Product Specifications
The XC5VLX330-1FFG1760I delivers impressive capabilities through its comprehensive feature set:
Logic Resources:
- 330,000 system gates providing extensive logic capacity
- 51,840 logic cells for complex digital designs
- 20,480 configurable logic blocks (CLBs) supporting versatile implementations
- 288 DSP48E slices for high-performance signal processing operations
Memory Architecture:
- 11,664 Kbits of block RAM for efficient data storage
- 648 block RAM/FIFO units supporting various memory configurations
- Distributed RAM capabilities for flexible memory implementation
I/O and Connectivity:
- 1,200 user I/O pins in the FFG1760 package
- Support for multiple I/O standards including LVDS, SSTL, and HSTL
- High-speed serial connectivity options
- Dedicated clock management resources with multiple clock domains
Package and Environmental Specifications:
- FFG1760 Fine-Pitch Ball Grid Array package (42.5mm x 42.5mm)
- Industrial temperature range: -40ยฐC to +100ยฐC
- Speed grade -1 for balanced performance and power consumption
- Lead-free and RoHS compliant construction
Price
The XC5VLX330-1FFG1760I is positioned as a premium FPGA solution, with pricing typically ranging from $2,000 to $4,500 per unit depending on quantity and supplier. Volume pricing is available for production quantities, with significant cost reductions for orders exceeding 100 units. Contact authorized distributors for current pricing and availability, as market conditions and supply chain factors may affect pricing.
Factors influencing XC5VLX330-1FFG1760I pricing include global semiconductor demand, manufacturing capacity, and specific package requirements. Educational and development discounts may be available through Xilinx University Program partnerships.
Documents & Media
Technical Documentation:
- XC5VLX330-1FFG1760I Product Brief and Datasheet
- Virtex-5 FPGA User Guide (UG190)
- Virtex-5 FPGA Configuration User Guide (UG191)
- DC and AC Switching Characteristics documentation
- Package and Pinout specifications
Design Resources:
- Reference designs and application notes
- Power estimation tools and thermal analysis guides
- PCB design guidelines for FFG1760 package
- Signal integrity considerations and layout recommendations
Software Support:
- Xilinx ISE Design Suite compatibility information
- Vivado Design Suite migration guides
- IP core libraries and integration documentation
- Simulation models and timing analysis resources
Related Resources
Development Platforms:ย The XC5VLX330-1FFG1760I integrates seamlessly with various Xilinx development boards and evaluation platforms. Popular development options include the ML505 evaluation platform and custom carrier boards designed specifically for the FFG1760 package.
Compatible IP Cores:ย Extensive IP core library support includes DSP functions, communication protocols, memory controllers, and interface standards. LogiCORE IP products provide pre-verified building blocks to accelerate development timelines.
Design Tools:ย Professional design tools including ISE Design Suite, ChipScope Pro analyzer, and System Generator for DSP provide comprehensive development environments. These tools offer optimization features specifically tailored for Virtex-5 architecture.
Alternative Products:ย Consider the XC5VLX220-1FFG1760I for cost-sensitive applications or the XC5VLX550-1FFG1760I for higher logic density requirements while maintaining the same package footprint.
Environmental & Export Classifications
Environmental Compliance:ย The XC5VLX330-1FFG1760I meets stringent environmental standards including RoHS (Restriction of Hazardous Substances) compliance and REACH regulation requirements. The device is manufactured using lead-free processes and halogen-free materials where applicable.
Operating Conditions:
- Junction temperature range: -40ยฐC to +125ยฐC
- Storage temperature: -65ยฐC to +150ยฐC
- Humidity tolerance: 85% relative humidity non-condensing
- Vibration and shock resistance per MIL-STD specifications
Export Classifications:ย Export control classifications vary by destination country and end-use application. The XC5VLX330-1FFG1760I typically falls under standard commercial export categories, but specific applications may require additional licensing. Consult current Export Administration Regulations (EAR) and International Traffic in Arms Regulations (ITAR) for compliance requirements.
Quality Standards:ย Manufacturing processes comply with ISO 9001 quality management systems, with additional aerospace and automotive qualifications available for specific part variants. Military and extended temperature range versions may be available under separate part numbers.
The XC5VLX330-1FFG1760I represents a mature, reliable FPGA solution for applications requiring high performance, extensive I/O capabilities, and industrial-grade reliability. Its proven architecture and comprehensive tool support make it an excellent choice for both prototype development and volume production deployment.
