Product Specifications
Core Architecture
The XC6VHX250T-2FFG1154C delivers robust performance with its advanced 40nm CMOS technology node. This FPGA features 241,152 logic cells and 37,680 slices, providing extensive computational resources for complex digital signal processing and system implementation.
Memory Configuration
This device incorporates 38.5 Mb of block RAM and 19.1 Mb of distributed RAM, offering flexible memory architecture for data-intensive applications. The integrated memory blocks support various configurations to optimize performance for specific use cases.
DSP Capabilities
With 768 DSP48E1 slices, the XC6VHX250T-2FFG1154C excels in mathematical computations and signal processing tasks. These dedicated DSP blocks enable efficient implementation of filters, transforms, and arithmetic operations.
I/O Features
The device provides 600 user I/O pins in the FFG1154 package, supporting various interface standards including DDR3, PCIe, and high-speed serial protocols. The -2 speed grade ensures reliable operation at elevated frequencies.
Package Details
- Package Type: FFG1154 (Fine-Pitch Ball Grid Array)
- Pin Count: 1154 pins
- Package Size: 35mm ร 35mm
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
Pricing Information
The XC6VHX250T-2FFG1154C pricing varies based on order quantity and distribution channel. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities exceeding 100 units.
Pricing Factors:
- Order quantity tiers
- Delivery timeline requirements
- Geographic region
- Distribution partner agreements
Documents & Media
Documentation Suite
Access comprehensive technical resources for the XC6VHX250T-2FFG1154C including detailed datasheets, user guides, and application notes. Key documentation includes:
Primary Documentation:
- Virtex-6 FPGA Data Sheet (DS150)
- Virtex-6 FPGA User Guide (UG364)
- Virtex-6 FPGA PCB Design Guide (UG393)
- Package and Pinout Specifications
Design Resources:
- Reference designs and example projects
- Constraint files and UCF templates
- Power estimation spreadsheets
- Thermal management guidelines
Development Tools
The XC6VHX250T-2FFG1154C is fully supported by Xilinx ISE Design Suite and Vivado Design Suite, providing comprehensive design entry, synthesis, implementation, and debugging capabilities.
Related Resources
Compatible Products
Explore complementary Xilinx products that enhance XC6VHX250T-2FFG1154C implementations:
Development Platforms:
- ML605 Evaluation Platform
- Custom carrier boards and modules
- Third-party development kits
Software Tools:
- Xilinx ISE Design Suite
- ChipScope Pro Analyzer
- System Generator for DSP
- Embedded Development Kit (EDK)
Application Areas
The XC6VHX250T-2FFG1154C serves diverse market segments including aerospace, defense, telecommunications, medical imaging, and high-performance computing applications.
Target Applications:
- Software-defined radio systems
- Video processing and broadcast equipment
- Network infrastructure devices
- Medical imaging systems
- Aerospace and defense electronics
Technical Support
Access Xilinx technical support resources including community forums, knowledge base articles, and direct engineering support for XC6VHX250T-2FFG1154C implementation challenges.
Environmental & Export Classifications
Environmental Compliance
The XC6VHX250T-2FFG1154C meets stringent environmental standards and regulations:
RoHS Compliance: Fully compliant with RoHS directive, containing no restricted substances above threshold levels.
REACH Regulation: Complies with European REACH regulation for chemical substances.
Conflict Minerals: Xilinx maintains conflict-free mineral sourcing policies in accordance with Dodd-Frank Act requirements.
Export Control Information
The XC6VHX250T-2FFG1154C is subject to export control regulations:
ECCN Classification: Export Control Classification Number applies to international shipments.
Country Restrictions: Certain geographic regions may have specific export limitations.
End-Use Applications: Military and aerospace applications may require additional export documentation.
Operating Environment
- Operating Temperature Range: 0ยฐC to +85ยฐC (commercial grade)
- Storage Temperature Range: -65ยฐC to +150ยฐC
- Humidity Requirements: 10% to 90% non-condensing
- Altitude Rating: Up to 2000 meters above sea level
The XC6VHX250T-2FFG1154C represents cutting-edge FPGA technology, combining high-performance processing capabilities with comprehensive development ecosystem support, making it an ideal choice for next-generation electronic system implementations requiring exceptional computational density and flexibility.
