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XC6SLX9-L1CSG225I Field Programmable Gate Array (FPGA)

Original price was: $20.00.Current price is: $19.00.

The XC6SLX9-L1CSG225I is a high-performance, low-power Field Programmable Gate Array (FPGA) from AMD’s Spartan-6 LX family. This device delivers exceptional value for cost-sensitive applications while providing the flexibility and functionality needed for modern digital design requirements.

Product Specifications

The XC6SLX9-L1CSG225I combines proven FPGA architecture with advanced manufacturing technology to deliver optimal performance:

Core Architecture:

  • Logic Cells: 9,152 logic cells for complex digital designs
  • Logic Blocks (CLBs): 715 configurable logic blocks
  • Process Technology: 45nm low-power copper process technology
  • Package Type: 225-pin CSBGA (Chip Scale Ball Grid Array)
  • I/O Pins: 160 user I/O pins
  • Supply Voltage: Low-power 1.0V core voltage operation

Memory & DSP Features:

  • Block RAM: 72 KB total (36 x 18Kb dual-port block RAMs)
  • DSP Slices: Second-generation DSP48A1 slices for efficient signal processing
  • Memory Controllers: Integrated SDRAM memory controllers

Connectivity & Interfaces:

  • Low-cost PCI technology support (33 MHz, 32-bit and 64-bit compatible)
  • High-speed interface support including Serial ATA, Aurora, 1G Ethernet
  • PCI Express compatible endpoint blocks
  • OBSAI, CPRI, EPON, GPON, DisplayPort, and XAUI interface support
  • SelectIO technology for flexible I/O standards

Advanced Features:

  • Dual-register 6-input lookup table (LUT) logic architecture
  • Enhanced mixed-mode clock management blocks
  • Power-optimized high-speed serial transceiver blocks
  • Advanced system-level power management modes
  • Auto-detect configuration options
  • Enhanced IP security with AES and Device DNA protection

Price Information

The XC6SLX9-L1CSG225I offers competitive pricing for volume applications. Typical pricing ranges from approximately $24-27 USD per unit depending on order quantities, with volume discounts available for larger orders. For current pricing and availability, contact authorized distributors including:

  • Avnet Asia Pacific
  • FPGAkey
  • Micro-Semiconductor
  • IC-Components
  • Various electronic component distributors worldwide

Pricing varies by distributor, order quantity, and current market conditions. Contact distributors directly for quote requests and volume pricing.

Documents & Media

Technical Documentation:

  • Official Spartan-6 FPGA Datasheet (DS162)
  • Product Brief and Selection Guide
  • Configuration User Guide
  • PCB Design Guidelines
  • Package and Pinout Information

Software & Tools:

  • Xilinx ISE Design Suite compatibility
  • Vivado Design Suite support for newer design flows
  • IP Core libraries and reference designs
  • Application notes and design examples

Development Resources:

  • Reference designs for common applications
  • Getting started tutorials
  • Design optimization guides
  • Power analysis and management documentation

All documentation is available through AMD’s official website and authorized distributor portals.

Related Resources

Development Platforms:

  • Compatible development boards and starter kits
  • Evaluation platforms for rapid prototyping
  • Third-party development boards (ZedBoard, Basys 3, Nexys4-DDR)

Software Development:

  • Xilinx ISE Design Suite for FPGA development
  • Vivado Design Suite for advanced design flows
  • IP Core Generator for system-level designs
  • ChipScope Pro for debugging and verification

Technical Support:

  • Online community forums and support
  • Application engineering assistance
  • Training and certification programs
  • Design consulting services

Ecosystem Partners:

  • Third-party IP providers
  • Design service companies
  • Training organizations
  • Hardware vendors

Environmental & Export Classifications

Environmental Compliance:

  • RoHS Compliance: RoHS 10 compliant, meeting European environmental standards
  • Operating Temperature Range: Commercial and industrial temperature grades available
  • Package Materials: Lead-free, environmentally friendly package construction
  • Lifecycle Status: Active product with long-term availability

Export Classifications:

  • ECCN (Export Control Classification Number): EAR99
  • USHTS: 8542390001
  • CNHTS: 8542399000
  • CAHTS: 8542390000
  • TARIC: 8542399000
  • MXHTS: 8542399999

Quality & Reliability:

  • Automotive-qualified variants available for automotive applications
  • Industrial temperature range options
  • Extended lifecycle support for critical applications
  • Comprehensive quality assurance and testing

Manufacturing:

  • Built on mature 45nm copper process technology
  • Advanced packaging technology for thermal and electrical performance
  • High-volume manufacturing capability
  • Global supply chain support

The XC6SLX9-L1CSG225I represents an ideal solution for high-volume logic designs, consumer-oriented DSP applications, and cost-sensitive embedded systems requiring programmable logic functionality with proven reliability and performance.