The XC6SLX150-3FG676I is a powerful FPGA (Field Programmable Gate Array) from Xilinx’s Spartan-6 family, designed to deliver exceptional performance for demanding digital signal processing and embedded applications. This advanced programmable logic device combines high logic density with cost-effective implementation, making it ideal for industrial automation, communications infrastructure, and consumer electronics.
Product Specifications
Core Features
The XC6SLX150-3FG676I offers impressive specifications that set it apart in the FPGA market:
Logic Capacity:
- 147,443 logic cells with advanced 6-input lookup tables
- 4,824 configurable logic blocks (CLBs) for flexible design implementation
- 536 user I/O pins for extensive connectivity options
Memory Architecture:
- 4,824 Kb of block RAM for high-speed data storage
- 576 distributed RAM blocks for localized memory requirements
- Advanced memory controller support for DDR2/DDR3 interfaces
DSP Performance:
- 180 DSP48A1 slices optimized for signal processing applications
- Built-in multipliers and accumulators for efficient arithmetic operations
- Support for advanced filtering and mathematical computations
Package Details:
- FG676 Fine-pitch Ball Grid Array (FBGA) package
- 676-pin configuration with 1.0mm ball pitch
- Industrial temperature grade (-40ยฐC to +100ยฐC)
- Speed grade -3 for high-performance applications
Price Information
Pricing for the XC6SLX150-3FG676I varies based on quantity, distributor, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical characteristics and specifications
- User Guide: Comprehensive implementation and design guidelines
- Application Notes: Specific use case implementations and best practices
- Reference Manual: Detailed architectural information and programming guidance
Design Resources
- Development Kits: Evaluation boards and starter kits for rapid prototyping
- IP Cores: Pre-verified intellectual property for common functions
- Design Examples: Sample projects and reference designs
- Software Tools: Xilinx ISE Design Suite compatibility information
Related Resources
Compatible Products
- XC6SLX100-3FG676I: Lower-density alternative in same package
- XC6SLX150-2FG676I: Same device with different speed grade
- Configuration Memory: Compatible PROM and flash memory devices
Development Tools
- Xilinx ISE Design Suite: Primary development environment
- ChipScope Pro: Integrated logic analyzer for debugging
- EDK (Embedded Development Kit): For embedded processor integration
- System Generator: MATLAB/Simulink integration tools
Support Ecosystem
- Technical Support: Xilinx online forums and direct support channels
- Training Resources: Webinars, tutorials, and certification programs
- Partner Network: Authorized distributors and design service providers
Environmental & Export Classifications
Environmental Compliance
The XC6SLX150-3FG676I meets stringent environmental standards:
- RoHS Compliant: Lead-free and environmentally friendly manufacturing
- REACH Regulation: Compliant with European chemical safety requirements
- Conflict Minerals: Sourced through responsible supply chain practices
Operating Conditions
- Temperature Range: -40ยฐC to +100ยฐC junction temperature
- Supply Voltage: Multiple voltage domains (1.2V core, 2.5V/3.3V I/O)
- Power Consumption: Optimized for low-power applications with advanced power management
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.39.0001
- Country of Origin: Varies by manufacturing location
Quality Standards
- ISO Certification: Manufactured under ISO 9001:2015 quality management
- Automotive Grade: Available in automotive-qualified versions (contact manufacturer)
- Reliability Testing: Extensive qualification testing for mission-critical applications
The XC6SLX150-3FG676I represents an excellent choice for designers requiring high-performance FPGA capabilities in a cost-effective package. Its robust feature set, comprehensive development ecosystem, and proven reliability make it suitable for a wide range of applications from prototype development to high-volume production deployment.
