Product Specification
The XC5VSX50T-3FF1136C delivers outstanding capabilities through its comprehensive feature set. This FPGA incorporates 8,160 logic cells with 32 dedicated DSP48E slices, providing exceptional digital signal processing performance. The device includes 1,728 Kb of block RAM and supports up to 480 user I/O pins in the FF1136 package configuration.
Built on advanced 65nm technology, the XC5VSX50T-3FF1136C operates at commercial temperature ranges and features a -3 speed grade for high-performance applications. The device supports multiple I/O standards including LVDS, LVTTL, and LVCMOS, ensuring compatibility with various system architectures. With its flip-chip fine-pitch BGA packaging, the XC5VSX50T-3FF1136C offers excellent thermal performance and signal integrity.
The integrated PowerPC processor capability and advanced clock management units make the XC5VSX50T-3FF1136C suitable for complex embedded system designs. The FPGA supports partial reconfiguration, enabling dynamic system updates without complete reprogramming.
Price
Pricing for the XC5VSX50T-3FF1136C varies based on quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing information and volume discounts. The XC5VSX50T-3FF1136C typically commands premium pricing due to its advanced capabilities and specialized DSP features.
Educational institutions and qualified research organizations may be eligible for special academic pricing programs. Long-term supply agreements and consignment inventory options are available for high-volume applications requiring the XC5VSX50T-3FF1136C.
Documents & Media
Comprehensive documentation supports the XC5VSX50T-3FF1136C implementation and design process. The official datasheet provides detailed electrical specifications, timing parameters, and packaging information specific to the XC5VSX50T-3FF1136C variant.
Technical reference manuals cover the Virtex-5 architecture, configuration procedures, and design guidelines applicable to the XC5VSX50T-3FF1136C. Application notes demonstrate best practices for DSP implementation, power optimization, and thermal management when using the XC5VSX50T-3FF1136C.
Design tools documentation includes user guides for ISE Design Suite, which provides complete design flow support for the XC5VSX50T-3FF1136C. IP core documentation covers pre-verified intellectual property blocks optimized for the XC5VSX50T-3FF1136C architecture.
Related Resources
Development boards featuring the XC5VSX50T-3FF1136C enable rapid prototyping and evaluation of design concepts. These boards typically include essential peripherals, memory interfaces, and connectivity options to demonstrate the XC5VSX50T-3FF1136C capabilities.
Software tools supporting the XC5VSX50T-3FF1136C include the ISE Design Suite with synthesis, implementation, and verification capabilities. System Generator for DSP provides MATLAB/Simulink integration for algorithm development targeting the XC5VSX50T-3FF1136C DSP resources.
Third-party IP cores and reference designs accelerate development time when implementing common functions on the XC5VSX50T-3FF1136C. Training courses and webinars provide education on maximizing the XC5VSX50T-3FF1136C performance in specific application domains.
Environmental & Export Classifications
The XC5VSX50T-3FF1136C meets stringent environmental and reliability standards required for commercial and industrial applications. The device operates within commercial temperature ranges (0°C to +85°C) and complies with RoHS environmental regulations.
Export classification for the XC5VSX50T-3FF1136C follows applicable trade regulations and may require export licenses for certain destinations or applications. The device classification considers its processing capabilities and potential dual-use applications in telecommunications and signal processing systems.
Quality certifications for the XC5VSX50T-3FF1136C include ISO standards compliance and automotive-grade qualifications where applicable. The device undergoes comprehensive testing to ensure reliability in demanding operating environments typical of XC5VSX50T-3FF1136C applications.
Packaging materials used in the XC5VSX50T-3FF1136C comply with environmental standards and support lead-free assembly processes. Moisture sensitivity level ratings guide proper handling and storage procedures for the XC5VSX50T-3FF1136C during manufacturing and assembly operations.
