Product Specifications
Core Architecture
The XC6VHX255T-2FFG1155C features a sophisticated 40nm CMOS process technology that ensures optimal power efficiency and performance. This FPGA incorporates 255,360 logic cells and 19,200 CLB slices, providing substantial programmable logic resources for complex digital designs.
Key Technical Specifications
- Logic Cells: 255,360
- CLB Slices: 19,200
- Block RAM: 11.7 Mb total capacity
- DSP48E1 Slices: 768 slices for high-performance signal processing
- GTH Transceivers: 24 channels supporting up to 11.18 Gbps data rates
- Package Type: FFG1155 (Fine-pitch Flip-chip Grid Array)
- Speed Grade: -2 (balanced performance and power)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- I/O Standards: Supports multiple voltage standards including LVDS, LVTTL, and LVCMOS
Memory and Connectivity Features
The XC6VHX255T-2FFG1155C integrates substantial memory resources with 11.7 Mb of block RAM, enabling efficient data buffering and storage for complex algorithms. The 24 GTH transceivers provide exceptional high-speed serial connectivity, making this FPGA particularly suitable for applications requiring multiple high-bandwidth data channels.
Price Information
Pricing for the XC6VHX255T-2FFG1155C varies based on quantity, distribution channel, and current market conditions. For accurate and up-to-date pricing information:
- Volume Pricing: Contact authorized Xilinx distributors for quantity-based pricing tiers
- Sample Availability: Engineering samples available through Xilinx direct sales
- Lead Times: Standard lead times range from 12-16 weeks depending on demand
- Alternative Sources: Available through major electronic component distributors
Note: Pricing is subject to change based on market conditions and availability. Contact your preferred supplier for current quotations.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and AC/DC characteristics
- User Guide: Comprehensive implementation and design guidelines
- Package Information: Detailed pinout diagrams and mechanical drawings
- Migration Guide: Instructions for upgrading from previous Virtex generations
- Power Estimation Tools: Xilinx Power Estimator (XPE) spreadsheets
Design Resources
- Reference Designs: Example implementations demonstrating key features
- IP Core Library: Compatible Xilinx IP cores and third-party solutions
- Development Tools: ISE Design Suite and Vivado compatibility information
- Application Notes: Best practices for high-speed design and signal integrity
Multimedia Resources
- Product Videos: Technical overview and application demonstrations
- Webinar Recordings: Design methodology and optimization techniques
- White Papers: Advanced implementation strategies and case studies
Related Resources
Development Tools and Software
The XC6VHX255T-2FFG1155C is fully supported by Xilinx’s comprehensive development ecosystem:
- ISE Design Suite: Primary development environment for Virtex-6 devices
- ChipScope Pro: Advanced on-chip debugging and analysis
- System Generator: MATLAB/Simulink integration for DSP applications
- EDK (Embedded Development Kit): Embedded processor system development
Evaluation Platforms
- ML605 Evaluation Board: Compatible development platform featuring the Virtex-6 HXT family
- Custom Development Boards: Third-party solutions optimized for specific applications
- Prototyping Kits: Rapid prototyping solutions for proof-of-concept development
Compatible IP Cores
- Memory Controllers: DDR3, DDR2, and QDR II+ memory interfaces
- Communication Protocols: PCIe, Ethernet, SRIO, and custom high-speed protocols
- Signal Processing: FIR filters, FFT cores, and digital up/down converters
- Video Processing: Video codecs and image processing acceleration
Environmental & Export Classifications
Environmental Compliance
The XC6VHX255T-2FFG1155C meets stringent environmental standards:
- RoHS Compliance: Fully compliant with RoHS directive 2011/65/EU
- REACH Regulation: Compliant with European chemical safety requirements
- Halogen-Free: Lead-free and halogen-free package construction
- Conflict Minerals: Compliant with conflict minerals reporting requirements
Operating Conditions
- Junction Temperature Range: -40ยฐC to +100ยฐC (extended range available)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: Non-condensing environments recommended
- Altitude: Operational up to 2000 meters above sea level
Export and Trade Classifications
- ECCN Classification: Check current U.S. Export Administration Regulations
- Country of Origin: Manufactured in Xilinx-qualified facilities
- Trade Compliance: Subject to applicable export control regulations
- Distribution Restrictions: Available through authorized channel partners
Quality and Reliability Standards
- Quality Grade: Industrial standard with comprehensive testing
- MTBF Rating: High reliability with extensive qualification testing
- Package Reliability: Meets JEDEC standards for BGA packages
- Electrostatic Discharge: Class 1C ESD protection (>1000V HBM)
The XC6VHX255T-2FFG1155C represents a premium solution for applications demanding high-performance FPGA capabilities with robust serial connectivity. Its comprehensive feature set, extensive documentation, and strong ecosystem support make it an excellent choice for advanced digital system implementations.
For additional technical support and design assistance, consult Xilinx documentation or contact authorized technical support channels.
