Product Specifications
Core Architecture
- Part Number: XC5VLX155T-2FFG1136I
- Logic Cells: 155,520 (6-input LUT based)
- Configurable Logic Blocks (CLBs): 9,720
- Speed Grade: -2 (commercial grade)
- Package Type: FFG1136 (Fine-Pitch Ball Grid Array)
- Total I/O Pins: 680
- Operating Temperature: Commercial (0ยฐC to +85ยฐC)
Memory Resources
- Block RAM: 10,368 Kb total capacity
- Block RAM Blocks: 324 (18Kb each)
- Distributed RAM: 3,888 Kb
- FIFO Support: Hardware-optimized FIFO implementations
DSP Performance
- DSP48E Slices: 320
- Maximum DSP Performance: Up to 550 MHz
- Multiply-Accumulate Operations: High-efficiency 25×18 multipliers
- Filter Implementation: Optimized for FIR/IIR digital filters
High-Speed Connectivity
- RocketIO GTP Transceivers: 18 channels
- Data Rates: 100 Mbps to 3.75 Gbps per channel
- Serial Protocols: PCIe, SATA, Gigabit Ethernet support
- Clock Management: 12 Clock Management Tiles (CMTs)
Power and Packaging
- Core Voltage: 1.0V
- I/O Voltage: 1.2V to 3.3V (multi-standard support)
- Package Dimensions: 35mm x 35mm
- Ball Pitch: 1.0mm
- Pin Count: 1,136 balls
Price Information
The XC5VLX155T-2FFG1136I pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing tiers:
- Unit Price (1-99 pieces): Contact for quote
- Volume Pricing (100+ pieces): Significant discounts available
- Engineering Samples: Available for qualified design projects
- Lead Time: Typically 12-16 weeks for standard orders
Note: Prices subject to change based on market conditions and availability. Contact authorized distributors for real-time pricing.
Documents & Media
Technical Documentation
- Datasheet: XC5VLX155T-2FFG1136I Complete Specifications (PDF)
- User Guide: Virtex-5 FPGA Configuration User Guide
- PCB Design Guide: FFG1136 Package Layout Recommendations
- Thermal Design Guide: Heat Dissipation and Cooling Solutions
Development Resources
- Reference Designs: Example implementations and IP cores
- Application Notes: Best practices for Virtex-5 LXT design
- Software Tools: Vivado Design Suite compatibility information
- Simulation Models: IBIS and SPICE models for signal integrity
Multimedia Resources
- Product Overview Video: Virtex-5 LXT series capabilities
- Webinar Recordings: Design methodologies and case studies
- 3D Package Models: For mechanical design verification
- Pin-out Diagrams: Detailed package pin assignments
Related Resources
Development Boards
- ML555 Development Board: Full-featured evaluation platform
- Custom Carrier Boards: Third-party development solutions
- Connector Modules: High-speed I/O expansion options
Compatible IP Cores
- Ethernet MAC: 10/100/1000 Mbps implementations
- PCIe Endpoint/Root Complex: Generation 1.0/2.0 support
- Memory Controllers: DDR2/DDR3 SDRAM interfaces
- Video Processing: H.264 encoder/decoder IP
Design Tools
- Xilinx Vivado: Primary development environment
- ChipScope Pro: On-chip debugging and analysis
- PlanAhead: Physical design and floor-planning
- ISE Design Suite: Legacy tool support
Training and Support
- Online Training Modules: Virtex-5 design fundamentals
- Technical Support Forums: Community-driven assistance
- Application Engineering: Direct technical consultation
- Regional Support Centers: Worldwide technical support
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free and environmentally friendly
- REACH Regulation: Compliant with EU chemical regulations
- Conflict Minerals: Responsibly sourced materials
- Green Packaging: Recyclable packaging materials
Quality Standards
- ISO 9001: Quality management system certified
- ISO 14001: Environmental management compliance
- IATF 16949: Automotive quality standards (where applicable)
- Military Standards: MIL-STD-883 testing available
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Various (contact for specific lot information)
- Export Restrictions: Standard semiconductor export controls apply
Operating Environment
- Humidity Range: 5% to 95% non-condensing
- Altitude: Up to 2,000 meters operational
- Vibration Resistance: MIL-STD-202 Method 204
- Shock Resistance: MIL-STD-202 Method 213
Reliability Data
- MTBF (Mean Time Between Failures): >1,000,000 hours
- Qualification Standards: JEDEC standards compliant
- Burn-in Testing: Available for critical applications
- Extended Temperature Options: Industrial grade variants available
The XC5VLX155T-2FFG1136I represents the pinnacle of Virtex-5 LXT technology, delivering unmatched performance for next-generation electronic systems. Its combination of high logic density, integrated transceivers, and robust design tools makes it the preferred choice for engineers developing cutting-edge applications in telecommunications, aerospace, defense, and industrial automation.
