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XC5215TM-5HQ240C: Xilinx XC5200 Family Extended I/O Field Programmable Gate Array

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Core Technical Specifications

  • Part Number: XC5215TM-5HQ240C
  • Manufacturer: Xilinx Inc.
  • Product Family: XC5200 FPGA Family
  • Device Classification: Field Programmable Gate Array (FPGA)
  • Logic Capacity: 23,000 gates equivalent (maximum XC5200 family capacity)
  • Logic Cells: 1,936 configurable logic cells (CLBs)
  • Maximum Operating Frequency: 83MHz (with -5 speed grade)
  • Process Technology: 0.5μm three-layer metal CMOS
  • Supply Voltage: 5V ±5% (single supply operation)
  • Package Type: 240-Pin HQ (High-density Quad Flat Pack)
  • Temperature Grade: C (Commercial: 0°C to +85°C)
  • Speed Grade: -5 (standard performance variant)

Enhanced I/O and Package Features

  • Pin Count: 240 pins (maximum I/O density in XC5200 family)
  • User I/O Pins: Up to 192 user-configurable I/O pins
  • Package Dimensions: 32mm x 32mm x 3.4mm (nominal)
  • Pin Pitch: 0.5mm (fine pitch for high-density applications)
  • Lead Frame: Copper alloy with gold-plated leads
  • Package Weight: Approximately 2.5 grams
  • Thermal Characteristics: Enhanced heat dissipation capability

Advanced Architecture Features

  • VersaBlock Logic Architecture: Optimized for register/latch-rich designs
  • VersaRing I/O Interface: Industry-leading logic cell to I/O ratio
  • SRAM-Based Configuration: Fast reconfiguration and in-system programming
  • Hierarchical Interconnect: Multi-level routing for complex designs
  • Programmable Slew Rate Control: Optimized signal integrity and EMI reduction
  • Zero Hold Time: Simplified timing analysis for input registers
  • Global Clock Networks: Multiple clock domains and distribution

Performance Characteristics

  • Propagation Delay: 5.6ns (typical logic delay)
  • Setup Time: 3.0ns (typical register setup)
  • Clock-to-Output: 4.5ns (typical register to pad)
  • Maximum Toggle Rate: 167MHz (I/O toggle frequency)
  • Power Consumption: 1.2W (typical active power at 25MHz)
  • Static Power: 150mW (typical standby power)
  • Configuration Time: <100ms (typical bitstream loading)

2. Pricing

Current Market Pricing

Price Category: Premium FPGA – Contact Authorized Distributors

  • Single Unit Price: Request quotation from authorized Xilinx distributors
  • Development Quantity (1-24 units): Premium pricing for prototyping
  • Small Production (25-99 units): Standard commercial pricing
  • Volume Production (100-499 units): Reduced pricing with volume discounts
  • High Volume (500+ units): Maximum discount tiers available
  • Lead Time: 10-20 weeks (dependent on global supply chain)

Pricing Factors and Considerations

  • Package Complexity: HQ240 commands premium over smaller packages
  • Legacy Product Premium: Mature product with stable but higher pricing
  • Limited Availability: Specialized distributors and authorized resellers
  • EOL Considerations: End-of-life product with restricted new production
  • Last-Time-Buy Opportunities: Consider stocking for long-term projects

Cost-Effective Alternatives

  • XC5215-5HQ240C: Standard commercial variant (non-TM designation)
  • XC5215TM-5HQ208C: Reduced pin count alternative
  • XC5215TM-6HQ240C: Higher speed grade option
  • Modern Replacements: Xilinx 7-Series or UltraScale alternatives for new designs

Total Cost of Ownership

  • Development Tools: ISE software licensing and support
  • Board Design: Complex PCB routing for 240-pin package
  • Manufacturing: Advanced assembly processes required
  • Testing: Comprehensive boundary scan and functional testing

Procurement Recommendation: The XC5215TM-5HQ240C is a legacy product suitable primarily for existing design support, replacement parts, and maintenance applications. New projects should evaluate current-generation Xilinx FPGA families for improved performance, power efficiency, and long-term availability.

3. Documents & Media

Primary Technical Documentation

  • Official Datasheet: XC5200 Field Programmable Gate Array Family Specification
  • User Manual: XC5215 Complete Implementation and Programming Guide
  • Package Specification: HQ240 Mechanical Drawings and Thermal Data
  • Pin Assignment Reference: Comprehensive pinout diagrams and signal definitions
  • Application Notes: Design optimization and implementation guidelines
  • Errata Documentation: Known issues and workaround solutions

Development Software Suite

  • Primary IDE: Xilinx ISE (Integrated Software Environment)
  • Legacy Tools: Foundation Series and Alliance development packages
  • Design Entry Options:
    • ABEL: Hardware description language synthesis
    • Schematic Capture: Graphical design entry and simulation
    • VHDL: IEEE-standard hardware description language
    • Verilog HDL: Industry-standard HDL synthesis and simulation
  • Programming Tools: iMPACT configuration and boundary scan testing
  • Simulation Support: ModelSim, VCS, and other industry-standard simulators

Package and Thermal Resources

  • HQ240 Package Drawings: Detailed mechanical specifications and dimensions
  • Thermal Analysis: Junction-to-ambient thermal resistance characteristics
  • PCB Design Guidelines: Recommended footprint and routing practices
  • Assembly Instructions: Surface mount assembly and soldering guidelines
  • Thermal Management: Heat sink recommendations and thermal design guidelines

Quality and Reliability Documentation

  • Quality Assurance Manual: Manufacturing and testing procedures
  • Reliability Analysis: MTBF calculations and failure rate data
  • Environmental Testing: Temperature cycling and stress test results
  • Qualification Reports: Industry standard compliance testing
  • Traceability Documentation: Manufacturing lot tracking and quality records

4. Related Resources

XC5200 Family Product Portfolio

  • XC5202: Entry-level (3,000 gates, 256 cells)
  • XC5204: Small-scale applications (6,000 gates, 484 cells)
  • XC5206: Medium-density option (9,000 gates, 784 cells)
  • XC5210: High-capacity variant (16,000 gates, 1,296 cells)
  • XC5215: Maximum family capacity (23,000 gates, 1,936 cells)

Package Variant Options

  • XC5215TM-5HQ208C: 208-pin reduced I/O alternative
  • XC5215TM-5PQ240C: PQFP package option
  • XC5215TM-5BG352C: Ball Grid Array for advanced applications
  • XC5215TM-6HQ240C: Higher speed grade (-6) variant
  • XC5215TM-4HQ240C: Lower speed grade (-4) cost-optimized option

Development Ecosystem

  • Evaluation Boards: XC5200 family development and demonstration platforms
  • Reference Designs: Pre-verified application examples and IP cores
  • Design Services: Authorized Xilinx design partners and consultants
  • Training Resources: Online tutorials and design methodology courses
  • Community Support: Xilinx forums and user communities

Application-Specific Resources

  • Digital Signal Processing: DSP algorithm implementation guides
  • Communications Applications: Protocol processor reference designs
  • Industrial Control: Real-time control system implementations
  • Instrumentation: Data acquisition and measurement applications
  • Aerospace/Defense: High-reliability design considerations

Migration and Modernization

  • Legacy Design Support: Maintaining and upgrading existing XC5200 systems
  • Modern FPGA Alternatives: 7-Series, UltraScale, and Versal families
  • Design Migration Tools: Automated conversion utilities and guidelines
  • Performance Comparison: Benchmarking legacy vs. modern architectures
  • Cost-Benefit Analysis: Upgrade vs. maintenance decision frameworks

5. Environmental & Export Classifications

Environmental Compliance and Standards

  • RoHS Directive Compliance: Legacy product – verify specific lot compliance
  • REACH Regulation: Compliant with European chemical safety requirements
  • Conflict Minerals: Xilinx responsible sourcing policies and declarations
  • Environmental Operating Range: Commercial grade (0°C to +85°C ambient)
  • Storage Temperature: -65°C to +150°C (non-condensing environment)
  • Relative Humidity: 5% to 95% (non-condensing)

Export Control Classifications

  • ECCN (Export Control Classification Number): 3A001.a.7
  • HTS (Harmonized Tariff Schedule): 8542.31.0001
  • Controlled Technology: Dual-use semiconductor technology
  • Export License Requirements: Subject to U.S. Export Administration Regulations (EAR)
  • Wassenaar Arrangement: Controlled under international dual-use technology agreements
  • Country-Specific Restrictions: Review BIS Commerce Country Chart for destination requirements

Quality and Manufacturing Standards

  • Manufacturing Standard: ISO 9001:2015 certified production facilities
  • Quality Grade: Commercial/Industrial grade (not automotive qualified)
  • Reliability Testing: JEDEC standard qualification procedures
  • Statistical Process Control: Advanced manufacturing process monitoring
  • Traceability: Full lot tracking and quality documentation

Package and Environmental Specifications

  • Moisture Sensitivity Level: MSL 3 per IPC/JEDEC J-STD-020
  • ESD Sensitivity: Class 2 per ANSI/ESDA/JEDEC JS-001
  • Package Material: Plastic molding compound with copper lead frame
  • Lead Finish: Gold plating over nickel barrier (Pb-free available)
  • Package Marking: Laser etched part number, date code, and lot traceability

Shipping and Storage Requirements

  • Anti-Static Packaging: Conductive foam and ESD-protective packaging
  • Dry Pack Requirements: Moisture barrier bags with desiccant
  • Storage Environment: Controlled temperature and humidity conditions
  • Shelf Life: 24 months minimum when stored per specifications
  • Handling Procedures: Standard JEDEC semiconductor handling guidelines

Regulatory Approvals and Certifications

  • FCC Part 15: Electromagnetic compatibility for digital devices
  • CE Marking: European conformity declaration for electronic equipment
  • ICES (Canada): Industry Canada electromagnetic compatibility
  • VCCI (Japan): Voluntary Control Council for Interference compliance
  • KC Mark (Korea): Korean certification for electromagnetic compatibility

End-of-Life and Disposal

  • Product Lifecycle: Mature/legacy product with limited production
  • Recycling Guidelines: Electronic waste disposal per local regulations
  • Material Recovery: Precious metal recovery programs available
  • Environmental Impact: Compliant with global e-waste management standards
  • Documentation Retention: Technical documentation archived for 10+ years

Legacy Product Advisory: The XC5215TM-5HQ240C represents mature technology from Xilinx’s proven XC5200 FPGA family. While suitable for maintaining existing designs and specific applications requiring this exact functionality, new projects should consider current-generation Xilinx FPGA families (7-Series, UltraScale, or Versal) for enhanced performance, lower power consumption, advanced features, and long-term product availability.

Technical Support: Legacy product support is available through Xilinx technical resources, authorized distributors, and the design community. For critical applications, consider establishing long-term supply agreements or last-time-buy procurement strategies.

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