1. Product Specifications
Core Features
- Part Number: XC5VFX70T-3FFG1136C
- Manufacturer: Xilinx Inc. (now AMD)
- Family: Virtex-5 FXT (Field-Programmable Gate Array with Transceivers)
- Technology: 65nm CMOS process
- Speed Grade: -3 (highest performance grade)
- Package: 1136-pin Fine-pitch Ball Grid Array (FFG)
Technical Specifications
- Logic Elements/Cells: 71,680
- System Logic Cells: 70,560
- Total RAM Bits: 5,455,872
- Block RAM: 2,880 Kb
- DSP48E Slices: 128
- I/O Count: 640 user I/Os
- Supply Voltage (VCCINT): 1.0V ± 5%
- Supply Voltage (VCCAUX): 2.5V ± 5%
- Operating Temperature Range: 0°C to +85°C (Commercial grade)
Advanced Features
- RocketIO GTP Transceivers: High-speed serial transceivers capable of 100 Mb/s to 3.75 Gb/s
- Integrated PCI Express Endpoint Blocks: Compliant with PCI Express Base Specification 1.1
- Tri-mode Ethernet MACs: 10/100/1000 Mb/s Ethernet support
- DSP48E Slices: Advanced 25×18 multipliers with optional pipelining
- System Monitor: On-chip thermal and power supply monitoring
- SelectIO Technology: Built-in digitally controlled impedance (DCI)
- ChipSync Interface Blocks: Source-synchronous interface support
Power Specifications
- Quiescent Current (ICCOQ): 6 mA typical
- Power-On Current (ICCINTMIN): 695 mA typical
- Power-On Current (ICCAUXMIN): 232 mA typical
- Static Power Consumption: Optimized for high-performance applications
2. Price
The XC5VFX70T-3FFG1136C pricing varies based on quantity, distributor, and market conditions. As this is a high-performance FPGA from the mature Virtex-5 family, pricing is typically competitive for its feature set.
Pricing Considerations:
- Contact authorized distributors for current pricing
- Volume discounts available for large quantities
- Price may vary based on speed grade and package options
- Consider lead times for production planning
Recommended Actions:
- Request quotes from multiple authorized Xilinx/AMD distributors
- Compare pricing with alternative speed grades (-1, -2) if performance requirements allow
- Evaluate total cost of ownership including development tools and support
3. Documents & Media
Official Documentation
- Primary Datasheet: Virtex-5 FPGA Data Sheet: DC and Switching Characteristics (DS202)
- Family Overview: Virtex-5 Family Overview (DS100)
- User Guide: Virtex-5 FPGA User Guide (UG190)
- Configuration Guide: Virtex-5 FPGA Configuration User Guide
- Packaging Guide: Virtex-5 FPGA Packaging and Pinout Specification (UG195)
Design Resources
- Pin Assignment Files: Available in Xilinx Vivado Design Suite
- Reference Designs: Multiple application-specific reference designs
- Application Notes: Power management, PCB layout guidelines, and thermal considerations
- Errata Documents: Device-specific errata and workarounds
Development Tools
- Vivado Design Suite: Complete FPGA design environment (recommended)
- ISE Design Suite: Legacy support for Virtex-5 designs
- SDK: Software Development Kit for embedded processor designs
- ChipScope Pro: Integrated logic analyzer for debugging
4. Related Resources
Compatible Development Boards
- Xilinx ML505 Evaluation Platform
- Third-party Virtex-5 FXT development boards
- Custom carrier boards designed for specific applications
Software Support
- Vivado Design Suite: Full synthesis, implementation, and debugging
- PetaLinux: Linux distribution for embedded applications
- Xilinx Runtime (XRT): For acceleration workloads
- MATLAB/Simulink: HDL code generation and co-simulation
Technical Support
- Xilinx Community Forums: Peer-to-peer technical discussions
- Application Engineering Support: Direct technical assistance
- Training Courses: FPGA design methodology and tool training
- Design Services: Professional design and consulting services
Alternative Part Numbers
- XC5VFX70T-1FFG1136C: Speed grade -1 version (lower performance)
- XC5VFX70T-2FFG1136C: Speed grade -2 version (medium performance)
- XC5VFX70T-3FFG1136I: Industrial temperature grade version
- XC5VFX70T-3FF665C: Smaller 665-pin package option
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Not RoHS Compliant (contains lead in solder bumps)
- Lead-Free Alternative: FFG package versions available for lead-free applications
- Reach Compliance: Compliant with EU REACH regulations
- Conflict Minerals: Xilinx maintains conflict-free mineral sourcing policies
Export Control Classifications
- ECCN (Export Control Classification Number): Subject to US export regulations
- HTS (Harmonized Tariff Schedule): Classified under semiconductor tariff codes
- Country of Origin: Typically manufactured in Asia with final test and assembly
- Export Licensing: May require export licenses for certain destinations
Operating Environment
- Storage Temperature: -65°C to +150°C
- Junction Temperature: +125°C maximum
- Humidity: Non-condensing environments recommended
- Altitude: Standard atmospheric pressure to 2000m elevation
Package Information
- Package Material: Flip-chip BGA with organic substrate
- Lead Frame: Lead-containing solder bumps (standard FFG package)
- Moisture Sensitivity Level (MSL): Level 3 (168 hours at 30°C/60% RH)
- ESD Sensitivity: Class 1A (>1000V Human Body Model)
Quality Standards
- ISO Certification: Manufactured under ISO 9001 quality systems
- Automotive Qualification: Not AEC-Q100 qualified (commercial grade only)
- Reliability Testing: Extensive qualification and reliability testing performed
- Screening Options: Available for high-reliability applications
The XC5VFX70T-3FFG1136C represents a mature, high-performance FPGA solution ideal for telecommunications, aerospace, defense, and high-performance computing applications requiring advanced processing capabilities and high-speed I/O connectivity.
