1. Product Specifications
Core Technical Specifications
- Part Number: XC5215PQ208
- Manufacturer: Xilinx Inc.
- Product Family: XC5200 FPGA Family
- Device Classification: Field Programmable Gate Array (FPGA)
- Logic Capacity: 23,000 gates equivalent (maximum XC5200 family capacity)
- Logic Cells: 1,936 configurable logic cells (CLBs)
- Maximum Operating Frequency: 83MHz (device capability)
- Process Technology: 0.5μm three-layer metal CMOS
- Supply Voltage: 5V ±5% (single supply operation)
- Package Type: 208-Pin PQ (Plastic Quad Flat Package)
- Temperature Grade: Standard commercial range available
- Speed Grades: Multiple speed options available (-4, -5, -6)
PQFP Package Specifications
- Package Designation: PQ208 (Plastic Quad Flat Package, 208 pins)
- Total Pin Count: 208 pins (high I/O density)
- User I/O Pins: Up to 164 user-configurable I/O pins
- Pin Pitch: 0.5mm (fine pitch for high density)
- Package Dimensions: 28mm x 28mm x 3.4mm (standard PQFP profile)
- Lead Style: Gull-wing leads for reliable surface mount assembly
- Package Material: Plastic molding compound with copper lead frame
- Package Weight: Approximately 2.0 grams
- Thermal Characteristics: Standard thermal performance for PQFP packages
Advanced Architecture Features
- VersaBlock Logic Architecture: Optimized for register-rich designs
- VersaRing I/O Interface: High-performance I/O with flexible standards
- SRAM-Based Configuration: Fast reconfiguration and in-system programming
- Hierarchical Interconnect: Multi-level routing for complex designs
- Distributed Memory: RAM and ROM capabilities within logic cells
- Clock Management: Global and local clock distribution networks
- Boundary Scan: IEEE 1149.1 JTAG compliance for testing and debug
Performance and Electrical Characteristics
- Propagation Delay: 5.6ns (typical logic delay, -5 speed grade)
- Setup Time: 3.0ns (typical register setup time)
- Clock-to-Output: 4.5ns (typical register to output pad)
- Maximum Toggle Rate: 167MHz (I/O switching frequency)
- Power Consumption: Optimized for 5V operation
- Input/Output Standards: TTL, CMOS, and ECL compatibility
- Drive Strength: Configurable output drive capability
- Slew Rate Control: Programmable for signal integrity optimization
Signal Integrity and I/O Features
- Programmable I/O Standards: Multiple voltage and logic standards
- Differential I/O Support: High-speed differential signaling capability
- Input Protection: ESD protection on all I/O pins
- Output Drive Options: Configurable drive strength settings
- Clock Input/Output: Dedicated clock pins and global distribution
- Power Distribution: Optimized power and ground pin placement
- Package Parasitics: Low inductance and capacitance for high-speed operation
2. Pricing
Competitive PQFP Pricing Structure
Price Category: High-Capacity FPGA – Authorized Distributors
- Single Unit Price: Contact authorized Xilinx distributors for current pricing
- Development Quantity (1-24 units): Standard development pricing
- Small Production (25-99 units): Volume pricing with setup considerations
- Production Volumes (100-499 units): Competitive production pricing
- High Volume (500+ units): Maximum volume discounts available
- Lead Time: 8-16 weeks (standard for legacy products)
PQFP Package Value Proposition
- Cost-Effective Assembly: PQFP offers lower assembly costs than BGA
- Proven Technology: Mature package with established supply chain
- Design Flexibility: Easier PCB routing compared to fine-pitch alternatives
- Rework Capability: Standard SMT rework procedures and equipment
- Testing Accessibility: Boundary scan and in-circuit test friendly
Market Positioning and Alternatives
- Legacy Product Advantage: Proven reliability and established design base
- Competitive Capacity: Maximum logic density in XC5200 family
- Package Alternatives: Compare with HQ208, BG352, and other variants
- Modern Equivalents: Current-generation alternatives for new designs
- Cost Comparison: Competitive pricing for equivalent logic capacity
Total Cost Analysis
- Development Costs: Standard PCB design tools and methodologies
- Assembly Costs: Conventional SMT assembly equipment and processes
- Testing Costs: Standard boundary scan and functional testing
- Rework Costs: Conventional SMT rework stations and procedures
- Thermal Management: Standard heat sinking and thermal design
Procurement Considerations
- Authorized Distributors: Established global distribution network
- Supply Chain: Mature product with predictable availability
- Documentation: Complete technical documentation and support
- Lifecycle: Legacy product with long-term availability considerations
- Replacement Planning: Consider modern alternatives for new designs
Value Assessment: The XC5215PQ208 offers maximum XC5200 family capacity in a cost-effective, assembly-friendly package. While legacy technology, it provides proven performance for applications requiring substantial logic resources with conventional assembly requirements.
3. Documents & Media
Primary Technical Documentation
- Official Datasheet: XC5200 Field Programmable Gate Array Family Complete Specification
- Package Specification: PQ208 mechanical drawings and thermal characteristics
- User Manual: XC5215 comprehensive implementation and programming guide
- Pin Assignment Reference: Complete PQFP pinout diagrams and signal definitions
- Application Notes: PQFP design guidelines and PCB layout recommendations
- Errata Documentation: Known issues, limitations, and workaround solutions
PQFP Design Resources
- PCB Design Guidelines: PQFP layout rules and thermal considerations
- Assembly Procedures: SMT placement, reflow, and inspection guidelines
- Thermal Design: Heat dissipation recommendations and thermal management
- Signal Integrity: High-speed design considerations for PQFP packages
- Testing Procedures: Boundary scan, in-circuit test, and functional testing
- Rework Guidelines: Component removal and replacement procedures
Development Software Suite
- Primary IDE: Xilinx ISE (Integrated Software Environment)
- Legacy Support: Foundation Series and Alliance development packages
- Design Entry Methods:
- ABEL: Hardware description language synthesis
- Schematic Capture: Graphical design entry with symbol libraries
- VHDL: IEEE-standard hardware description language
- Verilog HDL: Industry-standard HDL synthesis and simulation
- Implementation Tools: Place and route optimization for PQFP packages
- Programming Tools: iMPACT configuration and boundary scan utilities
Technical Reference Materials
- Design Methodologies: Best practices for XC5200 family implementation
- Timing Analysis: Static timing analysis procedures and constraints
- Power Analysis: Power consumption estimation and optimization
- Package Models: SPICE and IBIS models for simulation accuracy
- Reference Designs: Example implementations and application circuits
- Migration Guides: Upgrade paths to current-generation devices
Quality and Manufacturing Documentation
- Manufacturing Specifications: PQFP assembly and quality requirements
- Test Procedures: Acceptance testing and quality assurance protocols
- Reliability Data: Package reliability testing and qualification results
- Environmental Testing: Temperature cycling and stress test reports
- Failure Analysis: Package integrity and performance analysis procedures
- Traceability: Manufacturing lot tracking and quality documentation
4. Related Resources
XC5200 Family Product Portfolio
- XC5202PQ: Entry-level PQFP option (3,000 gates, 256 cells)
- XC5204PQ: Small-scale PQFP applications (6,000 gates, 484 cells)
- XC5206PQ: Medium-density PQFP variant (9,000 gates, 784 cells)
- XC5210PQ: High-capacity PQFP option (16,000 gates, 1,296 cells)
- XC5215PQ208: Maximum capacity PQFP configuration
Package Family Comparison
- XC5215HQ208: High-density QFP alternative (enhanced thermal)
- XC5215BG352: Ball Grid Array maximum I/O option
- XC5215PQ160: Reduced pin count PQFP alternative
- XC5215PQ240: Extended pin count PQFP variant
- XC5215TQ144: Thin QFP compact package option
PQFP Development Ecosystem
- Development Boards: XC5200 family evaluation and prototyping platforms
- Reference Designs: PQFP-optimized application examples
- Design Tools: PCB layout and thermal analysis software
- Assembly Services: Contract manufacturers with PQFP expertise
- Testing Solutions: Boundary scan and automated test equipment
Application Domains and Use Cases
- Digital Signal Processing: Real-time filtering and signal transformation
- Telecommunications: Protocol processing and interface bridging
- Industrial Control: Automation and process control applications
- Instrumentation: Data acquisition and measurement systems
- Communications: Network processing and switching applications
- Consumer Electronics: High-performance digital processing
Design Support and Services
- Technical Support: Xilinx application engineering and customer support
- Design Consultation: Authorized design partners and consultants
- Training Programs: XC5200 family design methodology courses
- Community Forums: User communities and technical discussion groups
- Documentation Library: Complete technical resource repository
Migration and Modernization
- Legacy Support: Maintaining existing XC5200-based systems
- Modern Alternatives: Current-generation FPGA families
- Design Migration: Tools and procedures for modernization
- Performance Upgrades: Enhanced capability with newer devices
- Long-term Strategy: Product lifecycle and obsolescence management
5. Environmental & Export Classifications
Environmental Operating Specifications
- Operating Temperature Range: 0°C to +85°C (Commercial grade standard)
- Storage Temperature: -65°C to +150°C (non-operating conditions)
- Junction Temperature: 125°C maximum (with proper thermal design)
- Humidity Tolerance: 5% to 95% RH (non-condensing conditions)
- Altitude Performance: Sea level to 10,000 feet operation
- Vibration Resistance: Standard electronic component specifications
- Mechanical Shock: JEDEC standards for surface mount components
Environmental Compliance Standards
- RoHS Directive: Compliance status varies by manufacturing date
- REACH Regulation: Compliant with European chemical safety requirements
- Conflict Minerals: Xilinx responsible sourcing policies and declarations
- Halogen Content: Standard package materials (non-halogen-free)
- Lead Content: Traditional Pb/Sn solder finish (lead-free variants available)
- Recycling Compliance: Electronic waste management standards
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Technology Classification: Dual-use semiconductor technology
- Export License Requirements: Subject to U.S. Export Administration Regulations (EAR)
- Wassenaar Arrangement: Controlled under international dual-use agreements
- Country Restrictions: Review BIS Commerce Country Chart for destination compliance
Quality and Manufacturing Standards
- Manufacturing Quality: ISO 9001:2015 certified production facilities
- Package Quality: IPC-A-610 Class 2 (general electronics applications)
- Assembly Standards: J-STD-020 moisture sensitivity guidelines
- Qualification Testing: JEDEC standards for plastic package reliability
- Statistical Process Control: Advanced manufacturing process monitoring
- Supplier Quality: Qualified vendor programs and auditing
PQFP-Specific Environmental Specifications
- Moisture Sensitivity Level: MSL 3 per IPC/JEDEC J-STD-020
- Package Coplanarity: 0.10mm maximum (per JEDEC standards)
- Lead Finish: Hot solder dip or electroplated finishes
- Package Material: Flame-retardant plastic molding compound
- Lead Frame: Copper alloy with appropriate surface finish
- Marking Requirements: Permanent laser or ink marking with traceability
Shipping and Storage Requirements
- Anti-Static Packaging: ESD-protective packaging and handling procedures
- Moisture Protection: Dry pack packaging for moisture-sensitive components
- Storage Conditions: Controlled temperature and humidity environment
- Shelf Life: 12 months minimum in moisture barrier packaging
- Handling Guidelines: Standard ESD-safe handling procedures
- Baking Procedures: Moisture recovery baking if exposure limits exceeded
Assembly and Reliability Considerations
- Soldering Profile: Compatible with standard SMT reflow processes
- Thermal Interface: Standard thermal design practices for PQFP
- Mechanical Stress: Package design for thermal cycling reliability
- Lead Integrity: Gull-wing lead design for assembly reliability
- Inspection Methods: Automated optical inspection (AOI) compatibility
- Rework Procedures: Standard SMT rework with appropriate thermal profiles
Legacy Product Status: The XC5215PQ208 represents mature, proven technology from Xilinx’s XC5200 FPGA family. While suitable for existing design support and applications requiring this specific functionality, new projects should evaluate current-generation Xilinx FPGA families for enhanced performance, lower power consumption, and modern features.
Package Advantages: The PQ208 PQFP package offers an excellent balance of I/O density, assembly manufacturability, and cost-effectiveness. The package is well-suited for applications requiring substantial I/O capability with conventional surface-mount assembly processes.
Design Considerations: The PQFP package provides easier PCB routing and assembly compared to fine-pitch alternatives, making it suitable for applications where conventional SMT assembly capabilities are preferred over advanced packaging technologies.
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