1. Product Specifications
Core Architecture Features
- Part Number: XC5210-6PQG208C
- Manufacturer: Xilinx (now AMD)
- Family: XC5200 Series FPGA
- Package Variant: PQG208C (Lead-Free Green Package)
- Technology: 0.5ฮผm three-layer metal CMOS process technology
- Speed Grade: -6 (Commercial grade, high performance)
Logic Resources
- Logic Gates: 16,000 equivalent gates
- Logic Cells: 1,296 configurable logic blocks (CLBs)
- CLB Count: 324 CLBs
- I/O Pins: 164 user I/O pins (maximum for this package)
- Total I/O Capability: Up to 244 I/O signals with VersaRing interface
Performance Specifications
- Maximum Clock Frequency: 83MHz
- Combinatorial Delay: 5.6ns maximum CLB delay
- Operating Voltage: 4.75V to 5.25V supply range
- Logic Cell Utilization: 1,296 cells for maximum design flexibility
Package Information
- Package Type: 208-PQFP (Plastic Quad Flat Pack – Lead-Free)
- Package Designation: PQG208C (Green, RoHS Compliant)
- Pin Count: 208 pins total
- Mounting Type: Surface Mount Technology (SMT)
- Package Body Material: Lead-free plastic/epoxy compound
- I/O Configuration: 164 user I/O, 44 power/ground/configuration pins
Temperature & Environmental
- Operating Temperature: 0ยฐC to +85ยฐC (TJ) – Commercial grade
- Storage Temperature: -65ยฐC to +150ยฐC
- Moisture Sensitivity: Level 3 (MSL-3)
- Peak Reflow Temperature: 260ยฐC (lead-free compatible)
Advanced Features
- Architecture: SRAM-based reprogrammable architecture with register/latch rich design
- I/O Interface: VersaRing I/O interface with programmable output slew-rate control
- Logic Module: VersaBlock logic module for enhanced design flexibility
- Hold Time: Zero flip-flop hold time for input registers
- Noise Control: Programmable output slew-rate control for noise reduction
- Interconnect: Rich hierarchy of interconnect resources
2. Pricing Information
The XC5210-6PQG208C pricing reflects its lead-free, environmentally compliant status:
Current Market Pricing (2025)
- Authorized Distributors: Contact for current pricing (typically premium over standard versions)
- Lead-Free Premium: 10-15% additional cost over leaded equivalent
- Volume Pricing: Significant discounts available for quantities >100 units
- Sample Quantities: 1-10 pieces available for prototyping
Pricing Factors
- RoHS Compliance: Lead-free status commands premium pricing
- Environmental Certification: Additional cost for green packaging
- Lifecycle Status: Legacy product with limited new production
- Market Demand: Increasing demand for RoHS-compliant alternatives
- Packaging: 208-pin package provides optimal I/O density pricing
Cost Considerations
- Design Migration: Consider upgrade path to modern FPGA families
- Long-term Availability: Limited production runs affect pricing stability
- Minimum Order Quantities: Varies by distributor (typically 25-50 pieces)
- Lead Times: 12-20 weeks for new production orders
Note: The “G” designation in PQG208C indicates lead-free, RoHS-compliant packaging, which typically adds 10-15% to the standard PQ208C version cost.
3. Documents & Media
Official Documentation
- Primary Datasheet: XC5200 Family Data Sheet (comprehensive specifications)
- Green Package Addendum: Lead-free packaging specifications and handling
- Application Notes: Environmental compliance and design guidelines
- Migration Guide: Transition from leaded to lead-free packages
Technical Resources
- Pinout Diagram: 208-pin PQFP package pinout with I/O assignments
- Package Drawings: Mechanical specifications for PCB design
- Thermal Characteristics: Junction-to-ambient thermal resistance data
- Soldering Profiles: Lead-free reflow soldering temperature profiles
Design Support Materials
- Reference Designs: Sample VHDL/Verilog implementations optimized for 164 I/O
- PCB Layout Guidelines: High-density layout recommendations for 208-pin package
- Signal Integrity: Guidelines for high-speed design with 164 I/O pins
- Power Distribution: Decoupling and power plane design recommendations
Software & Tools
- ISE Design Suite: Legacy Xilinx development environment (recommended)
- Vivado Compatibility: Limited support in newer tool versions
- Third-Party Tools: Synopsys, Cadence, Mentor Graphics synthesis support
- Simulation Models: SPICE, IBIS, and timing analysis models
Compliance Documentation
- RoHS Certificate: Lead-free compliance certification
- Material Declaration: Complete bill of materials for environmental compliance
- REACH Compliance: European chemical regulation compliance documents
- Green Package Specification: Environmental qualification test results
4. Related Resources
Development Ecosystem
- Evaluation Boards: XC5210 development kits with 208-pin socket
- Prototype Boards: High I/O count development platforms
- Reference Designs: 164 I/O utilization examples and best practices
- Design Services: Third-party design and migration services
Alternative Components
- Standard Version: XC5210-6PQ208C (leaded version, lower cost)
- Speed Variants: XC5210-5PQG208C (speed grade -5, lower performance)
- Package Alternatives: XC5210-6PQG240C (240-pin for maximum I/O)
- Modern Replacements: Current AMD Xilinx FPGA families for new designs
Application Areas
- Industrial Systems: Factory automation and control systems requiring RoHS compliance
- Medical Equipment: Healthcare devices with strict environmental regulations
- Automotive Electronics: In-vehicle systems requiring lead-free components
- Telecommunications: Network infrastructure with environmental compliance needs
- Consumer Electronics: Products destined for global markets with RoHS requirements
Design Ecosystem
- IP Cores: Compatible soft and hard IP blocks for common functions
- Board Support: High-density connector and routing solutions
- Thermal Management: Heat sink and cooling solutions for 208-pin packages
- Testing Solutions: Boundary scan and in-system programming tools
Technical Support
- Application Engineers: Xilinx/AMD field application engineers
- Design Review Services: Pre-production design validation
- Migration Assistance: Support for transitioning from leaded packages
- Compliance Consulting: Environmental regulation guidance
Training & Education
- FPGA Design Courses: Xilinx University Program resources
- Lead-Free Design: Best practices for environmental compliance
- Signal Integrity: High-speed design techniques for dense packages
- Thermal Design: Managing heat in high I/O count applications
5. Environmental & Export Classifications
Environmental Compliance Status
- RoHS Directive: Fully compliant – Restriction of Hazardous Substances
- Lead-Free Status: 100% lead-free construction (< 1000 ppm lead)
- Halogen-Free: Low halogen content meeting environmental standards
- REACH Compliance: Meets European chemical registration requirements
- WEEE Directive: Waste Electrical and Electronic Equipment compliant
Green Package Certifications
- IPC/JEDEC J-STD-020: Lead-free soldering and assembly standards
- JESD97: Transistor outline package standards for lead-free
- IEC 61249-2-21: Halogen-free base materials specification
- ISO 14001: Environmental management system certification
Material Composition
- Lead Content: < 1000 ppm (parts per million)
- Mercury: < 100 ppm
- Cadmium: < 100 ppm
- Hexavalent Chromium: < 1000 ppm
- PBB/PBDE: < 1000 ppm (flame retardants)
- Package Material: Lead-free plastic compound with copper leadframe
Export Classifications
- ECCN: 3A001.a.7 (Export Control Classification Number)
- HTS Code: 8542.39.00.01 (Harmonized Tariff Schedule)
- Schedule B: 8542.39.0001 (US export classification)
- Country of Origin: Various approved manufacturing facilities
- Export License: May require export license for certain destinations
International Standards
- China RoHS: Meets Chinese restriction of hazardous substances
- Korea RoHS: K-RoHS compliant for Korean market
- Japan RoHS: J-Moss compliant marking
- California Prop 65: Meets California environmental requirements
- CPSIA: Consumer Product Safety Improvement Act compliant
Quality & Reliability
- AEC-Q100: Not qualified (commercial grade component)
- JEDEC Standards: Meets JEDEC reliability test methods
- MSL Rating: Moisture Sensitivity Level 3 (168 hours at 30ยฐC/60% RH)
- ESD Classification: Class 1A (>1000V Human Body Model)
- Thermal Cycling: -55ยฐC to +125ยฐC, 1000 cycles minimum
Packaging & Handling
- Anti-Static Protection: Required during handling and storage
- Dry Pack: Vacuum sealed with desiccant for moisture control
- Floor Life: 168 hours at <30ยฐC/60% RH after bag opening
- Baking Requirements: 125ยฐC for 24 hours if moisture limit exceeded
- Storage Conditions: <40ยฐC/90% RH in sealed moisture barrier bag
End-of-Life Considerations
- Recyclability: Package materials are recyclable
- Disposal Guidelines: Follow local electronic waste regulations
- Material Recovery: Precious metals recovery programs available
- WEEE Symbol: European waste marking for proper disposal
- Take-Back Programs: Manufacturer recycling programs available
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