“Weโ€™ve trusted Rayming with multiple PCB orders, and theyโ€™ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XC6SLX9-2FTG256I: High-Performance Spartan-6 FPGA for Advanced Digital Design

Original price was: $20.00.Current price is: $19.00.

The XC6SLX9-2FTG256I is a versatile field-programmable gate array (FPGA) from Xilinx’s Spartan-6 family, engineered to deliver exceptional performance for cost-sensitive applications. This programmable logic device combines advanced architecture with robust industrial-grade specifications, making it an ideal choice for embedded systems, signal processing, and digital communication applications.

Product Specifications

The XC6SLX9-2FTG256I features a comprehensive set of technical specifications designed for demanding applications:

Core Architecture:

  • Logic Cells: 9,152 configurable logic blocks
  • Block RAM: 576 Kb total memory capacity
  • DSP48A1 Slices: 16 dedicated digital signal processing blocks
  • Maximum User I/O: 186 pins for flexible connectivity
  • Speed Grade: -2 (balanced performance and power consumption)

Package Details:

  • Package Type: FTBGA256 (Fine-pitch Ball Grid Array)
  • Pin Count: 256 balls in 17×17 grid configuration
  • Package Size: 17mm x 17mm footprint
  • Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
  • Supply Voltage: 1.2V core, 1.8V/2.5V/3.3V I/O

Performance Characteristics:

  • Maximum System Clock: Up to 375 MHz
  • Low Power Consumption: Optimized for battery-powered applications
  • Advanced Clock Management: Multiple PLLs and DCMs
  • High-Speed Serial Connectivity: Support for various communication protocols

The XC6SLX9-2FTG256I incorporates Xilinx’s 45nm process technology, ensuring reliable operation while maintaining competitive power efficiency. This FPGA supports multiple I/O standards including LVDS, LVTTL, and LVCMOS, providing excellent interfacing flexibility for diverse system requirements.

Price

Pricing for the XC6SLX9-2FTG256I varies based on quantity, supplier, and market conditions. Typical pricing ranges include:

Volume Pricing Tiers:

  • Single Unit: $25-35 USD (depending on distributor)
  • 100+ Units: $20-28 USD per unit
  • 1000+ Units: $18-25 USD per unit
  • 10,000+ Units: Contact manufacturer for volume pricing

Factors Affecting Price:

  • Current market demand and supply chain conditions
  • Distributor margins and regional variations
  • Lead times and availability status
  • Custom packaging or testing requirements

For the most current XC6SLX9-2FTG256I pricing and availability, consult authorized Xilinx distributors such as Digi-Key, Mouser Electronics, Arrow Electronics, or Avnet. Educational discounts may be available for qualifying institutions and research projects.

Documents & Media

Comprehensive technical documentation supports successful XC6SLX9-2FTG256I implementation:

Essential Documentation:

  • Spartan-6 Family Data Sheet: Complete electrical specifications and timing parameters
  • XC6SLX9-2FTG256I Product Brief: Overview of key features and applications
  • Spartan-6 FPGA User Guide: Detailed architecture description and design guidelines
  • Package and Pinout Information: FTBGA256 mechanical drawings and pin assignments

Design Resources:

  • Vivado Design Suite: Latest FPGA development environment
  • ISE Design Suite: Legacy development tools (for existing projects)
  • IP Core Libraries: Pre-verified intellectual property blocks
  • Reference Designs: Example implementations for common applications

Application Notes:

  • Power Management Guidelines for Spartan-6 FPGAs
  • High-Speed Design Considerations
  • PCB Layout Recommendations for FTBGA Packages
  • Thermal Management Best Practices

Video Resources:

  • Spartan-6 FPGA Training Videos
  • Vivado Design Flow Tutorials
  • Hardware Implementation Demonstrations

All documentation for the XC6SLX9-2FTG256I is available through the official Xilinx support portal, providing designers with comprehensive resources for successful project implementation.

Related Resources

The XC6SLX9-2FTG256I ecosystem includes various supporting products and resources:

Development Boards:

  • Spartan-6 FPGA SP601 Evaluation Kit
  • Nexys 3 Spartan-6 FPGA Board (Digilent)
  • Atlys Spartan-6 FPGA Development Board

Compatible Family Members:

  • XC6SLX4: Smaller logic capacity alternative
  • XC6SLX16: Higher logic density option
  • XC6SLX25: Enhanced performance variant
  • XC6SLX45: Maximum Spartan-6 logic capacity

Design Tools and Software:

  • Xilinx Vivado Design Suite (recommended)
  • Xilinx ISE Design Suite (legacy support)
  • ModelSim for simulation and verification
  • ChipScope Pro for in-system debugging

Third-Party Resources:

  • FPGA development communities and forums
  • University curriculum and training materials
  • Consulting services for complex implementations
  • Custom board design services

Technical Support:

  • Xilinx Technical Support Portal
  • Community forums and knowledge base
  • Regional field application engineers
  • Online training and certification programs

These resources ensure that designers working with the XC6SLX9-2FTG256I have access to comprehensive support throughout the development process.

Environmental & Export Classifications

The XC6SLX9-2FTG256I meets stringent environmental and regulatory standards:

Environmental Compliance:

  • RoHS Compliant: Lead-free manufacturing process
  • REACH Regulation: Compliant with EU chemical safety requirements
  • Conflict Minerals: Responsible sourcing practices implemented
  • ISO 14001: Environmental management system certification

Quality Standards:

  • Automotive Grade: AEC-Q100 qualified versions available
  • Industrial Temperature Range: -40ยฐC to +100ยฐC operation
  • Moisture Sensitivity Level: MSL-3 packaging classification
  • ESD Protection: Human Body Model (HBM) and Charged Device Model (CDM) tested

Export Control Classifications:

  • ECCN (Export Control Classification Number): 3A001.a.7
  • HTS (Harmonized Tariff Schedule): 8542.33.0001
  • Country of Origin: Manufactured in various global facilities
  • Export License Requirements: Varies by destination country

Reliability Specifications:

  • MTBF (Mean Time Between Failures): >1,000,000 hours at 55ยฐC
  • Operating Life: 20+ years under normal conditions
  • Storage Temperature: -65ยฐC to +150ยฐC
  • Humidity Tolerance: Up to 85% relative humidity (non-condensing)

Packaging and Handling:

  • Tape and Reel Packaging: Standard for automated assembly
  • Anti-Static Packaging: ESD protection during shipping and storage
  • Traceability: Full lot tracking and quality documentation
  • Lead-Free Process: Compatible with lead-free soldering profiles

The XC6SLX9-2FTG256I’s comprehensive compliance with international standards ensures reliable operation across diverse applications while meeting global regulatory requirements for commercial and industrial deployment.