programs covering FPGA design methodology, advanced DSP techniques, and high-speed serial design principles. Technical support includes online resources, community forums, and direct engineering assistance.
Compatible IP Cores
Extensive library of verified IP cores optimized for Virtex-6 architecture, including communication protocols, signal processing functions, and interface controllers.
Environmental & Export Classifications
Environmental Compliance
The XC6VHX380T-1FF1924I meets stringent environmental standards including RoHS compliance for lead-free manufacturing. The device is manufactured using environmentally responsible processes and materials.
Operating Conditions
- Ambient Temperature Range: -40ยฐC to +100ยฐC (Industrial grade)
- Humidity: Non-condensing environments up to 95% relative humidity
- Altitude: Operational up to 3,000 meters above sea level
- Shock and Vibration: Meets MIL-STD-883 specifications for mechanical stress
Export Control Information
The XC6VHX380T-1FF1924I is subject to U.S. export administration regulations. Export classification and licensing requirements vary by destination country and end-use application. Consult current export control documentation and legal counsel for international shipments.
Quality and Reliability
Manufactured to automotive and aerospace quality standards with comprehensive testing including burn-in, temperature cycling, and electrical parameter verification. The device carries appropriate quality certifications for mission-critical applications.
Packaging and Handling
The FF1924 package requires appropriate ESD handling procedures and specialized assembly equipment. Moisture sensitivity level (MSL) classification and baking requirements are specified in packaging documentation.
The XC6VHX380T-1FF1924I represents the pinnacle of FPGA technology for applications demanding maximum performance, reliability, and flexibility in a single programmable solution.
