Product Specification
The XC5VSX35T-2FF665C delivers outstanding performance through its comprehensive feature set. This FPGA incorporates 35,840 logic cells with advanced 6-input look-up tables (LUTs) and flip-flops, providing substantial processing power for complex algorithms. The device features 192 DSP48E slices optimized for high-speed mathematical operations, enabling efficient implementation of filters, transforms, and other signal processing functions.
Memory resources include 1,728 Kb of block RAM, distributed across 48 36Kb blocks, supporting various memory configurations for data buffering and storage requirements. The XC5VSX35T-2FF665C operates at a speed grade of -2, ensuring reliable performance across industrial temperature ranges.
The device comes in a 665-pin Fine-Pitch Ball Grid Array (FF665) package, measuring 27mm x 27mm with a 1.0mm ball pitch. This compact form factor maximizes board space efficiency while providing extensive I/O connectivity with up to 540 user I/O pins supporting various voltage standards including LVDS, LVTTL, and LVCMOS.
Power consumption is optimized through advanced 65nm process technology, featuring multiple power domains and clock gating capabilities. The XC5VSX35T-2FF665C supports voltages from 0.9V to 3.3V across different power rails, enabling flexible system integration.
Price
Pricing for the XC5VSX35T-2FF665C varies based on quantity, packaging options, and supplier. The device is typically available through authorized Xilinx distributors and electronic component suppliers. Volume pricing discounts are generally available for orders exceeding standard quantity breaks.
For current pricing information and availability, customers should contact authorized distributors or visit official Xilinx partner websites. Educational institutions may qualify for special academic pricing programs.
Documents & Media
Comprehensive technical documentation supports the XC5VSX35T-2FF665C implementation process. The primary datasheet provides detailed electrical specifications, timing parameters, and package information. Pin-out diagrams and PCB layout guidelines ensure proper board design practices.
Xilinx provides extensive design tools including Vivado Design Suite and ISE Design Suite, offering synthesis, implementation, and debugging capabilities. Reference designs and application notes demonstrate best practices for common signal processing implementations.
User guides cover configuration options, power management techniques, and thermal considerations. Simulation models support various EDA tools for accurate system verification before hardware implementation.
Related Resources
The XC5VSX35T-2FF665C ecosystem includes development boards, evaluation kits, and IP cores that accelerate design cycles. Xilinx LogiCORE IP library offers pre-verified signal processing functions including FFTs, FIR filters, and communication protocol implementations.
Third-party tool support extends functionality through specialized development environments and debugging solutions. Training materials and webinars help engineers maximize the XC5VSX35T-2FF665C potential in their applications.
Community forums and technical support channels provide ongoing assistance throughout the development process. Application-specific reference designs showcase implementation techniques for common use cases.
Environmental & Export Classifications
The XC5VSX35T-2FF665C meets stringent environmental and quality standards required for industrial and commercial applications. The device complies with RoHS (Restriction of Hazardous Substances) regulations, ensuring environmentally responsible manufacturing processes.
Operating temperature range extends from 0ยฐC to +85ยฐC for commercial grade devices, with industrial variants supporting -40ยฐC to +100ยฐC operation. Storage temperature specifications range from -65ยฐC to +150ยฐC.
Export classification information is available through official documentation, with specific ECCN (Export Control Classification Number) designations depending on performance characteristics and intended applications. Customers requiring export compliance information should consult current regulatory guidelines and contact appropriate authorities.
Quality certifications include ISO 9001 manufacturing standards and automotive-grade options for safety-critical applications. Reliability testing encompasses temperature cycling, thermal shock, and accelerated aging protocols to ensure long-term operation.
The XC5VSX35T-2FF665C represents a powerful solution for engineers requiring high-performance FPGA capabilities in demanding applications, combining processing power, flexibility, and reliability in a proven platform.
