1. Product Specifications
Core Architecture Features
- Part Number: XC5210-6PC84I
- Manufacturer: Xilinx (now AMD)
- Family: XC5200 Series FPGA
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
- Speed Grade: -6 (High performance)
- Package Type: 84-Pin PLCC (Plastic Leaded Chip Carrier)
- Technology: 0.5ฮผm three-layer metal CMOS process technology
Logic Resources
- Logic Gates: 16,000 equivalent gates (maximum for XC5210 family)
- Logic Cells: 1,296 configurable logic blocks (CLBs)
- CLB Count: 324 CLBs
- I/O Pins: 50 user I/O pins (optimized for compact package)
- Total I/O Capability: Efficient I/O utilization with VersaRing interface
- Logic-to-I/O Ratio: High logic density optimized for computational applications
Performance Specifications
- Maximum Clock Frequency: 83MHz at industrial temperature range
- Combinatorial Delay: 5.6ns maximum CLB delay (at 25ยฐC)
- Operating Voltage: 4.75V to 5.25V supply range
- Logic Cell Utilization: 1,296 cells for complex industrial designs
- Temperature Derating: Performance specifications maintained across full industrial range
Compact PLCC Package Information
- Package Type: 84-Pin PLCC (Plastic Leaded Chip Carrier – Industrial)
- Package Designation: PC84I (PLCC Industrial Temperature)
- Pin Count: 84 pins total
- Package Dimensions: 29.21mm ร 29.21mm (1.15″ ร 1.15″)
- Package Height: 4.57mm (0.18″) maximum
- Pin Pitch: 1.27mm (0.05″) J-lead configuration
- Mounting Type: Surface Mount Technology (SMT)
Industrial Temperature Specifications
- Operating Temperature: -40ยฐC to +100ยฐC (TJ) – Industrial grade
- Storage Temperature: -65ยฐC to +150ยฐC
- Temperature Cycling: -55ยฐC to +125ยฐC (per JEDEC standards)
- Thermal Resistance: ฮธJA = 40ยฐC/W (typical with proper PCB design)
- Junction Temperature: 100ยฐC maximum continuous operation
Compact Package Advantages
- Space Efficiency: Smallest footprint in XC5210 family for space-critical applications
- Cost Effective: Lower cost alternative to larger packages while maintaining full logic capability
- Socket Compatible: Compatible with standard 84-pin PLCC sockets for development
- Mature Technology: Well-established package with proven reliability track record
- Easy Assembly: Standard SMT assembly processes with J-lead configuration
Advanced Features
- Architecture: SRAM-based reprogrammable architecture optimized for industrial reliability
- I/O Interface: VersaRing I/O interface with optimized pin utilization
- Logic Module: VersaBlock logic module for enhanced design flexibility in compact form
- Hold Time: Zero flip-flop hold time for input registers
- Industrial Reliability: Enhanced screening and testing for harsh environments
- Power Efficiency: Optimized power distribution in compact package
Reliability Features
- MTBF: >1 million hours at 55ยฐC operation
- ESD Protection: Class 1A (>1000V Human Body Model)
- Latch-up Immunity: >100mA (per JEDEC JESD78)
- Thermal Cycling: Enhanced package reliability for industrial temperature cycling
- Mechanical Stress: J-lead configuration provides stress relief during temperature cycling
2. Pricing Information
The XC5210-6PC84I offers industrial-grade reliability in the most cost-effective package option:
Current Market Pricing (2025)
- Industrial Premium: 30-50% premium over commercial PC84C equivalent
- Compact Package Value: Most economical option in XC5210 industrial family
- Authorized Distributors: Contact for current industrial pricing
- Volume Pricing: Significant discounts for quantities >25 units
- Sample Quantities: 1-10 pieces available for prototyping
- Market Range: $3.44 – $17.19 per unit (varies by distributor and quantity)
Pricing Factors
- Industrial Qualification: Extended temperature testing adds moderate premium
- Compact Package: Lower assembly costs compared to larger packages
- High Volume Production: More common package reduces per-unit costs
- Socket Compatibility: Development-friendly for prototyping applications
- Legacy Support: Established product with stable pricing
Cost Analysis
- Temperature Premium: 30-50% above commercial XC5210-6PC84C
- Package Efficiency: Lowest cost per gate in XC5210 industrial family
- Development Costs: Socket compatibility reduces development board costs
- Assembly Costs: Standard SMT processes minimize assembly premiums
- Total Cost of Ownership: Compact size reduces PCB area requirements
Value Proposition
- Space Savings: Smallest footprint enables compact product designs
- Cost Effectiveness: Maximum logic capability at minimum package cost
- Industrial Reliability: Extended temperature operation with proven reliability
- Design Flexibility: Socket compatibility enables rapid prototyping
- Legacy Migration: Drop-in replacement for existing PLCC FPGA designs
Market Positioning
- Cost-Sensitive Industrial: Applications requiring industrial reliability at lower cost
- Space-Constrained Designs: Compact products with size limitations
- Legacy System Upgrades: Retrofitting existing PLCC-based designs
- Development Platforms: Prototyping systems requiring socketed solutions
- High-Volume Applications: Industrial products with aggressive cost targets
Note: The PC84I offers the best cost-performance ratio in the XC5210 industrial family, providing full logic capability in the most economical package.
3. Documents & Media
Official Documentation
- Industrial Datasheet: XC5200 Family Industrial Temperature Specifications for PLCC packages
- PLCC Package Specification: Mechanical and thermal characteristics for PC84I package
- Reliability Report: Industrial qualification test results and MTBF data
- Application Notes: Compact package design guidelines and thermal management
Technical Resources
- Pinout Diagram: 84-pin PLCC pinout with optimized I/O assignment
- Package Drawings: Detailed mechanical specifications for PCB layout
- Thermal Design Guide: Heat dissipation strategies for compact packages
- Socket Compatibility: Compatible socket types and development board options
Compact Package Design Support
- PCB Layout Guidelines: High-density layout techniques for PLCC packages
- Signal Integrity: Design practices for 50 I/O pins in compact form factor
- Power Distribution: Optimized power and ground strategies for PC84 package
- Thermal Management: Heat dissipation in space-constrained applications
Software & Tools
- ISE Design Suite: Full industrial temperature simulation and constraint files
- Package Models: SPICE and thermal models for PC84I package
- Socket Design Tools: Development board and prototype design resources
- Constraint Files: Pin assignment and timing constraint templates
Industrial Design Documentation
- Temperature Characterization: Performance verification across -40ยฐC to +100ยฐC
- Industrial Standards: Compliance documentation for industrial automation
- Environmental Testing: Temperature cycling and thermal shock results
- Quality Certifications: Industrial-grade manufacturing and testing procedures
Socket and Development Resources
- Socket Specifications: Compatible 84-pin PLCC socket recommendations
- Development Boards: Reference designs and evaluation platforms
- Programming Adapters: In-system programming solutions for socketed applications
- Prototyping Guides: Rapid development techniques using PLCC sockets
4. Related Resources
Development Ecosystem
- PLCC Sockets: High-quality 84-pin sockets for development and prototyping
- Development Boards: Compact development platforms with PC84 socket
- Programming Solutions: In-system programming cables and adapters
- Thermal Test Platforms: Temperature characterization boards for validation
Alternative Components
- Commercial Version: XC5210-6PC84C (0ยฐC to +85ยฐC, lower cost)
- Higher I/O Count: XC5210-6PQ208I (208-pin industrial with 164 I/O)
- Ceramic Option: XC5210-6PG223I (ceramic package for highest reliability)
- Modern Replacements: Current AMD Xilinx Spartan industrial FPGAs
Compact Industrial Application Areas
- Factory Automation: Compact control modules and sensor interfaces
- Transportation: Automotive electronics and railway control systems
- Test Equipment: Portable test instruments and measurement devices
- Medical Devices: Compact medical equipment with industrial reliability
- Process Control: Small form factor industrial control systems
- Embedded Systems: Space-constrained industrial embedded applications
Design Ecosystem
- Compact IP Cores: Optimized IP for 50 I/O pin applications
- Thermal Solutions: Heat sinks and thermal management for compact packages
- Socket Systems: Development and production socket solutions
- Testing Equipment: Compact test fixtures and programming solutions
Technical Support
- Compact Design Consulting: Specialized support for space-constrained applications
- Thermal Design Services: Heat management in compact industrial systems
- Socket Selection Support: Compatible socket and development board recommendations
- Industrial Standards Guidance: Compliance with industrial automation requirements
Training & Certification
- Compact FPGA Design: Design techniques for space-constrained applications
- Industrial Reliability: Design practices for harsh environment applications
- Thermal Management: Heat dissipation in compact electronic systems
- PLCC Assembly: Best practices for PLCC package assembly and rework
Supply Chain Support
- Socket Suppliers: Qualified PLCC socket manufacturers and distributors
- Development Tools: Evaluation boards and programming adapter suppliers
- Long-term Availability: Extended lifecycle support for industrial applications
- Counterfeit Protection: Authenticated supply chains for industrial components
5. Environmental & Export Classifications
Industrial Environmental Compliance
- Operating Environment: Harsh industrial environments with temperature extremes
- Compact Durability: PLCC package designed for industrial mechanical stress
- Humidity Resistance: 95% RH non-condensing across temperature range
- Vibration Resistance: Enhanced package reliability for mobile industrial applications
- Chemical Resistance: Industrial solvent and cleaning agent compatibility
Industrial Standards Compliance
- IEC 61131: Industrial automation and control systems standard
- ISO 13849: Safety of machinery – Safety-related parts of control systems
- IEC 61508: Functional safety of electrical/electronic systems (up to SIL 2)
- UL 991: Environmental and safety standards for industrial control equipment
- CSA C22.2: Canadian electrical safety standards for industrial equipment
Material Composition & RoHS
- RoHS Status: Contains lead (not RoHS compliant) – typical for industrial-grade components
- PLCC Package Materials: Plastic molding compound with copper leadframe
- Industrial Exemptions: Lead exemption applies under industrial equipment categories
- Material Declaration: Full bill of materials available for industrial customers
- Conflict Minerals: Xilinx conflict minerals reporting compliance
Export Classifications
- ECCN: 3A001.a.7 (Export Control Classification Number)
- HTS Code: 8542.39.00.01 (Harmonized Tariff Schedule)
- Industrial Classification: Dual-use technology for industrial automation
- Export License: May require export license for certain end-use applications
- Country of Origin: Various approved industrial manufacturing facilities
Quality & Manufacturing Standards
- ISO 9001: Quality management system certification
- Industrial Screening: Enhanced testing beyond commercial grade requirements
- PLCC Assembly: Qualified assembly processes for industrial reliability
- Traceability: Full lot traceability for industrial quality requirements
- Certificate of Compliance: Industrial grade compliance certificates available
Reliability & Testing Standards
- JEDEC Standards: Full compliance with industrial semiconductor standards
- Temperature Cycling: JEDEC JESD22-A104 temperature cycling qualification
- Thermal Shock: JEDEC JESD22-A106 thermal shock testing
- Mechanical Testing: PLCC package mechanical stress testing
- Highly Accelerated Life Testing: JEDEC JESD22-A108 HALT procedures
PLCC Package Environmental Standards
- Moisture Sensitivity: Level 3 with standard industrial floor life
- Soldering Compatibility: Standard reflow soldering profiles
- Rework Capability: PLCC packages support standard rework procedures
- Cleaning Compatibility: Compatible with industrial cleaning solvents
- Storage Requirements: Standard semiconductor storage conditions
Industrial Safety Classifications
- Electrical Safety: UL 991, CSA C22.2 electrical safety compliance
- Functional Safety: SIL 2 capable with proper system design
- Hazardous Location: Not rated for explosive atmospheres (requires external protection)
- EMC Compliance: Industrial EMC standards per IEC 61000 series
- ESD Classification: Class 1A industrial ESD protection
Packaging & Handling
- Industrial Packaging: Anti-static packaging suitable for industrial environments
- PLCC Handling: Standard procedures for J-lead package handling
- Socket Installation: Proper insertion and removal techniques for development
- Shelf Life: Extended shelf life specifications for industrial inventory management
- Temperature Storage: -65ยฐC to +150ยฐC storage range for warehouse environments
End-of-Life & Recycling
- Industrial Recycling: Electronic waste management for industrial equipment
- Material Recovery: Plastic and metal recovery programs for industrial volumes
- PLCC Recycling: Specialized procedures for leaded chip carrier packages
- Disposal Guidelines: Industrial waste disposal regulations compliance
- Environmental Impact: Life cycle assessment data for compact industrial applications
Socket Compatibility Standards
- JEDEC Standards: PLCC socket compatibility per JEDEC specifications
- Socket Reliability: Industrial-grade socket specifications and testing
- Insertion Cycles: Rated for development and limited production cycles
- Contact Resistance: Low resistance contacts for reliable connections
- Mechanical Durability: Socket mechanical specifications for industrial use
Regional Certifications
- Industrial Automation: Pre-approved for industrial control system integration
- Transportation: Automotive and railway industry approvals (where applicable)
- Process Industries: Chemical and petrochemical industry compatibility
- International Standards: Compliance with major international industrial standards
- Regional Variations: Specific certifications for different geographic markets
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