Product Specifications
The XC5VSX50T-2FFG665I delivers robust performance through its sophisticated architecture. This FPGA features 8,160 logic cells and 288 dedicated DSP48E slices, providing substantial computational resources for complex algorithms. With 1,728 Kb of block RAM and support for up to 480 user I/O pins, the XC5VSX50T-2FFG665I offers extensive memory and connectivity options.
Key specifications include a -2 speed grade ensuring reliable operation at high frequencies, while the FFG665 package provides a compact 23mm x 23mm BGA footprint suitable for space-constrained designs. The industrial-grade temperature range (-40ยฐC to +100ยฐC) makes the XC5VSX50T-2FFG665I suitable for harsh operating environments.
The device operates on multiple voltage rails including 1.0V core voltage and 2.5V/3.3V I/O voltages, supporting various interface standards such as DDR2, PCIe, and high-speed serial protocols. Power consumption is optimized through advanced 65nm process technology, balancing performance with energy efficiency.
Pricing Information
Pricing for the XC5VSX50T-2FFG665I varies based on order quantity, distribution channel, and current market conditions. Enterprise customers typically benefit from volume pricing tiers, while prototype quantities are available through authorized distributors. Contact authorized Xilinx distributors for current pricing and availability, as semiconductor pricing fluctuates based on supply chain conditions and demand cycles.
Educational institutions and research organizations may qualify for special academic pricing programs. Long-term supply agreements are recommended for production applications to ensure consistent availability and pricing stability for the XC5VSX50T-2FFG665I.
Documents & Media
Comprehensive technical documentation supports XC5VSX50T-2FFG665I implementation and development. The official datasheet provides detailed electrical characteristics, timing specifications, and package information essential for system design. Application notes demonstrate best practices for power management, signal integrity, and thermal considerations.
Development resources include reference designs, IP cores, and software tools specifically optimized for the XC5VSX50T-2FFG665I architecture. Vivado Design Suite provides complete development environment support, while ISE Design Suite offers legacy compatibility for existing projects.
Training materials, webinars, and technical papers are available through Xilinx’s online resource center, covering topics from basic FPGA concepts to advanced DSP implementation techniques using the XC5VSX50T-2FFG665I platform.
Related Resources
The XC5VSX50T-2FFG665I ecosystem includes development boards, evaluation kits, and third-party IP solutions. Popular development platforms feature the XC5VSX50T-2FFG665I as the central processing element, providing immediate prototyping capabilities with standard interfaces and peripherals.
Compatible IP cores encompass communication protocols, signal processing functions, and interface controllers optimized for the XC5VSX50T-2FFG665I architecture. Partner solutions include high-speed ADCs, DACs, and RF components designed to complement the FPGA’s capabilities in complete system implementations.
Software tools beyond the primary development suite include debugging utilities, performance analysis tools, and third-party synthesis options that enhance XC5VSX50T-2FFG665I development productivity and design optimization.
Environmental & Export Classifications
The XC5VSX50T-2FFG665I meets stringent environmental standards including RoHS compliance for hazardous substance restrictions. The device is manufactured using lead-free processes and packaging materials, supporting global environmental regulations and sustainability initiatives.
Export classification information for the XC5VSX50T-2FFG665I is available through official trade compliance documentation. End-use applications may require export license verification depending on destination country and specific implementation requirements.
Reliability testing includes qualification to JEDEC standards for automotive and industrial applications. The XC5VSX50T-2FFG665I demonstrates proven performance across extended temperature ranges and operational lifetimes, backed by comprehensive quality assurance programs and statistical reliability data.
Quality certifications encompass ISO manufacturing standards and device-level testing protocols ensuring consistent performance across production lots. Traceability systems track each XC5VSX50T-2FFG665I device from wafer fabrication through final packaging and delivery.
