The XC6SLX75-L1FG676I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-6 family, designed to deliver exceptional performance for cost-sensitive applications. This advanced FPGA combines high logic capacity with energy-efficient operation, making it an ideal choice for embedded processing, digital signal processing, and communication applications.
Product Specifications
The XC6SLX75-L1FG676I features robust specifications that meet demanding application requirements:
Core Architecture:
- Logic Cells: 74,196 logic cells providing extensive processing capability
- Look-Up Tables (LUTs): 46,648 6-input LUTs for flexible logic implementation
- Flip-Flops: 93,296 flip-flops supporting complex sequential designs
- Block RAM: 4,824 Kb total block RAM (267 blocks of 18 Kb each)
Memory and DSP Features:
- Distributed RAM: 1,150 Kb for high-speed data storage
- DSP48A1 Slices: 132 dedicated DSP slices for efficient arithmetic operations
- Maximum User I/O: 408 user I/O pins for extensive connectivity options
Package and Operating Conditions:
- Package Type: FG676 (Fine-pitch Ball Grid Array)
- Speed Grade: -1L (Low power, commercial grade)
- Operating Temperature: 0ยฐC to +85ยฐC (Commercial range)
- Supply Voltage: 1.2V core, 3.3V I/O (Low voltage operation)
Performance Characteristics:
- Maximum Frequency: Up to 375 MHz internal clock frequency
- Power Consumption: Optimized for low-power applications
- Configuration Memory: External configuration support via SPI, BPI, or JTAG
Pricing Information
The XC6SLX75-L1FG676I is competitively priced for volume applications. Pricing varies based on order quantity, delivery requirements, and current market conditions. For current pricing information and volume discounts, contact authorized Xilinx distributors or sales representatives. Educational and development pricing may be available for qualifying institutions and projects.
Documents & Media
Technical Documentation:
- Datasheet: Complete electrical and timing specifications
- User Guide: Comprehensive implementation guidelines and design recommendations
- Migration Guide: Transition information from previous FPGA families
- Errata: Known issues and workarounds for current silicon revision
Design Resources:
- Reference Designs: Proven implementation examples and templates
- Application Notes: Detailed guidance for specific use cases
- White Papers: Technical insights and best practices
- Video Tutorials: Step-by-step design methodology demonstrations
Software Support:
- ISE Design Suite: Complete development environment compatibility
- IP Core Library: Pre-verified intellectual property blocks
- Simulation Models: Behavioral and timing simulation support
Related Resources
Development Tools:
- Spartan-6 FPGA SP605 Evaluation Kit: Complete development platform
- ISE Design Suite: Professional FPGA development software
- ChipScope Pro: Advanced debugging and analysis tools
- EDK (Embedded Development Kit): Embedded processor design tools
Compatible Products:
- XC6SLX45-L1FG676I: Lower-capacity alternative in same package
- XC6SLX100-L1FG676I: Higher-capacity option for expanded designs
- Configuration Devices: Platform Flash and SPI Flash memory solutions
Technical Support:
- Xilinx Forums: Community-driven technical discussions
- Answer Database: Searchable solution repository
- Technical Support: Professional engineering assistance
- Training Courses: Hands-on FPGA design education
Third-Party Solutions:
- IP Providers: Specialized intellectual property vendors
- Design Services: Professional FPGA development partners
- Board-Level Products: Ready-to-use modules and systems
Environmental & Export Classifications
Environmental Compliance: The XC6SLX75-L1FG676I meets stringent environmental standards and regulations:
- RoHS Compliant: Lead-free package meeting EU environmental directives
- REACH Compliant: Substances of Very High Concern (SVHC) declaration available
- Conflict Minerals: Compliant with conflict minerals reporting requirements
- Green Package: Halogen-free and antimony-free package materials
Quality and Reliability:
- AEC-Q100 Qualified: Automotive-grade reliability testing (where applicable)
- Temperature Cycling: Extensive thermal stress testing
- Moisture Sensitivity Level: MSL-3 rating for safe handling and storage
- Electrostatic Discharge: HBM and CDM ESD protection standards
Export Classification:
- ECCN (Export Control Classification Number): 3A001.a.7 (subject to change)
- HTS (Harmonized Tariff Schedule): 8542.39.0001
- Country of Origin: Manufactured in qualified facilities worldwide
- Export Restrictions: Subject to U.S. Export Administration Regulations
Packaging and Handling:
- Moisture Barrier Bag: Protective packaging for sensitive components
- Dry Pack Requirements: Specific humidity control during shipping
- Shelf Life: Defined storage conditions and time limits
- Handling Precautions: ESD-sensitive device requiring proper handling procedures
The XC6SLX75-L1FG676I represents an excellent balance of performance, power efficiency, and cost-effectiveness for modern FPGA applications. Its comprehensive feature set and robust support ecosystem make it suitable for applications ranging from industrial automation to telecommunications infrastructure.
