The XC6SLX25-L1CSG324C is a versatile and cost-effective field-programmable gate array (FPGA) from Xilinx’s proven Spartan-6 family. This low-power device delivers exceptional performance for embedded processing, digital signal processing, and connectivity applications across industrial, automotive, and consumer electronics markets.
Product Specifications
The XC6SLX25-L1CSG324C features robust specifications that make it ideal for demanding applications:
Core Architecture:
- 24,051 logic cells with advanced 6-input look-up tables (LUTs)
- 52 user I/O pins for flexible connectivity options
- 1,355 Kbits of block RAM for efficient data storage
- 38 dedicated DSP48A1 slices for high-speed mathematical operations
Package Details:
- CSG324 package type in compact 17mm x 17mm footprint
- 324-pin CSBGA (Chip Scale Ball Grid Array) configuration
- Industrial temperature range (-40ยฐC to +100ยฐC)
- Speed grade -1L for optimized power consumption
Performance Characteristics:
- Maximum operating frequency up to 375 MHz
- Low static power consumption with advanced power management
- Integrated memory controllers and high-speed serial transceivers
- Support for multiple I/O standards including LVDS, DDR, and LVCMOS
Price Information
The XC6SLX25-L1CSG324C offers competitive pricing for volume applications. Contact authorized Xilinx distributors for current pricing based on quantity requirements. Educational discounts and development kit bundles are available for qualifying institutions and engineers.
Pricing factors include:
- Order quantity and delivery timeline
- Geographic region and local distributor relationships
- Additional services such as programming and testing
- Long-term supply agreements for production volumes
Documents & Media
Technical Documentation:
- XC6SLX25-L1CSG324C datasheet with complete electrical specifications
- Spartan-6 FPGA User Guide for architecture details
- Package and pinout documentation for PCB design
- Thermal and power consumption analysis reports
Design Resources:
- Reference designs and application notes
- Hardware description language (HDL) code examples
- Constraint files and timing analysis templates
- Signal integrity guidelines for high-speed designs
Software Tools:
- Xilinx ISE Design Suite compatibility information
- Programming and configuration utilities
- Simulation models for popular EDA tools
- Debug and verification methodologies
Related Resources
Development Platforms:
- Spartan-6 FPGA SP605 Evaluation Kit for rapid prototyping
- Third-party development boards featuring the XC6SLX25-L1CSG324C
- USB programming cables and JTAG debugging interfaces
- Power supply and clock generation reference designs
Complementary Products:
- Compatible Xilinx configuration memories and boot devices
- Power management ICs optimized for FPGA applications
- High-speed connectors and interface components
- Oscillators and clock distribution networks
Community Support:
- Xilinx developer forums and technical communities
- Third-party IP cores and design services
- Training courses and certification programs
- Regional field application engineer support
Environmental & Export Classifications
The XC6SLX25-L1CSG324C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant lead-free construction
- REACH regulation compliance for European markets
- Conflict minerals reporting for responsible sourcing
- ISO 14001 environmental management system certification
Quality Standards:
- Automotive AEC-Q100 qualification available for automotive variants
- Industrial temperature range testing and validation
- Comprehensive reliability testing including thermal cycling
- Statistical quality control and continuous monitoring
Export Classifications:
- Export Control Classification Number (ECCN) designation
- International Traffic in Arms Regulations (ITAR) status
- Country-specific import/export documentation requirements
- Encryption and security feature compliance information
Packaging and Handling:
- Moisture sensitivity level (MSL) rating for storage requirements
- Anti-static packaging and handling procedures
- Tape and reel packaging options for automated assembly
- Lead-free reflow soldering profiles and recommendations
The XC6SLX25-L1CSG324C represents an excellent balance of performance, power efficiency, and cost-effectiveness for engineers developing next-generation embedded systems. Its comprehensive feature set and extensive ecosystem support make it an ideal choice for applications requiring flexible, high-performance digital processing capabilities.
