The XC6SLX25-3FG484I is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-6 family, designed to deliver exceptional processing capabilities for embedded applications. This XC6SLX25-3FG484I device combines advanced features with cost-effective pricing, making it an ideal choice for developers seeking reliable programmable logic solutions.
Product Specifications
Core Features of XC6SLX25-3FG484I
The XC6SLX25-3FG484I offers robust specifications that meet demanding application requirements:
Logic Capacity:
- 24,051 logic cells
- 3,355 slices
- 52 DSP48A1 slices for signal processing
- 38 block RAM/FIFO (18Kb each)
Memory Configuration:
- Total block RAM: 608 Kb
- Distributed RAM: 67 Kb
- Maximum user I/O: 296 pins
Package Details:
- Package type: FBGA (Fine Ball Grid Array)
- Pin count: 484 pins
- Speed grade: -3 (highest performance)
- Temperature grade: Industrial (-40ยฐC to +100ยฐC)
Power and Performance:
- Advanced 45nm process technology
- Low static power consumption
- High-speed operation capabilities
- Multiple clock management tiles
The XC6SLX25-3FG484I supports various interface standards including DDR3, LPDDR, PCIe, and Ethernet, ensuring seamless integration with modern system architectures.
Price Information
The XC6SLX25-3FG484I pricing varies based on quantity and supplier. For current pricing and availability of the XC6SLX25-3FG484I:
- Contact authorized Xilinx distributors for volume pricing
- Evaluation quantities typically available for development purposes
- Consider lead times for production quantities
- Pricing may fluctuate based on market conditions and semiconductor supply chain factors
Cost Considerations:
- Compare XC6SLX25-3FG484I against similar capacity FPGAs
- Factor in development tool licensing costs
- Consider total system cost including supporting components
Documents & Media
Essential Documentation for XC6SLX25-3FG484I
Datasheets and Technical References:
- XC6SLX25-3FG484I product datasheet with complete electrical characteristics
- Spartan-6 FPGA Configuration User Guide
- Spartan-6 FPGA Clocking Resources User Guide
- XC6SLX25-3FG484I package and pinout documentation
Design Resources:
- ISE Design Suite compatibility information
- Vivado Design Suite migration guidelines
- Reference designs and application notes
- XC6SLX25-3FG484I evaluation board documentation
Software Tools:
- Xilinx ISE WebPACK (free version available)
- Xilinx Platform Studio (XPS) for embedded designs
- ChipScope Pro for debugging and verification
- Third-party tool compatibility lists
Video and Multimedia Resources
Training materials and webinars covering XC6SLX25-3FG484I implementation best practices are available through Xilinx University Program and partner training providers.
Related Resources
Development Ecosystem for XC6SLX25-3FG484I
Evaluation Platforms:
- Spartan-6 FPGA Development Boards featuring XC6SLX25-3FG484I
- Third-party evaluation modules and carrier boards
- Prototyping accessories and expansion modules
IP Cores and Libraries:
- Xilinx LogiCORE IP portfolio compatibility
- Open-source IP cores optimized for Spartan-6 architecture
- Partner IP solutions for common functions
Community and Support:
- Xilinx Community Forums for XC6SLX25-3FG484I discussions
- Application engineering support
- Training courses and certification programs
Alternative Devices:
- XC6SLX16-3FG484I (smaller capacity option)
- XC6SLX45-3FG484I (higher capacity in same package)
- Migration paths to newer Xilinx FPGA families
Technical Application Areas
The XC6SLX25-3FG484I excels in applications requiring moderate logic capacity with high-performance requirements:
- Industrial automation and control systems
- Communications infrastructure equipment
- Test and measurement instrumentation
- Medical device electronics
- Automotive electronics applications
Environmental & Export Classifications
Environmental Compliance
The XC6SLX25-3FG484I meets stringent environmental standards:
Temperature Ratings:
- Industrial temperature range: -40ยฐC to +100ยฐC junction temperature
- Extended temperature variants available for specialized applications
- Thermal management considerations for high-performance applications
Environmental Certifications:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals reporting compliance
- ISO 14001 environmental management system compliance
Export Control Information
Trade Compliance:
- Export Control Classification Number (ECCN) classification
- International Traffic in Arms Regulations (ITAR) status
- Country-specific import/export restrictions may apply
- End-user license requirements for certain applications
Quality and Reliability:
- Automotive grade options available (XC6SLX25-2FG484CES)
- Military/aerospace specifications for harsh environments
- Commercial grade standard for typical applications
- Comprehensive quality assurance and testing programs
Packaging and Handling
The XC6SLX25-3FG484I requires proper handling procedures:
- Moisture sensitivity level classification
- ESD protection requirements during handling
- Storage temperature and humidity specifications
- Recommended soldering profiles for FBGA package
For the most current information about XC6SLX25-3FG484I availability, pricing, and technical specifications, consult official Xilinx documentation and authorized distributors. This XC6SLX25-3FG484I overview provides general information and should be verified against current product documentation for design decisions.
