XC5215-6HQ304C FPGA: High-Density Programmable Logic Device

Product Specifications

Core Features

• Part Number: XC5215-6HQ304C
• Logic Density: 15,000 equivalent gates
• Speed Grade: -6 (premium performance grade)
• Package Type: HQ304 (304-pin Ceramic Quad Flat Pack)
• Temperature Range: Commercial (0°C to +70°C)
• Supply Voltage: 5V ±5%
• Maximum Operating Frequency: Up to 80 MHz system clock
• User I/O Pins: 192 available I/O pins

Advanced Technical Specifications

• Configurable Logic Blocks (CLBs): 196 CLBs with advanced routing
• Input/Output Blocks (IOBs): 304 IOBs with flexible configuration
• On-Chip Memory: 6,144 bits distributed RAM
• Interconnect Architecture: Hierarchical programmable routing matrix
• Configuration Technology: SRAM-based with external memory interface
• Process Node: Proven CMOS technology
• Package Size: 35mm x 35mm ceramic package
• Thermal Performance: Enhanced heat dissipation characteristics

Performance Characteristics

• Propagation Delay: Ultra-low latency signal paths
• Setup/Hold Times: Optimized for high-speed synchronous designs
• Clock-to-Output: Predictable timing for critical applications
• Power Consumption: Efficient power management with multiple voltage domains

Pricing Information

The XC5215-6HQ304C is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities:

• Commercial Pricing: Competitive rates for high-pin-count applications
• Volume Pricing: Attractive discounts for orders of 10+ units
• Extended Lead Times: 6-12 weeks typical delivery for standard orders
• Availability Status: Limited production with allocated inventory
• Cost Factors: Premium pricing due to ceramic package and high I/O count

Contact authorized Xilinx distributors for current XC5215-6HQ304C pricing, minimum order quantities, and delivery schedules.

Documents & Media

Comprehensive Technical Documentation

• Complete Datasheet: Full electrical, thermal, and mechanical specifications
• Pinout Documentation: Detailed 304-pin configuration and signal assignments
• Timing Specifications: Comprehensive AC characteristics and timing models
• Package Specifications: Mechanical drawings and assembly requirements
• Thermal Analysis: Heat dissipation guidelines and thermal management
• Configuration Manual: Programming interfaces and bitstream management

Design Implementation Resources

• HDL Model Libraries: Complete VHDL and Verilog simulation models
• Constraint Files: Timing and placement constraint templates
• Reference Designs: Proven implementation examples and best practices
• PCB Design Guidelines: High-density routing recommendations and layer stack-ups
• Signal Integrity Guidelines: Transmission line design and termination strategies
• Power Distribution: Decoupling and power plane design recommendations

Quality Documentation

• Qualification Reports: Comprehensive reliability and stress test results
• Process Control: Statistical quality metrics and process capability data
• Revision History: Device revision tracking and change documentation

Related Resources

Professional Development Tools

• Xilinx Foundation Suite: Complete FPGA design and implementation environment
• Alliance Development System: Professional-grade design tools and methodologies
• Timing Analysis Tools: Advanced static timing analysis and optimization
• Logic Synthesis: High-performance synthesis engines and optimization algorithms
• Place and Route: Advanced implementation tools for high-utilization designs

Hardware Development Platforms

• High-Density Evaluation Boards: Development platforms featuring the XC5215-6HQ304C
• Advanced Prototyping Systems: Multi-FPGA development and verification platforms
• Programming Solutions: High-speed configuration and in-system programming tools
• Test Equipment: Specialized test fixtures and automated test equipment compatibility

Professional Services

• Design Consulting: Expert FPGA implementation and optimization services
• Technical Training: Advanced FPGA design methodology and tool training
• Custom IP Development: Specialized intellectual property creation and licensing
• System Integration: Complete solution development and deployment support

Industry Partnerships

• EDA Tool Vendors: Third-party design tool compatibility and support
• IP Providers: Verified intellectual property and soft-core processors
• Board Manufacturers: Certified PCB fabrication and assembly services
• Test Services: Independent verification and validation laboratories

Environmental & Export Classifications

Environmental Compliance Standards

• RoHS Directive Compliance: Full compliance with lead-free and hazardous substance restrictions
• REACH Regulation: European chemical safety regulation conformance
• Green Manufacturing: Sustainable production processes and materials
• Packaging Standards: Environmentally responsible packaging and shipping materials
• Recycling Programs: End-of-life device recovery and material reclamation
• Carbon Footprint: Manufacturing process environmental impact assessment

International Trade Classifications

• Export Administration Regulations: US Department of Commerce EAR compliance
• Export Control Classification Number: Specific ECCN designation for trade control
• Harmonized Tariff Schedule: International customs classification code
• Certificate of Origin: Manufacturing location and content documentation
• Free Trade Agreement: Eligibility for preferential trade treatment
• Anti-Dumping Compliance: International trade regulation adherence

Quality and Regulatory Certifications

• Commercial Temperature Grade: Standard operating temperature qualification testing
• ISO 9001 Certification: Quality management system compliance
• AS9100 Aerospace Standard: Aerospace industry quality system requirements
• Automotive Electronics Council: AEC-Q100 automotive qualification available
• Military Standards: MIL-STD environmental and reliability testing capability

International Safety Standards

• UL Recognition: Underwriters Laboratories component safety certification
• CSA Certification: Canadian Standards Association approval
• TÜV Certification: German technical inspection association validation
• CE Marking: European Conformity assessment and compliance declaration
• FCC Compliance: Federal Communications Commission electromagnetic compatibility

The XC5215-6HQ304C represents the pinnacle of XC5200 series performance, offering maximum I/O density and premium reliability for mission-critical applications. Its ceramic package construction and extensive connectivity make it the preferred choice for high-end telecommunications infrastructure, aerospace systems, and advanced industrial control applications requiring exceptional performance and reliability.

For the latest XC5215-6HQ304C technical specifications, compliance certifications, and availability information, consult official Xilinx documentation and authorized distribution partners.