The XC6SLX45-N3FGG676C is a high-performance, low-power Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) renowned Spartan-6 LX family. Built on mature 45nm process technology, this versatile FPGA delivers an optimal balance of cost, power efficiency, and performance for a wide range of applications in telecommunications, automotive, consumer electronics, and industrial automation.
1. Product Specifications
Core Features
- FPGA Family: Spartanยฎ-6 LX Series
- Logic Cells: 43,661 logic cells
- Configuration Logic Blocks (CLBs): 3,411 CLBs
- Process Technology: 45nm low-power copper process
- Operating Voltage: 1.14V – 1.26V (core supply)
- Speed Grade: -N3 (Industrial temperature range)
Package and I/O
- Package Type: 676-pin Fine-pitch Ball Grid Array (FBGA)
- Package Code: FGG676
- User I/O Pins: 358 configurable I/O pins
- Total Pins: 676 pins total
- Package Dimensions: 27mm x 27mm with 1mm pitch
- Mounting Type: Surface Mount
Memory and DSP Resources
- Block RAM: 2,138,112 total RAM bits
- 18Kb Block RAMs: 116 blocks (configurable as 2 x 9Kb)
- DSP Slices: 58 DSP48A1 slices for high-performance arithmetic
- Maximum Operating Frequency: Up to 390MHz
Temperature and Environmental
- Operating Temperature Range: 0ยฐC to 85ยฐC (Industrial grade)
- Junction Temperature: TJ specification compliant
- Speed Grade: -N3 optimized for industrial applications
- RoHS Compliance: RoHS3 compliant for environmental standards
Advanced Features
- Dual-register 6-input Lookup Tables (LUTs): Enhanced logic efficiency
- Enhanced Mixed-Mode Clock Management: DCM and PLL blocks
- SelectIOโข Technology: Over 40 I/O standards support
- Built-in Configuration Security: AES encryption and Device DNA protection
- Memory Controllers: Integrated SDRAM memory controllers
- High-Speed Serial Interfaces: Support for PCIe, Ethernet, and other protocols
2. Pricing Information
The XC6SLX45-N3FGG676C pricing varies based on quantity and distributor:
Market Pricing Overview
- Single Unit Price: Typically ranges from $98-$150 USD
- Bulk Pricing: Volume discounts available for quantities of 100+ units
- Lead Time: 52 weeks manufacturer lead time (as of 2024)
- Availability: Active product status with global distributor network
Authorized Distributors
- AMD/Xilinx authorized distributors
- Major electronic component suppliers
- Regional electronics distributors
- Online component marketplaces
Note: Prices are subject to market fluctuations and availability. Contact authorized distributors for current pricing and volume discounts.
3. Documents & Media
Technical Documentation
- Datasheet: Spartan-6 FPGA Data Sheet (DS162) – 89 pages, comprehensive specifications
- User Guides: Spartan-6 FPGA User Guide collection covering:
- SelectIO Resources User Guide
- Clocking Resources User Guide
- Memory Controller User Guide
- Configuration User Guide
Development Tools
- ISE Design Suite: Free WebPACK edition for development
- Vivado Design Suite: Advanced design environment
- IP Core Libraries: Extensive collection of verified IP cores
- Reference Designs: PCIe, Ethernet, DDR3, and other interface examples
Application Notes
- Migration guides from previous FPGA families
- Power optimization techniques
- High-speed interface implementation
- Signal integrity guidelines
Media Resources
- Product overview videos
- Technical webinars
- Application case studies
- Development board demonstrations
4. Related Resources
Development Platforms
- SP605 Evaluation Kit: Complete development platform (discontinued but reference designs available)
- Third-party Development Boards: EDGE Spartan-6, Basys 3, and other compatible platforms
- FPGA Mezzanine Cards (FMC): Expansion options for specialized interfaces
Software Ecosystem
- MicroBlazeโข Soft Processor: Embedded processor solution
- System Generator: MATLAB/Simulink integration
- ChipScope Pro: Embedded logic analyzer
- EDK (Embedded Development Kit): Complete embedded design flow
Migration and Upgrade Paths
- 7 Series FPGAs: Next-generation migration options
- Zynq UltraScale+ MPSoCs: ARM-based SoC alternatives
- Artix-7 Family: Direct replacement considerations
- Migration Methodology Guides: Detailed transition documentation
Training and Support
- Online Training Courses: Free FPGA design tutorials
- Community Forums: Active developer community support
- Application Engineering: Direct technical support
- University Program: Academic resources and support
Compatible IP and Interfaces
- PCIe Endpoint: PCI Express connectivity
- Ethernet MAC: 1G Ethernet implementation
- DDR2/DDR3 Controllers: High-speed memory interfaces
- Serial Protocols: UART, SPI, I2C implementations
- Video Interfaces: DVI, VGA, and display controllers
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Directive: RoHS3 compliant (2015/863/EU)
- REACH Regulation: Compliant with EU chemical regulations
- Conflict Minerals: Compliant with Dodd-Frank Act requirements
- WEEE Directive: Waste electrical equipment compliance
- Halogen-Free: Available in halogen-free packaging options
Quality and Reliability Standards
- ISO 9001: Manufacturing quality management certification
- ISO 14001: Environmental management system compliance
- JEDEC Standards: Compliant with semiconductor industry standards
- Automotive Grade: XA variants available for automotive applications
- Defense Grade: XQ variants available for military/aerospace applications
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Manufactured in various AMD-approved facilities
- Export Licensing: May require export license for certain countries
- ITAR Compliance: Standard commercial grade, not ITAR restricted
Packaging and Logistics
- Anti-Static Packaging: ESD protection during shipping and storage
- Moisture Sensitivity Level (MSL): MSL-3 rating for humidity control
- Tray Packaging: Standard packaging in conductive trays
- Tape and Reel: Available upon request for automated assembly
- Lead-Free Soldering: Compatible with lead-free assembly processes
Thermal Management
- Junction Temperature: Maximum TJ = 85ยฐC for industrial grade
- Thermal Resistance: ฮธJA values specified in datasheet
- Power Dissipation: Detailed power consumption models available
- Thermal Simulation: Tools and models for thermal analysis
The XC6SLX45-N3FGG676C represents a proven, cost-effective FPGA solution with extensive ecosystem support, making it ideal for mid-range logic designs requiring reliable performance and comprehensive I/O capabilities. Its mature 45nm technology ensures stable supply and well-characterized performance across industrial temperature ranges.
