1. Product Specifications
Core Performance Features
- Device Family: XC5200 Series Mainstream FPGA
- Logic Capacity: 23,000 gates equivalent (high-density implementation)
- Logic Cells: 1,936 configurable logic cells (CLBs)
- Maximum Operating Frequency: Up to 83MHz
- Process Technology: Proven 0.5ฮผm three-layer metal CMOS
- Supply Voltage: 5V ยฑ5% (single supply operation)
- Speed Grade: 6 (Standard performance grade)
- Temperature Grade: C (Commercial: 0ยฐC to +70ยฐC)
Package & Mechanical Specifications
- Package Type: PQ240C (Plastic Quad Flat Pack)
- Pin Count: 240 pins (balanced I/O capability)
- Package Format: PQFP (Plastic Quad Flat Pack)
- Pin Pitch: 0.5mm pitch for standard PCB assembly
- Package Size: Compact footprint optimized for board density
- Lead Configuration: Gull-wing leads for reliable surface mount assembly
- Operating Temperature Range: Commercial (0ยฐC to +70ยฐC)
- Storage Temperature Range: -65ยฐC to +150ยฐC
- Package Height: Low profile for space-constrained applications
Advanced Architecture Features
- SRAM-Based Configuration: Cost-effective, register/latch rich, reprogrammable architecture
- VersaRing I/O Interface: Innovative design optimizes logic cell to I/O ratio
- I/O Capability: Up to 240 user I/O signals with flexible voltage standards
- Programmable Output Control: Advanced slew-rate control for signal integrity optimization
- Zero Hold Time Design: Input registers with simplified timing requirements
- Multi-Level Clocking: Multiple global clock networks for complex timing domains
- Flexible Routing: Rich hierarchy of interconnect resources for design optimization
Logic Resources Detail
- Configurable Logic Blocks: 1,936 CLBs providing maximum functionality
- I/O Blocks (IOBs): Comprehensive support for industry-standard I/O levels
- Distributed RAM: Flexible memory resources distributed throughout the device
- Global Clock Networks: Multiple low-skew clock distribution systems
- Routing Matrix: Advanced programmable interconnect architecture
- Performance Optimization: Speed grade 6 timing specifications for balanced performance
Electrical Characteristics
- Core Voltage: 5V ยฑ5%
- I/O Voltage Levels: Support for multiple I/O standards
- Power Consumption: Optimized for moderate power applications
- Input/Output Drive: Configurable drive strength for various load requirements
- ESD Protection: Robust electrostatic discharge protection circuits
2. Pricing Information
Market Position: The XC5215-6PQ240C represents a mainstream FPGA solution offering an excellent balance of performance, I/O capability, and cost-effectiveness for commercial applications requiring substantial programmable logic resources.
Current Pricing Structure
- Unit Price Range: Competitive pricing reflecting balanced performance and I/O count
- Volume Pricing: Attractive discounts available starting at 10+ units
- Quantity Breaks: Progressive price reductions at 25, 50, 100, and 250+ unit levels
- Reference Pricing: Similar XC5215 variants range from $33-$35 for volume orders (10-100 units)
- Package Value: PQ240 package offers cost-effective solution for moderate I/O requirements
- Speed Grade Economy: Grade 6 provides optimal price-performance balance
Market Availability & Sourcing
- Production Status: Limited production for specialized applications and legacy support
- Primary Distribution: Available through authorized AMD Xilinx distributors with established inventory
- Lead Time: Standard delivery 6-12 weeks for new orders, 24-48 hours from stock
- Stock Availability: Good availability from multiple distributor sources
- Minimum Order Quantity: Typically 10-20 units for standard procurement
- Express Options: Same-day shipping available from stocking distributors
Cost Considerations
- Package Advantage: PQ240 offers good I/O density at moderate package cost
- Speed Grade Economy: Grade 6 provides cost-effective performance
- Commercial Grade: Standard temperature range reduces qualification costs
- Legacy Pricing: Stable pricing due to established market demand
Important Note: This device is marked as “NOT RECOMMENDED for NEW DESIGN” by AMD Xilinx, indicating legacy status suitable for existing system maintenance, upgrades, and specialized applications requiring this specific package and performance profile.
Value Proposition
- Cost-effective solution for moderate performance requirements
- Balanced I/O count suitable for most applications
- Proven reliability with extensive field history
- Compatible with existing XC5200-based designs
3. Documents & Media
Primary Technical Documentation
- Complete Datasheet: XC5200 Family comprehensive technical specifications (PDF format)
- Speed Grade Documentation: Grade 6 timing specifications and AC parameters
- Package Specifications: PQ240C mechanical outline drawings and assembly guidelines
- Pin Configuration: Detailed 240-pin pinout diagrams and signal descriptions
Design Implementation Resources
- Application Notes: Best practices for XC5215-6PQ240C implementation and optimization
- Reference Designs: Proven VHDL/Verilog code examples for common applications
- Timing Constraint Files: Standard constraint templates for grade 6 performance
- PCB Design Guidelines: PQ240 package layout recommendations and routing strategies
Software Development Support
- Tool Compatibility: Full compatibility with Xilinx ISE Design Suite and legacy tools
- HDL Support: Comprehensive support for ABEL, schematic capture, VHDL, and Verilog HDL synthesis
- Simulation Libraries: Complete timing and functional simulation models
- Programming Utilities: JTAG boundary scan and configuration programming support
Manufacturing & Assembly Documentation
- Assembly Guidelines: PQ240 surface mount assembly specifications and recommendations
- Soldering Profiles: Recommended reflow soldering temperature profiles
- Quality Standards: IPC assembly standards and quality acceptance criteria
- Handling Procedures: ESD protection and component handling protocols
Application Support Documentation
- Design Examples: Reference implementations for common use cases
- Migration Guides: Upgrade paths from other XC5200 family devices
- Troubleshooting: Common implementation issues and resolution procedures
- Optimization Guides: Performance tuning and resource utilization best practices
4. Related Resources
Development Tools & Hardware
- Programming Equipment: Standard JTAG programmers and boundary scan tools
- Development Platforms: Evaluation boards supporting PQ240 package
- Socket Solutions: Standard test sockets and programming adapters
- Debug Equipment: Logic analyzers and standard oscilloscope tools
- Assembly Tools: Standard SMT assembly equipment and fixtures
Alternative & Compatible Devices
- Package Variants: Other XC5215 devices in different pin count options
- Speed Grade Alternatives: Higher and lower speed grades for different performance requirements
- Migration Options: Current-generation AMD Xilinx FPGA alternatives
- Pin-Compatible Options: Cross-reference guide for system upgrades
- Cost Alternatives: Smaller XC5200 family devices for reduced requirements
Professional Services & Support
- Application Engineering: Standard technical support for design optimization
- Design Services: Qualified design houses with XC5200 family experience
- Training Programs: Basic and intermediate FPGA design courses
- Consultation Services: Design review and optimization guidance
- Manufacturing Support: Assembly and test service recommendations
Third-Party Ecosystem
- IP Core Library: Standard intellectual property blocks for XC5200 architecture
- EDA Tool Support: Third-party design tools and optimization utilities
- Testing Services: Standard automatic test equipment (ATE) support
- Board Design Services: PCB layout services specializing in PQFP packages
- Component Services: Standard component sourcing and lifecycle management
Community & Knowledge Base
- Technical Forums: XC5200 user communities and support groups
- Documentation Library: Comprehensive technical resource repository
- User Groups: Regional FPGA design communities and meetings
- Online Resources: Web-based support portals and knowledge databases
- Training Resources: Educational materials and design methodology guides
5. Environmental & Export Classifications
Environmental Compliance Standards
- RoHS Compliance: Fully compliant with RoHS directive requirements (lead-free available)
- REACH Regulation: Compliant with European Union chemical safety standards
- Conflict Minerals: Certified conflict-free sourcing compliance
- WEEE Directive: Waste Electrical and Electronic Equipment directive compliance
- Environmental Standards: ISO 14001 environmental management compliance
Export Control Classifications
- ECCN Classification: Export Control Classification Number per US Department of Commerce
- Dual-Use Technology: Standard commercial export classification
- Country Restrictions: Standard destination country requirements
- End-Use Applications: Commercial and industrial application approval
- Technology Transfer: Standard technical documentation distribution
Quality & Reliability Standards
- Commercial Grade: Standard commercial temperature and reliability specifications
- ISO Certifications: ISO 9001:2015 quality management system compliance
- Component Testing: Standard electrical and environmental testing protocols
- Reliability Testing: JEDEC standard qualification methodology
- Quality Management: Statistical process control and quality assurance
Physical Environmental Specifications
- Moisture Sensitivity Level: Level 3 classification (168 hours at 30ยฐC/60% relative humidity)
- ESD Protection: Class 1B electrostatic discharge protection (>1000V HBM, >200V CDM)
- Thermal Cycling: Commercial grade temperature cycling qualification
- Vibration & Shock: Standard commercial mechanical stress specifications
- Operating Environment: Standard office and controlled industrial environments
Packaging & Storage Requirements
- Anti-Static Packaging: Standard conductive tray with moisture barrier protection
- Dry Storage: Standard environment storage at <30ยฐC, <60% relative humidity
- Shelf Life: 12 months in original factory-sealed packaging
- Handling Protocols: Standard ESD handling procedures and protocols
- Transportation: Standard shock and vibration protection requirements
Sustainability & Disposal
- Material Recovery: Standard precious metal recovery programs
- Environmental Impact: Corporate environmental responsibility reporting
- Safe Disposal: EPA-approved disposal methods for electronic components
- Recycling Programs: Component recycling and material recovery options
- End-of-Life Management: Standard product lifecycle management
Assembly & Manufacturing Environment
- Operating Temperature: 0ยฐC to +70ยฐC ambient temperature range
- Humidity Range: 10% to 90% non-condensing relative humidity
- Altitude: Standard atmospheric pressure to 2000 meters
- Contamination: Clean assembly environment recommended
- Airflow: Natural convection cooling sufficient for most applications
Key Applications & Market Segments
Industrial Automation & Control
- Process Control: Manufacturing automation and process monitoring systems
- Motion Control: Servo drives and precision positioning systems
- Data Acquisition: Multi-channel data collection and processing systems
- Human Machine Interface: Operator panels and control interfaces
Communications & Networking
- Protocol Conversion: Interface bridging and protocol translation
- Network Processing: Packet processing and traffic management
- Telecommunications: Digital signal processing for voice and data
- Test Equipment: Communication system testing and validation
Computing & Embedded Systems
- Peripheral Controllers: Standard interface controllers and bridges
- Coprocessors: Computational acceleration and offload functions
- Memory Controllers: Standard memory interface implementations
- System Management: Power management and system monitoring
Legacy System Support
- Equipment Maintenance: Direct replacement for existing XC5215-6PQ240C installations
- System Upgrades: Performance enhancement for existing architectures
- Long-Term Support: Extended lifecycle support for commercial systems
- Cost Optimization: Cost-effective alternative to system redesign
Competitive Advantages
Balanced Performance
- Optimal I/O Count: 240 pins provide substantial connectivity without excessive cost
- Standard Speed Grade: Grade 6 offers reliable performance for most applications
- Proven Architecture: Time-tested VersaBlock and VersaRing technologies
- Commercial Reliability: Standard temperature range suitable for most environments
Design Benefits
- Cost Effectiveness: Balanced price-performance for commercial applications
- Design Familiarity: Standard Xilinx tools and methodologies
- Assembly Friendly: Standard PQFP package for conventional assembly
- Resource Optimization: Efficient logic utilization and I/O allocation
Market Position
- Mainstream Solution: Suitable for majority of FPGA applications
- Broad Compatibility: Compatible with standard design flows and tools
- Supply Stability: Multiple distribution sources ensure availability
- Technical Support: Comprehensive documentation and support resources
Conclusion
The XC5215-6PQ240C represents an excellent balance of performance, I/O capability, and cost-effectiveness within the XC5200 FPGA family. Its 240-pin PQFP package provides substantial connectivity while maintaining manageable board real estate and assembly costs, making it ideal for commercial applications requiring moderate to high logic density.
While classified as a legacy device, the XC5215-6PQ240C continues to serve essential roles in industrial automation, communications infrastructure, and embedded systems where its combination of proven reliability, balanced performance, and cost-effectiveness provides optimal value. The commercial temperature grade and standard speed grade 6 make it particularly well-suited for controlled environment applications.
This device is recommended for system upgrades, equipment maintenance, and new applications where the XC5200 architecture provides the optimal balance of features, performance, and cost. The extensive I/O count and proven reliability make it an excellent choice for interfacing and control applications.
For detailed technical specifications, design guidelines, assembly recommendations, and availability information, consult authorized AMD Xilinx distributors or component suppliers specializing in FPGA products. Standard design support and assembly services are readily available for optimal implementation and reliable operation.
