1. Product Specifications
Technical Specifications – XC5210-6TQG176C
| Parameter | Specification |
|---|---|
| Part Number | XC5210-6TQG176C |
| Package Type | 176-pin TQG (Thin Quad Gate Array) |
| Speed Grade | -6 (High Performance) |
| Configuration | C (Standard Configuration) |
| Operating Temperature Range | [Specify range: e.g., 0°C to +85°C] |
| Core Supply Voltage | [Specify voltage: e.g., 2.5V ±3%] |
| I/O Supply Voltages | [Specify: e.g., 3.3V/2.5V/1.8V] |
| Logic Density | [Specify equivalent system gates] |
| Configurable Logic Blocks | [Specify CLB array size] |
| Block RAM Resources | [Specify total memory bits] |
| Available User I/O | [Specify I/O pin count] |
| Global Clock Networks | [Specify clock distribution] |
| Maximum Operating Frequency | [Specify MHz] |
| Dynamic Power Consumption | [Specify mW at maximum frequency] |
Compact High-Performance Architecture
- Speed Grade -6 Optimization: Maximum frequency operation in space-constrained applications
- Compact Logic Density: High logic utilization per square millimeter of board space
- Fast Interconnect Network: Optimized routing architecture for speed-critical compact designs
- High-Speed Clock Management: Efficient clock distribution for maximum frequency operation
- Performance-Tuned Memory: Block RAM optimized for high-speed data access in compact systems
- Advanced Timing Closure: Predictable timing characteristics for reliable compact implementation
TQG Package Advantages
- 176-Pin Configuration: Optimal pin count for balanced I/O density and compact footprint
- Thin Profile Design: Minimized package height for space-constrained applications
- Compact PCB Footprint: Efficient board space utilization for portable and embedded systems
- Enhanced Thermal Performance: Superior heat dissipation despite compact size
- Reliable Assembly: Proven quad gate array technology for high-volume manufacturing
- Cost-Effective Solution: Balanced cost structure for performance-sensitive compact applications
C Configuration Features
- Balanced Architecture: Standard configurable logic block arrangement for versatile applications
- Efficient Resource Allocation: Optimal distribution of logic, memory, and I/O resources
- Flexible Routing Network: Comprehensive interconnect resources for diverse design requirements
- Standard Pin Assignment: Proven I/O placement for reliable interface implementation
- Power-Optimized Design: Efficient power distribution for compact system integration
- Complete Debug Support: Standard boundary scan and test access capabilities
Compact Package Design Excellence
- TQG Package Dimensions: [Length] x [Width] x [Height] mm for minimal board impact
- Pin Pitch: [Specify] mm for reliable assembly and compact routing
- Low Profile: Thin package height for space-constrained mechanical designs
- Thermal Characteristics: Optimized thermal resistance for effective heat management
- Signal Integrity: Controlled impedance design for high-speed compact applications
- EMI Performance: Advanced electromagnetic compatibility for dense system integration
High-Speed Electrical Performance
- Ultra-Fast Propagation Delay: [Specify] ns typical for speed grade -6 critical paths
- High-Speed Setup Time: [Specify] ns minimum for maximum frequency synchronous operation
- Precise Hold Time: [Specify] ns minimum for reliable high-speed data capture
- Optimized Clock-to-Output: [Specify] ns maximum for high-frequency interfaces
- Multi-Standard I/O: Comprehensive support for high-speed signaling standards
- Configurable Drive Strength: Output current capability optimized for compact systems
2. Pricing Information
XC5210-6TQG176C Pricing Guide
| Volume Tier | Unit Price (USD) | Lead Time | Availability |
|---|---|---|---|
| 1-9 units | Performance Compact | 3-5 weeks | Stock/Order |
| 10-49 units | Volume Compact | 5-7 weeks | Build to Order |
| 50-199 units | Quantity Compact | 7-9 weeks | Production Schedule |
| 200-499 units | Bulk Compact | 9-12 weeks | Manufacturing Queue |
| 500+ units | Contract Compact | 12-15 weeks | Long-term Agreement |
Compact High-Performance Value Proposition
- Performance-Size Optimization: Premium pricing for maximum speed in minimal footprint
- TQG Package Economy: Cost-effective assembly compared to equivalent performance alternatives
- Compact System Savings: Reduced PCB size requirements lower overall system cost
- Speed Grade Premium: Enhanced performance capabilities justify investment for speed-critical applications
- Standard Commercial Terms: Flexible payment arrangements for diverse compact application requirements
Specialized Compact Services
- Factory Pre-Programming: Custom bitstream configuration for rapid deployment
- Enhanced Speed Testing: Extended characterization for maximum frequency validation
- Compact System Consultation: Design guidance for space-constrained high-performance applications
- Custom Compact Packaging: Application-specific packaging options for unique form factors
- Priority Technical Support: Dedicated assistance for speed-critical compact implementations
Economic Analysis for Compact High-Performance Applications
- Space-Speed Trade-off: Optimal balance of performance and size for premium applications
- System Miniaturization: Enables compact product designs with uncompromised performance
- Development Acceleration: Proven compact platform reduces design risk and time-to-market
- Manufacturing Efficiency: Standard TQG assembly processes enable reliable production scaling
- Performance Leadership: Competitive advantage through superior speed in compact form factor
Regional Compact Market Pricing
- North American Compact: USD pricing with specialized compact design support infrastructure
- European Compact: EUR pricing including compact system regulatory compliance
- Asia-Pacific Compact: Local currency support with regional compact manufacturing capabilities
- Global Compact Distribution: Worldwide availability through compact application specialists
3. Documents & Media
Core Compact High-Performance Documentation
- Complete Product Datasheet: XC5210-6TQG176C Comprehensive Performance and Package Specifications
- Compact Implementation Guide: Design methodology for high-speed space-constrained applications
- TQG Package Assembly Manual: Comprehensive guidelines for 176-pin TQG assembly and soldering
- Speed Optimization Guide: Techniques for maximizing frequency in compact implementations
Compact High-Speed Design Resources
- TQG176 Application Notes:
- AN1401: XC5210-6TQG176C Compact High-Speed System Design
- AN1402: 176-Pin TQG Package Layout and Routing Optimization
- AN1403: Thermal Management in Compact High-Performance Applications
- AN1404: Speed Grade -6 Timing Closure in Space-Constrained Designs
- AN1405: Power Distribution for Compact High-Speed FPGA Systems
- AN1406: Signal Integrity in Compact TQG Package Applications
- AN1407: EMI/EMC Design for Compact High-Performance Systems
- AN1408: C Configuration Resource Optimization for Speed Applications
- Compact Design Examples: Proven implementations for space-constrained high-speed applications
- Performance Benchmarking: Speed validation data for compact system implementations
Development Tool Integration for Compact Applications
- Compact Design Software: Enhanced tools with space and speed optimization features
- High-Speed IP Library: Intellectual property optimized for compact high-performance applications
- TQG Simulation Models: Comprehensive thermal, electrical, and mechanical simulation models
- Compact Debug Solutions: Advanced debugging tools for space-constrained implementations
Physical Design Resources for Compact Systems
- TQG176 CAD Libraries: Complete symbol and footprint libraries optimized for compact designs
- 3D Compact Models: Precise mechanical models for space-constrained assembly analysis
- Compact PCB Guidelines: Layout rules and routing strategies for high-speed TQG packages
- Assembly Documentation: Manufacturing specifications optimized for compact system production
Educational and Training Materials
- Compact High-Speed Design Course: Specialized training for space-constrained performance applications
- TQG Assembly Workshop: Hands-on training for 176-pin package assembly and inspection
- Video Tutorial Series: Step-by-step guidance for compact high-performance implementation
- Professional Compact Certification: Industry credentials for compact high-speed FPGA design
Quality and Performance Documentation
- Speed Grade Characterization: Performance validation across compact package thermal conditions
- Compact Reliability Testing: Long-term performance validation for space-constrained applications
- TQG Assembly Qualification: Manufacturing standards for compact package production
- Performance Statistical Analysis: Process capability data for compact high-speed manufacturing
4. Related Resources
Compact High-Performance Development Ecosystem
- TQG176 Evaluation Board: XC5210-6TQG176C development platform with compact form factor
- Compact Programming Tools: Space-efficient JTAG programmers for portable development
- High-Speed Analysis Equipment: Compact test equipment for performance validation
- Rapid Prototyping Platforms: Quick-turn development systems for compact applications
System Integration Components for Compact Designs
- Compact Power Management: Space-efficient power supplies optimized for high-performance operation
- Miniature Clock Sources: Compact oscillators and timing solutions for space-constrained designs
- High-Density Memory: Compact memory devices optimized for high-speed applications
- Compact Interface Components: Space-efficient level shifters and signal conditioning circuits
Compact High-Performance Software Suite
- Space-Optimized Design Tools: Enhanced synthesis with compact and speed optimization
- Compact IP Portfolio: Intellectual property optimized for space-constrained high-speed applications
- Performance Simulation: Advanced timing and thermal analysis for compact implementations
- Compact System Integration: Hardware/software co-design tools for miniaturized systems
Professional Services for Compact Applications
- Compact Design Consultation: Expert guidance for space-constrained high-performance implementations
- TQG Assembly Services: Professional PCB layout and assembly optimization for compact packages
- Thermal Analysis Services: Advanced thermal modeling for compact high-performance systems
- Performance Optimization: Professional timing closure and frequency maximization services
Target Compact High-Performance Applications
- Portable High-Performance Computing: Mobile workstations and portable processing systems
- Compact Communications Equipment: Space-constrained high-speed communication devices
- Embedded High-Speed Processing: Real-time processing in space-limited applications
- Portable Test Equipment: Compact instrumentation requiring high-speed processing
- Mobile Industrial Systems: Portable automation and control systems with performance requirements
Technology Partnership Network for Compact Solutions
- Compact EDA Tools: Enhanced software support for space-constrained high-performance design
- Miniaturization IP Vendors: Intellectual property optimized for compact implementations
- Compact PCB Manufacturers: Specialized fabrication for high-density compact designs
- Compact System Integrators: Solution providers specializing in miniaturized high-performance systems
Migration and Scalability for Compact Applications
- Compact Device Family: Related products optimized for space-constrained applications
- Performance Scaling: Migration options for different speed and size requirements
- Package Alternatives: Transition pathways between compact package options
- Compact Technology Roadmap: Future evolution for space-constrained high-performance applications
5. Environmental & Export Classifications
Environmental Regulatory Compliance
- EU RoHS Directive 2011/65/EU: Complete restriction of hazardous substances compliance
- REACH Regulation EC 1907/2006: Chemical substance registration and authorization compliance
- Conflict Minerals Regulation: Dodd-Frank Act Section 1502 responsible sourcing certification
- WEEE Directive 2012/19/EU: Electronic waste management and recycling compliance
- Compact Green Manufacturing: Environmentally sustainable production for space-efficient devices
International Quality Management Standards
- ISO 9001:2015: Quality management system certification with compact device focus
- ISO 14001:2015: Environmental management system implementation and certification
- ISO 45001:2018: Occupational health and safety management system compliance
- IPC Standards: Electronics manufacturing quality standards for TQG assembly
- Compact Device Standards: Enhanced quality controls for space-constrained applications
Export Control and Trade Regulations
- US Export Administration Regulations: Department of Commerce export control compliance
- Export Control Classification Number: [Specific ECCN classification for XC5210-6TQG176C]
- Bureau of Industry and Security: Technology transfer and dual-use export regulations
- Harmonized System Classification: [International trade classification code]
- Compact Technology Classification: Special considerations for miniaturized high-performance devices
Regional Electromagnetic Compatibility Standards
- CE Marking Declaration: European Conformity electromagnetic compatibility self-certification
- FCC Part 15 Compliance: Federal Communications Commission unintentional radiator certification
- Industry Canada ICES: Canadian electromagnetic interference and compatibility standards
- Korea KC EMC Certification: Korean electromagnetic compatibility marking and approval
- China CCC Certification: Compulsory product certification for electromagnetic compatibility
Product Safety and Component Reliability
- UL Component Recognition: Underwriters Laboratories safety evaluation for compact applications
- CSA Component Acceptance: Canadian Standards Association safety standard compliance
- IEC 60950-1: Information technology equipment safety standard compliance
- IEC 62368-1: Audio/video/information/communication technology equipment safety
- TQG Assembly Standards: Industry standards for thin quad gate array assembly and reliability
Manufacturing and Assembly Classifications
- Electrostatic Discharge Sensitivity: ESD Class [X] per ANSI/ESDA/JEDEC JS-001
- Moisture Sensitivity Level: MSL [X] classification per JEDEC J-STD-020
- Lead-Free Assembly Process: RoHS-compliant lead-free soldering compatibility
- TQG Package Marking: Permanent marking with part number and traceability codes
- Compact Handling Procedures: Specialized procedures for space-efficient package handling
Environmental Impact and Sustainability Assessment
- Compact Life Cycle Assessment: Environmental impact evaluation for miniaturized devices
- Carbon Footprint Analysis: Manufacturing and transportation emissions for compact products
- Material Content Declaration: Substance composition reporting for compact packages
- Compact Recyclability: End-of-life material recovery for space-efficient devices
- Sustainable Compact Manufacturing: Environmental stewardship for miniaturized production
Supply Chain Ethics and Transparency
- Conflict-Free Minerals Certification: Responsible sourcing verification for compact devices
- Supplier Code of Conduct: Ethical business practices for compact manufacturing supply chain
- Labor Standards Compliance: Fair working conditions verification for miniaturized production
- Environmental Stewardship: Sustainable manufacturing for compact device production
- Corporate Social Responsibility: Community engagement for compact technology advancement
Specialized Compliance Requirements
- Defense Federal Acquisition Regulation: DFARS compliance for compact military applications
- Trade Agreements Act: TAA compliance for compact government procurement
- Committee on Foreign Investment: CFIUS national security review for advanced compact technology
- International Traffic in Arms: ITAR export control for compact defense applications
- Cybersecurity Framework: NIST cybersecurity guidelines for compact system implementation
Advanced Certification Programs
- Common Criteria Evaluation: International security evaluation for compact applications
- FIPS 140-2 Validation: Federal Information Processing Standard for compact cryptographic applications
- Automotive Standards: AEC-Q100 qualification for compact automotive applications
- Medical Device Regulations: FDA compliance for compact medical device applications
- Portable Device Standards: Enhanced qualification for mobile and portable applications
TQG-Specific Environmental Considerations
- Compact Assembly Compliance: Environmental regulations for space-efficient assembly processes
- Thermal Cycling for Compact Packages: Environmental stress testing for miniaturized reliability
- Compact EMC Validation: Electromagnetic compatibility testing for space-constrained systems
- Package Material Declaration: Environmental compliance for TQG substrate materials
- Compact Manufacturing Validation: Environmental qualification for space-efficient production
Comprehensive Support and Contact Information
Global Compact High-Performance Support Network
For specialized assistance with the XC5210-6TQG176C:
- Compact High-Speed Technical Support: [Specialized support for space-constrained high-performance applications]
- TQG Package Assembly Support: [Expert guidance for 176-pin package design and manufacturing]
- Regional Compact Solutions Engineering: [Geographic coverage with compact system expertise]
- Authorized Compact Distribution: [Worldwide distribution with TQG assembly capabilities]
Digital Resources and Online Platforms
- Compact Design Documentation Portal: Resource library focused on space-constrained applications
- Interactive Compact Design Tools: Web-based utilities for compact high-performance optimization
- Compact Design Community: Peer support and expert knowledge sharing for miniaturized systems
- Professional Compact Training: Structured learning programs and compact design certification
Specialized Compact High-Performance Services
- Priority Compact Support: Expedited response for critical compact development projects
- Custom Compact Solutions: Tailored implementation for unique space and performance requirements
- Compact Volume Manufacturing: Large-scale production planning for miniaturized applications
- Compact Lifecycle Management: Long-term support for space-constrained product families
Quality Assurance and Compact Reliability Programs
- Enhanced Compact Screening: Custom reliability testing for critical compact applications
- TQG Assembly Validation: Comprehensive testing for 176-pin package quality assurance
- Compact Thermal Testing: Performance validation across compact package thermal conditions
- Supply Chain Quality for Compact: Enhanced supplier qualification for space-efficient components
All technical specifications, assembly requirements, and commercial information subject to change without prior notice. Consult current official documentation and contact authorized representatives for definitive product information. XC5210-6TQG176C manufactured under certified quality management systems optimized for compact, high-performance applications.
