Product Specifications
Core Architecture
- Device Family: Xilinx Virtex-5 LX Series
- Part Number: XC5VLX110-1FF1153I
- Logic Cells: 110,592 logic cells
- System Gates: 1,728,000 equivalent gates
- CLB Slices: 17,280 configurable logic block slices
- Speed Grade: -1 (standard performance)
- Package Type: FF1153 (Fine-Pitch Ball Grid Array)
- Total I/O Pins: 800 user I/O pins
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
Memory Resources
- Block RAM: 4,752 Kb total block RAM
- Distributed RAM: 2,160 Kb distributed RAM capacity
- Memory Blocks: 148 dedicated 36Kb block RAM/FIFO blocks
DSP and Processing
- DSP48E Slices: 64 dedicated DSP slices
- Embedded Multipliers: 18×18 multiplier capability
- Clock Management: 6 Clock Management Tiles (CMTs)
- DCM Units: 12 Digital Clock Manager units
- PLL Units: 6 Phase-Locked Loop units
Advanced Features
- SerDes Technology: Integrated high-speed serial transceivers
- Configuration: Multiple configuration options including JTAG
- Power Management: Advanced power optimization features
- ECC Support: Built-in Error Correction Code capabilities
Price
The XC5VLX110-1FF1153I pricing varies based on quantity and supplier. Contact authorized distributors for current pricing information:
- Single Unit Price: Contact for quote
- Volume Pricing: Available for quantities of 100+ units
- Lead Time: Standard 12-16 weeks for production quantities
- Availability: Available through authorized Xilinx distributors
- Alternative Sources: Check with multiple suppliers for competitive pricing
Note: Prices are subject to change based on market conditions and availability. Contact suppliers directly for the most current pricing information.
Documents & Media
Technical Documentation
- Datasheet: XC5VLX110-1FF1153I Complete Specifications (PDF)
- User Guide: Virtex-5 FPGA User Guide for CLB, I/O, and CMT
- PCB Design Guide: Package and PCB Design Guidelines
- Programming Guide: Configuration and Programming Specifications
- Errata Sheet: Known issues and workarounds documentation
Design Resources
- Reference Designs: Pre-verified IP cores and design examples
- Application Notes: Implementation guides for specific use cases
- White Papers: Technical deep-dive documents and best practices
- Video Tutorials: Step-by-step design implementation guides
- Webinar Recordings: Expert-led technical presentations
Software Tools
- Xilinx ISE Design Suite: Complete development environment
- ChipScope Pro: Integrated logic analyzer for debugging
- System Generator: Model-based design for DSP applications
- SDK Documentation: Software development kit resources
Related Resources
Development Boards
- ML505 Evaluation Platform: Full-featured development board
- Custom Carrier Boards: Third-party development solutions
- Prototyping Kits: Rapid development and testing platforms
Compatible Components
- Power Management ICs: Recommended power supply solutions
- Clock Generation: Compatible oscillators and clock sources
- Memory Interfaces: DDR2/DDR3 memory controller IP
- Communication Interfaces: Ethernet, PCIe, and USB IP cores
Design Services
- Professional Services: Xilinx consulting and design services
- Training Programs: FPGA design methodology courses
- Technical Support: Comprehensive customer support resources
- Community Forums: Peer-to-peer technical discussions
Alternative Products
- XC5VLX85-1FF1153I: Lower logic density alternative
- XC5VLX155-1FF1153I: Higher logic density option
- Virtex-6 Series: Next-generation FPGA alternatives
- Kintex Series: Cost-optimized alternatives for specific applications
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with EU chemical regulation requirements
- Pb-Free: Lead-free package and assembly process
- Halogen-Free: Environmentally friendly package materials
- WEEE Compliant: Waste Electrical and Electronic Equipment directive
Operating Conditions
- Operating Temperature Range: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- MSL Rating: Moisture Sensitivity Level 3
- ESD Classification: Class 1 (โฅ1kV HBM)
Export Control Information
- ECCN Classification: 3A001.a.7 (US Export Administration Regulations)
- Export License: May require export license for certain destinations
- Country Restrictions: Subject to US export control regulations
- End-Use Restrictions: Restrictions apply for military and defense applications
- Documentation Required: Proper export documentation needed for international shipments
Quality Standards
- ISO Certification: Manufactured in ISO 9001:2015 certified facilities
- Automotive Grade: Not qualified for automotive applications
- Military Grade: Commercial grade only (not MIL-STD qualified)
- Reliability Testing: Extensive qualification and reliability testing performed
Package Information
- Package Material: BT (Bismaleimide-Triazine) substrate
- Ball Material: SAC305 lead-free solder balls
- Package Dimensions: 35mm x 35mm x 2.29mm nominal
- Ball Pitch: 1.0mm ball pitch
- Coplanarity: ยฑ0.08mm maximum
The XC5VLX110-1FF1153I represents a proven solution for high-performance FPGA applications requiring substantial logic resources and advanced features. Contact authorized distributors for detailed pricing, availability, and technical support to accelerate your next design project.
