Product Specifications
The XC5VSX35T-3FFG665C delivers impressive performance specifications that set it apart in the FPGA market:
Core Architecture:
- Logic Cells: 35,280 equivalent logic cells
- CLB Slices: 5,540 configurable logic blocks
- Look-Up Tables (LUTs): 22,160 6-input LUTs
- Flip-Flops: 22,160 flip-flops
- Block RAM: 1,728 Kb total block RAM
- DSP48E Slices: 192 dedicated DSP slices
Memory and Processing:
- Distributed RAM: 690 Kb
- Maximum User I/O: 440 pins
- Speed Grade: -3 (high performance)
- Package Type: FFG665 (Fine-Pitch Ball Grid Array)
- Package Size: 27mm x 27mm
Performance Characteristics:
- Operating voltage: 1.0V core, 1.8V/2.5V/3.3V I/O
- Maximum operating frequency: Up to 550 MHz
- Power consumption: Optimized for high-performance applications
- Temperature range: Commercial grade (0ยฐC to +85ยฐC)
The XC5VSX35T-3FFG665C features advanced 65nm process technology, ensuring optimal power efficiency while maintaining exceptional performance levels.
Price
Pricing for the XC5VSX35T-3FFG665C varies based on quantity, distributor, and market conditions. As a professional-grade FPGA component, the XC5VSX35T-3FFG665C is typically positioned in the mid-to-high-end pricing segment for Virtex-5 series devices.
Typical Price Ranges:
- Single unit: $200-400 USD
- Volume pricing (100+ units): Significant discounts available
- Extended temperature variants: Premium pricing applies
For current pricing and availability of the XC5VSX35T-3FFG665C, contact authorized Xilinx distributors or visit official supplier websites. Educational and volume discounts may be available for qualifying organizations.
Documents & Media
Comprehensive documentation and development resources are available for the XC5VSX35T-3FFG665C:
Technical Documentation:
- XC5VSX35T-3FFG665C Datasheet: Complete electrical and timing specifications
- Virtex-5 FPGA User Guide: Detailed architecture and design guidelines
- Configuration User Guide: Programming and configuration procedures
- PCB Design Guidelines: Layout recommendations for optimal performance
Development Tools:
- Vivado Design Suite: Latest development environment
- ISE Design Suite: Legacy tool support
- ChipScope Pro: Integrated logic analyzer
- CORE Generator: IP core library access
Application Notes:
- High-speed design techniques for XC5VSX35T-3FFG665C
- Power management strategies
- Signal integrity considerations
- Thermal management guidelines
Reference Designs:
- DSP application examples
- Communication system implementations
- Video processing demonstrations
- High-speed interface designs
All documentation for the XC5VSX35T-3FFG665C is available through the official Xilinx website and authorized distribution partners.
Related Resources
The XC5VSX35T-3FFG665C ecosystem includes extensive development resources and compatible components:
Development Boards:
- ML555 Virtex-5 SX Evaluation Kit
- Custom carrier boards from third-party vendors
- Prototyping platforms with XC5VSX35T-3FFG665C support
IP Cores and Libraries:
- DSP IP cores optimized for Virtex-5 SX architecture
- Communication protocol stacks
- Video and image processing libraries
- High-speed interface IP (PCIe, Ethernet, etc.)
Software Support:
- Device drivers for popular operating systems
- Software libraries for common algorithms
- Example projects and tutorials
- Community forums and support resources
Training and Support:
- Xilinx University Program resources
- Online training modules for XC5VSX35T-3FFG665C development
- Technical support through authorized channels
- Design consultation services
Compatible Components:
- Configuration memories (PROM, Flash)
- Clock generation and management devices
- Power management solutions
- High-speed connectors and cables
Environmental & Export Classifications
The XC5VSX35T-3FFG665C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (Lead-free)
- REACH regulation compliant
- Conflict minerals compliant
- ISO 14001 environmental management certified manufacturing
Operating Conditions:
- Junction temperature: -40ยฐC to +125ยฐC
- Storage temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters
Reliability Standards:
- JEDEC standards compliance
- Automotive qualification available (selected variants)
- Military temperature range options
- Extended lifecycle support available
Export Classifications:
- ECCN (Export Control Classification Number): Varies by destination
- HTS (Harmonized Tariff Schedule): 8542.39.0001
- Country of origin: Manufactured in various locations
- Export licensing requirements may apply for certain destinations
Quality Certifications:
- ISO 9001 quality management system
- AS9100 aerospace quality standard
- Six Sigma manufacturing processes
- Comprehensive quality testing and screening
The XC5VSX35T-3FFG665C undergoes rigorous testing and quality assurance procedures to ensure reliable operation in demanding applications. Environmental stress screening and burn-in testing options are available for critical applications requiring enhanced reliability.
The XC5VSX35T-3FFG665C represents the pinnacle of FPGA technology, combining exceptional performance with comprehensive development support. Whether you’re developing next-generation communication systems, advanced signal processing applications, or high-performance computing solutions, the XC5VSX35T-3FFG665C provides the flexibility and performance needed to bring your designs to market successfully.
