Product Specifications
The XC6VHX255T-2FFG1923I delivers outstanding performance with its comprehensive feature set:
Core Architecture:
- Logic Cells: 255,360 equivalent logic cells
- Configurable Logic Blocks (CLBs): 39,900 CLBs
- Block RAM: 11,664 Kb total block RAM capacity
- DSP48E1 Slices: 768 dedicated DSP slices for high-speed arithmetic operations
Memory and Processing:
- Distributed RAM: 1,663 Kb
- Maximum user I/O pins: 1,200 pins
- Speed Grade: -2 (high-performance grade)
- Package Type: FFG1923 (Fine-Pitch Ball Grid Array)
Connectivity Features:
- High-speed serial transceivers optimized for backplane applications
- Multiple clock management tiles (CMTs)
- Advanced power management capabilities
- Support for various I/O standards
The XC6VHX255T-2FFG1923I operates reliably across industrial temperature ranges and provides exceptional signal integrity for mission-critical applications.
Price
Pricing for the XC6VHX255T-2FFG1923I varies based on quantity, packaging options, and distribution channel. Contact authorized Xilinx distributors for current pricing information, volume discounts, and availability. The XC6VHX255T-2FFG1923I typically falls within the premium FPGA price tier due to its advanced capabilities and high logic density.
Documents & Media
Essential documentation for the XC6VHX255T-2FFG1923I includes:
Technical Documentation:
- Virtex-6 Family Overview datasheet
- XC6VHX255T-2FFG1923I product specification sheet
- Virtex-6 FPGA Configuration User Guide
- Package and pinout documentation for FFG1923
- Power and thermal design guidelines
Development Resources:
- Vivado Design Suite compatibility information
- ISE Design Suite support documentation
- Reference designs and application notes
- PCB layout guidelines and recommendations
Software Tools:
- Xilinx development environment compatibility matrices
- Programming and debugging tool specifications
Related Resources
The XC6VHX255T-2FFG1923I ecosystem includes comprehensive development support:
Development Boards:
- Xilinx evaluation boards featuring the XC6VHX255T-2FFG1923I
- Third-party development platforms and modules
- Custom carrier board reference designs
Software Tools:
- Xilinx Vivado Design Suite
- Legacy ISE Design Suite support
- IP core libraries and reference implementations
- Simulation and verification tools
Technical Support:
- Xilinx community forums and knowledge base
- Application engineering support
- Training materials and workshops
- Migration guides from other FPGA families
Complementary Products:
- Compatible memory solutions and interfaces
- Power management ICs and modules
- High-speed connector and cable assemblies
- Cooling and thermal management solutions
Environmental & Export Classifications
The XC6VHX255T-2FFG1923I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals reporting compliance
- ISO 14001 environmental management standards
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC
- Industrial temperature options available
- Humidity resistance per JEDEC standards
- Shock and vibration tolerance specifications
Export Classifications:
- ECCN (Export Control Classification Number): Check current regulations
- Country of origin marking compliance
- Export licensing requirements vary by destination
- Trade compliance documentation available
Quality Standards:
- Automotive qualification options (contact factory)
- Military and aerospace screening available
- Extended reliability testing and burn-in options
- Comprehensive quality assurance testing
The XC6VHX255T-2FFG1923I represents cutting-edge FPGA technology, combining high performance, extensive connectivity, and robust reliability for the most demanding applications across telecommunications, aerospace, defense, and high-performance computing markets.
