1. Product Specifications
Core Technical Specifications
- Part Number: XC5215TM-5HQ240C
- Manufacturer: Xilinx Inc.
- Product Family: XC5200 FPGA Family
- Device Classification: Field Programmable Gate Array (FPGA)
- Logic Capacity: 23,000 gates equivalent (maximum XC5200 family capacity)
- Logic Cells: 1,936 configurable logic cells (CLBs)
- Maximum Operating Frequency: 83MHz (with -5 speed grade)
- Process Technology: 0.5μm three-layer metal CMOS
- Supply Voltage: 5V ±5% (single supply operation)
- Package Type: 240-Pin HQ (High-density Quad Flat Pack)
- Temperature Grade: C (Commercial: 0°C to +85°C)
- Speed Grade: -5 (standard performance variant)
Enhanced I/O and Package Features
- Pin Count: 240 pins (maximum I/O density in XC5200 family)
- User I/O Pins: Up to 192 user-configurable I/O pins
- Package Dimensions: 32mm x 32mm x 3.4mm (nominal)
- Pin Pitch: 0.5mm (fine pitch for high-density applications)
- Lead Frame: Copper alloy with gold-plated leads
- Package Weight: Approximately 2.5 grams
- Thermal Characteristics: Enhanced heat dissipation capability
Advanced Architecture Features
- VersaBlock Logic Architecture: Optimized for register/latch-rich designs
- VersaRing I/O Interface: Industry-leading logic cell to I/O ratio
- SRAM-Based Configuration: Fast reconfiguration and in-system programming
- Hierarchical Interconnect: Multi-level routing for complex designs
- Programmable Slew Rate Control: Optimized signal integrity and EMI reduction
- Zero Hold Time: Simplified timing analysis for input registers
- Global Clock Networks: Multiple clock domains and distribution
Performance Characteristics
- Propagation Delay: 5.6ns (typical logic delay)
- Setup Time: 3.0ns (typical register setup)
- Clock-to-Output: 4.5ns (typical register to pad)
- Maximum Toggle Rate: 167MHz (I/O toggle frequency)
- Power Consumption: 1.2W (typical active power at 25MHz)
- Static Power: 150mW (typical standby power)
- Configuration Time: <100ms (typical bitstream loading)
2. Pricing
Current Market Pricing
Price Category: Premium FPGA – Contact Authorized Distributors
- Single Unit Price: Request quotation from authorized Xilinx distributors
- Development Quantity (1-24 units): Premium pricing for prototyping
- Small Production (25-99 units): Standard commercial pricing
- Volume Production (100-499 units): Reduced pricing with volume discounts
- High Volume (500+ units): Maximum discount tiers available
- Lead Time: 10-20 weeks (dependent on global supply chain)
Pricing Factors and Considerations
- Package Complexity: HQ240 commands premium over smaller packages
- Legacy Product Premium: Mature product with stable but higher pricing
- Limited Availability: Specialized distributors and authorized resellers
- EOL Considerations: End-of-life product with restricted new production
- Last-Time-Buy Opportunities: Consider stocking for long-term projects
Cost-Effective Alternatives
- XC5215-5HQ240C: Standard commercial variant (non-TM designation)
- XC5215TM-5HQ208C: Reduced pin count alternative
- XC5215TM-6HQ240C: Higher speed grade option
- Modern Replacements: Xilinx 7-Series or UltraScale alternatives for new designs
Total Cost of Ownership
- Development Tools: ISE software licensing and support
- Board Design: Complex PCB routing for 240-pin package
- Manufacturing: Advanced assembly processes required
- Testing: Comprehensive boundary scan and functional testing
Procurement Recommendation: The XC5215TM-5HQ240C is a legacy product suitable primarily for existing design support, replacement parts, and maintenance applications. New projects should evaluate current-generation Xilinx FPGA families for improved performance, power efficiency, and long-term availability.
3. Documents & Media
Primary Technical Documentation
- Official Datasheet: XC5200 Field Programmable Gate Array Family Specification
- User Manual: XC5215 Complete Implementation and Programming Guide
- Package Specification: HQ240 Mechanical Drawings and Thermal Data
- Pin Assignment Reference: Comprehensive pinout diagrams and signal definitions
- Application Notes: Design optimization and implementation guidelines
- Errata Documentation: Known issues and workaround solutions
Development Software Suite
- Primary IDE: Xilinx ISE (Integrated Software Environment)
- Legacy Tools: Foundation Series and Alliance development packages
- Design Entry Options:
- ABEL: Hardware description language synthesis
- Schematic Capture: Graphical design entry and simulation
- VHDL: IEEE-standard hardware description language
- Verilog HDL: Industry-standard HDL synthesis and simulation
- Programming Tools: iMPACT configuration and boundary scan testing
- Simulation Support: ModelSim, VCS, and other industry-standard simulators
Package and Thermal Resources
- HQ240 Package Drawings: Detailed mechanical specifications and dimensions
- Thermal Analysis: Junction-to-ambient thermal resistance characteristics
- PCB Design Guidelines: Recommended footprint and routing practices
- Assembly Instructions: Surface mount assembly and soldering guidelines
- Thermal Management: Heat sink recommendations and thermal design guidelines
Quality and Reliability Documentation
- Quality Assurance Manual: Manufacturing and testing procedures
- Reliability Analysis: MTBF calculations and failure rate data
- Environmental Testing: Temperature cycling and stress test results
- Qualification Reports: Industry standard compliance testing
- Traceability Documentation: Manufacturing lot tracking and quality records
4. Related Resources
XC5200 Family Product Portfolio
- XC5202: Entry-level (3,000 gates, 256 cells)
- XC5204: Small-scale applications (6,000 gates, 484 cells)
- XC5206: Medium-density option (9,000 gates, 784 cells)
- XC5210: High-capacity variant (16,000 gates, 1,296 cells)
- XC5215: Maximum family capacity (23,000 gates, 1,936 cells)
Package Variant Options
- XC5215TM-5HQ208C: 208-pin reduced I/O alternative
- XC5215TM-5PQ240C: PQFP package option
- XC5215TM-5BG352C: Ball Grid Array for advanced applications
- XC5215TM-6HQ240C: Higher speed grade (-6) variant
- XC5215TM-4HQ240C: Lower speed grade (-4) cost-optimized option
Development Ecosystem
- Evaluation Boards: XC5200 family development and demonstration platforms
- Reference Designs: Pre-verified application examples and IP cores
- Design Services: Authorized Xilinx design partners and consultants
- Training Resources: Online tutorials and design methodology courses
- Community Support: Xilinx forums and user communities
Application-Specific Resources
- Digital Signal Processing: DSP algorithm implementation guides
- Communications Applications: Protocol processor reference designs
- Industrial Control: Real-time control system implementations
- Instrumentation: Data acquisition and measurement applications
- Aerospace/Defense: High-reliability design considerations
Migration and Modernization
- Legacy Design Support: Maintaining and upgrading existing XC5200 systems
- Modern FPGA Alternatives: 7-Series, UltraScale, and Versal families
- Design Migration Tools: Automated conversion utilities and guidelines
- Performance Comparison: Benchmarking legacy vs. modern architectures
- Cost-Benefit Analysis: Upgrade vs. maintenance decision frameworks
5. Environmental & Export Classifications
Environmental Compliance and Standards
- RoHS Directive Compliance: Legacy product – verify specific lot compliance
- REACH Regulation: Compliant with European chemical safety requirements
- Conflict Minerals: Xilinx responsible sourcing policies and declarations
- Environmental Operating Range: Commercial grade (0°C to +85°C ambient)
- Storage Temperature: -65°C to +150°C (non-condensing environment)
- Relative Humidity: 5% to 95% (non-condensing)
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Controlled Technology: Dual-use semiconductor technology
- Export License Requirements: Subject to U.S. Export Administration Regulations (EAR)
- Wassenaar Arrangement: Controlled under international dual-use technology agreements
- Country-Specific Restrictions: Review BIS Commerce Country Chart for destination requirements
Quality and Manufacturing Standards
- Manufacturing Standard: ISO 9001:2015 certified production facilities
- Quality Grade: Commercial/Industrial grade (not automotive qualified)
- Reliability Testing: JEDEC standard qualification procedures
- Statistical Process Control: Advanced manufacturing process monitoring
- Traceability: Full lot tracking and quality documentation
Package and Environmental Specifications
- Moisture Sensitivity Level: MSL 3 per IPC/JEDEC J-STD-020
- ESD Sensitivity: Class 2 per ANSI/ESDA/JEDEC JS-001
- Package Material: Plastic molding compound with copper lead frame
- Lead Finish: Gold plating over nickel barrier (Pb-free available)
- Package Marking: Laser etched part number, date code, and lot traceability
Shipping and Storage Requirements
- Anti-Static Packaging: Conductive foam and ESD-protective packaging
- Dry Pack Requirements: Moisture barrier bags with desiccant
- Storage Environment: Controlled temperature and humidity conditions
- Shelf Life: 24 months minimum when stored per specifications
- Handling Procedures: Standard JEDEC semiconductor handling guidelines
Regulatory Approvals and Certifications
- FCC Part 15: Electromagnetic compatibility for digital devices
- CE Marking: European conformity declaration for electronic equipment
- ICES (Canada): Industry Canada electromagnetic compatibility
- VCCI (Japan): Voluntary Control Council for Interference compliance
- KC Mark (Korea): Korean certification for electromagnetic compatibility
End-of-Life and Disposal
- Product Lifecycle: Mature/legacy product with limited production
- Recycling Guidelines: Electronic waste disposal per local regulations
- Material Recovery: Precious metal recovery programs available
- Environmental Impact: Compliant with global e-waste management standards
- Documentation Retention: Technical documentation archived for 10+ years
Legacy Product Advisory: The XC5215TM-5HQ240C represents mature technology from Xilinx’s proven XC5200 FPGA family. While suitable for maintaining existing designs and specific applications requiring this exact functionality, new projects should consider current-generation Xilinx FPGA families (7-Series, UltraScale, or Versal) for enhanced performance, lower power consumption, advanced features, and long-term product availability.
Technical Support: Legacy product support is available through Xilinx technical resources, authorized distributors, and the design community. For critical applications, consider establishing long-term supply agreements or last-time-buy procurement strategies.
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