Product Specification
The XC5VLX155T-3FFG1136C is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex-5 LXT family, engineered to deliver exceptional performance for demanding digital signal processing and high-speed communication applications. This advanced FPGA combines substantial logic capacity with integrated high-speed transceivers, making it an ideal solution for complex system designs.
Key Technical Specifications:
Logic Resources:
- Logic Cells: 155,136 equivalent gates
- Configurable Logic Blocks (CLBs): 9,600
- Slices: 24,320 (4 LUTs per slice)
- Block RAM: 10,368 Kb total
- DSP48E Slices: 320 for high-performance arithmetic operations
Memory Architecture:
- Distributed RAM: 758 Kb
- Block RAM Blocks: 324 (36 Kb each)
- FIFO support with built-in flow control
I/O Capabilities:
- Maximum User I/O: 680 pins
- High-speed differential signaling support
- Multiple I/O standards compatibility including LVDS, LVPECL, and HSTL
High-Speed Transceivers:
- 12 RocketIO GTP transceivers
- Data rates up to 3.75 Gbps per channel
- Supports multiple protocols including PCI Express, SATA, and custom protocols
Package Information:
- Package Type: FFG1136 (Fine-Pitch Ball Grid Array)
- Pin Count: 1,136 pins
- Speed Grade: -3 (highest performance grade)
- Temperature Grade: C (Commercial: 0ยฐC to +85ยฐC)
Price
The XC5VLX155T-3FFG1136C is positioned as a premium FPGA solution, with pricing typically reflecting its advanced capabilities and high-performance specifications. Due to market fluctuations and volume requirements, current pricing information should be obtained through authorized Xilinx distributors or direct from AMD (Xilinx’s parent company).
Pricing factors include:
- Order quantity (volume discounts available)
- Lead time requirements
- Regional market conditions
- Additional support services
For accurate pricing and availability, contact authorized distributors or visit the official AMD-Xilinx website for current quotations.
Documents & Media
Technical Documentation:
- Datasheet: Complete electrical specifications, timing parameters, and package information
- User Guide: Comprehensive implementation guidelines and design recommendations
- Package Report: Detailed pinout information and mechanical specifications
- Errata: Known issues and recommended workarounds
Design Resources:
- Reference Designs: Pre-verified implementations for common applications
- Application Notes: Best practices for power management, signal integrity, and thermal considerations
- IP Core Library: Optimized intellectual property blocks for accelerated development
Software Tools:
- Vivado Design Suite: Complete development environment for synthesis, implementation, and debugging
- ISE Design Suite: Legacy tool support for existing projects
- ChipScope Pro: Integrated logic analyzer for real-time debugging
Related Resources
Development Platforms:
- ML555 Development Board: Complete evaluation platform featuring the XC5VLX155T-3FFG1136C
- Custom carrier boards: Third-party solutions for specific application requirements
Complementary Products:
- XC5VLX110T: Lower-density option within the same family
- XC5VLX220T: Higher-density alternative for expanded applications
- Configuration devices: Platform Flash and System Flash options
Software Ecosystem:
- Embedded Development Kit (EDK): For processor-based system design
- System Generator: MATLAB/Simulink integration for DSP applications
- PlanAhead: Floorplanning and design analysis tool
Training and Support:
- Technical webinars and workshops
- Online training modules
- Community forums and knowledge base
- Professional consulting services
Environmental & Export Classifications
Environmental Compliance:
The XC5VLX155T-3FFG1136C meets stringent environmental standards and regulations:
- RoHS Compliant: Lead-free construction meeting European Union restrictions
- REACH Compliant: Complies with EU chemical safety regulations
- Conflict Minerals: Sourced in accordance with Dodd-Frank Act requirements
- Green Product: Environmentally conscious design and manufacturing
Operating Conditions:
- Commercial Temperature Range: 0ยฐC to +85ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- Altitude: Up to 2,000 meters above sea level
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7 (subject to U.S. export regulations)
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Manufactured in controlled facilities with global supply chain
Reliability Standards:
- JEDEC Standards: Compliant with industry reliability testing standards
- Qualification: Automotive-grade options available for extended temperature ranges
- MTBF (Mean Time Between Failures): Exceeds 1 million hours under normal operating conditions
Quality Certifications:
- ISO 9001:2015 manufacturing quality management
- ISO 14001:2015 environmental management system
- IATF 16949 automotive quality standard (for automotive-grade versions)
The XC5VLX155T-3FFG1136C represents the pinnacle of FPGA technology, combining substantial logic resources with high-speed connectivity to enable next-generation electronic systems across telecommunications, aerospace, defense, and industrial automation markets.
