Product Specifications
The XC6VHX255T-1FFG1155I features comprehensive specifications designed for professional applications:
Core Architecture:
- Logic Cells: 255,360 system gates
- Configurable Logic Blocks (CLBs): 39,600 slices
- Block RAM: 11,664 Kb total memory
- DSP48E1 Slices: 768 dedicated DSP blocks
- Speed Grade: -1 (standard performance)
Package Details:
- Package Type: FFG1155 (Fine-Pitch Ball Grid Array)
- Pin Count: 1155 pins
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
- Package Size: 35mm x 35mm
I/O Capabilities:
- User I/O Pins: 600 maximum
- High-speed serial transceivers: 24 GTX transceivers
- Data rates up to 6.6 Gbps per transceiver
- Multiple I/O standards support including LVDS, SSTL, HSTL
The XC6VHX255T-1FFG1155I delivers exceptional performance with its advanced 40nm process technology and optimized architecture for bandwidth-intensive applications.
Price
Pricing for the XC6VHX255T-1FFG1155I varies based on quantity, distributor, and current market conditions. Contact authorized Xilinx distributors for current pricing information. Volume pricing discounts are typically available for quantities over 100 units. The XC6VHX255T-1FFG1155I represents significant value considering its advanced feature set and proven reliability in mission-critical applications.
Documents & Media
Essential documentation for the XC6VHX255T-1FFG1155I includes:
Technical Documentation:
- Product Brief and Datasheet (DS150)
- Pin-out and Package Information
- DC and AC Switching Characteristics
- Configuration User Guide (UG360)
- SelectIO Resources User Guide (UG361)
Development Resources:
- ISE Design Suite compatibility information
- Reference designs and application notes
- Power estimation spreadsheets
- PCB design guidelines for FFG1155 package
Software Support:
- Xilinx ISE Design Suite support
- Vivado Design Suite migration path
- IP core compatibility matrix
- Timing analysis and constraint files
Access these resources through the official Xilinx documentation portal to ensure you have the latest revisions for your XC6VHX255T-1FFG1155I implementation.
Related Resources
The XC6VHX255T-1FFG1155I ecosystem includes comprehensive development resources:
Development Platforms:
- ML605 Evaluation Board (compatible reference)
- Custom carrier boards and modules
- Third-party development platforms
IP Cores and Libraries:
- Xilinx LogiCORE IP portfolio
- DSP and connectivity IP blocks
- Memory controllers and interfaces
- High-speed serial protocol cores
Design Tools:
- ISE Design Suite (14.7 recommended)
- ChipScope Pro for debugging
- System Generator for DSP
- EDK for embedded processing
Community Resources:
- Xilinx Support Community forums
- Application notes and white papers
- Video tutorials and webinars
- Third-party design services directory
These resources accelerate development with the XC6VHX255T-1FFG1155I and ensure successful project implementation.
Environmental & Export Classifications
The XC6VHX255T-1FFG1155I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free)
- REACH regulation compliant
- Conflict minerals compliant
- Industrial temperature range operation (-40ยฐC to +100ยฐC)
- Moisture sensitivity level: MSL 3
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Various (check specific lot)
- Export license requirements may apply for certain destinations
Quality Standards:
- ISO 9001:2015 manufacturing
- Automotive qualified versions available (contact factory)
- Space-grade screening available for critical applications
- Extended temperature and radiation-hardened variants in development
Packaging and Handling:
- Anti-static packaging required
- Dry pack storage recommended
- Baking requirements per J-STD-033
- Lead-free soldering process compatible
The XC6VHX255T-1FFG1155I maintains Xilinx’s commitment to environmental responsibility while delivering uncompromising performance for your most demanding applications. Contact your local Xilinx representative for specific compliance documentation and certifications relevant to your application requirements.
