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XC6SLX100-N3FGG484I – Xilinx Spartan-6 FPGA Complete Guide

Original price was: $20.00.Current price is: $19.00.

The XC6SLX100-N3FGG484I is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-6 family. This advanced programmable logic device delivers exceptional flexibility and performance for demanding applications in telecommunications, industrial automation, automotive, and consumer electronics.

Product Specifications

Core Features of XC6SLX100-N3FGG484I

Logic Resources:

  • Logic Cells: 101,261 cells providing extensive programmable logic capacity
  • Configurable Logic Blocks (CLBs): 15,822 CLBs for complex digital designs
  • Maximum Distributed RAM: 1,038 Kb for efficient data storage
  • Block RAM: 4,824 Kb organized in 268 blocks (18 Kb each)

Memory and DSP Capabilities:

  • DSP48A1 Slices: 180 dedicated multiply-accumulate units
  • Memory Controllers: Integrated memory interface blocks
  • FIFO Support: Hardware FIFO implementations for data buffering

I/O and Connectivity:

  • Maximum User I/Os: 338 configurable input/output pins
  • Package Type: FBGA484 (Fine-pitch Ball Grid Array)
  • Pin Count: 484 pins in compact form factor
  • Differential I/O Pairs: Supports LVDS, mini-LVDS standards

Performance Specifications:

  • Speed Grade: -3 (fastest speed grade available)
  • Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
  • Supply Voltage: Multiple voltage domains (1.2V core, 2.5V/3.3V I/O)
  • Maximum Frequency: Up to 550 MHz internal clock rates

XC6SLX100-N3FGG484I Technical Details

Architecture Benefits:

  • 45nm process technology for low power consumption
  • Advanced clock management with integrated PLLs and DCMs
  • Flexible interconnect architecture for optimal routing
  • Built-in configuration memory eliminates external storage needs

Communication Interfaces:

  • PCIe endpoint support for high-speed data transfer
  • Gigabit Ethernet MAC integration
  • Multiple serial communication protocols
  • JTAG boundary scan for testing and debugging

Price Information

The XC6SLX100-N3FGG484I pricing varies based on quantity, supplier, and market conditions. Typical pricing ranges:

Volume Pricing:

  • Single Unit: $150 – $200 USD
  • 10+ Pieces: $120 – $160 USD
  • 100+ Pieces: $90 – $130 USD
  • 1000+ Pieces: Contact manufacturer for volume discounts

Availability Notes:

  • Lead times typically 8-16 weeks for standard quantities
  • Stock availability varies by authorized distributors
  • Custom packaging and tape-and-reel options available
  • Extended lifecycle support through Xilinx programs

Prices subject to change based on market conditions and availability. Contact authorized distributors for current pricing and stock levels.

Documents & Media

XC6SLX100-N3FGG484I Documentation

Datasheets and Specifications:

  • Spartan-6 Family Overview (DS160)
  • XC6SLX100-N3FGG484I Device-specific datasheet
  • DC and AC switching characteristics
  • Package thermal and mechanical specifications

Design Resources:

  • Pinout and package information (FBGA484)
  • PCB layout guidelines and recommendations
  • Signal integrity design considerations
  • Power supply design requirements

Software and Tools:

  • Xilinx ISE Design Suite compatibility
  • Vivado Design Suite migration guide
  • IP core integration documentation
  • Constraint file templates and examples

Application Notes:

  • High-speed design techniques
  • Clock domain crossing methodologies
  • Memory controller implementation guides
  • Power optimization strategies

Video and Media Resources

Training Materials:

  • Spartan-6 architecture overview videos
  • XC6SLX100-N3FGG484I implementation tutorials
  • Design methodology webinars
  • Troubleshooting and debugging guides

Related Resources

Compatible Development Boards

Evaluation Platforms:

  • Spartan-6 SP605 Evaluation Kit
  • ML605 Virtex-6 FPGA Evaluation Kit (reference design compatibility)
  • Custom carrier boards for XC6SLX100-N3FGG484I
  • Third-party development modules

Design Ecosystem

IP Cores and Libraries:

  • MicroBlaze soft processor integration
  • Ethernet MAC IP cores
  • Memory controller IP (DDR2, DDR3)
  • Video and image processing libraries

Compatible Software:

  • Xilinx ISE Design Suite 14.7 (recommended)
  • Xilinx Platform Studio (XPS)
  • ChipScope Pro Analyzer for debugging
  • Third-party synthesis and simulation tools

XC6SLX100-N3FGG484I Application Examples

Target Applications:

  • Industrial automation and control systems
  • Medical imaging and instrumentation
  • Telecommunications infrastructure equipment
  • Automotive infotainment and ADAS systems
  • High-speed data acquisition systems

Reference Designs:

  • Gigabit Ethernet switch implementations
  • Video processing and display controllers
  • Motor control and power management
  • Wireless communication base stations

Environmental & Export Classifications

Environmental Compliance

RoHS Compliance:

  • The XC6SLX100-N3FGG484I meets RoHS directive requirements
  • Lead-free package construction and materials
  • Compliant with WEEE regulations for electronic waste
  • Halogen-free package options available

Operating Conditions:

  • Commercial Grade: 0ยฐC to +85ยฐC ambient temperature
  • Industrial Grade: -40ยฐC to +100ยฐC ambient temperature
  • Humidity: 5% to 95% non-condensing
  • Altitude: Up to 2000 meters operational

Export and Trade Classifications

Export Control Information:

  • ECCN (Export Control Classification Number): 5A002
  • HTS (Harmonized Tariff Schedule): 8542.31.0001
  • Country of Origin: Varies by manufacturing facility
  • Export License: May be required for certain destinations

Regulatory Certifications:

  • CE marking for European market compliance
  • FCC Part 15 Class B certification available
  • UL recognition for safety standards
  • ISO 9001 manufacturing quality certification

Packaging and Shipping:

  • Moisture sensitivity level (MSL): Level 3
  • Anti-static packaging required for handling
  • Temperature-controlled shipping recommended
  • Tape and reel packaging for automated assembly

Quality and Reliability

Quality Standards:

  • Military temperature range testing (-55ยฐC to +125ยฐC)
  • JEDEC standard compliance for reliability
  • Extensive burn-in testing for critical applications
  • Statistical quality control and monitoring

Lifecycle Information:

  • Product lifecycle status: Active production
  • Recommended for new designs
  • Long-term availability commitment from Xilinx
  • Migration path to newer device families available

Need assistance with XC6SLX100-N3FGG484I integration? Contact our technical support team for design consultation, pricing information, and application-specific guidance. The XC6SLX100-N3FGG484I delivers the performance and flexibility your next-generation designs demand.