1. Product Specifications
Core Features
- Family: Xilinx XC5200 FPGA Series
- Part Number: XC5206-6PQG208I
- Logic Capacity: 10K Gates / 784 Logic Cells (196 CLBs)
- Operating Frequency: 83MHz maximum system clock
- Process Technology: 0.5ฮผm three-layer metal CMOS
- Supply Voltage: 5V operation (4.75V – 5.25V)
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
Package Information
- Package Type: 208-Pin PQFP (Plastic Quad Flat Pack)
- Package Designation: PQG208I form factor
- I/O Count: Up to 148 I/O pins
- Pin Count: 208 pins total
- Mounting Type: Surface Mount Technology (SMT)
- Pin Pitch: 0.5mm lead spacing
Architecture Highlights
- VersaBlock Logic Module: Advanced configurable logic architecture
- VersaRing I/O Interface: High-performance I/O structure with up to 244 I/O signals
- SRAM-Based Configuration: Reprogrammable architecture with register/latch rich design
- Configurable Logic Blocks: 196 CLBs for complex digital logic implementation
- Programmable Interconnect: Rich hierarchy of routing resources for design flexibility
Performance Specifications
- Speed Grade: -6 (High-performance industrial grade)
- Maximum Operating Frequency: 83MHz system performance
- Logic Cells: 784 configurable logic elements
- Gate Equivalent: 10,000 system gates
- Technology Node: 0.5ฮผm CMOS process technology
- Operating Temperature: -40ยฐC to +100ยฐC (Industrial grade)
Electrical Characteristics
- Operating Voltage: 5V ยฑ5% (4.75V – 5.25V)
- Power Consumption: Optimized low-power CMOS design
- I/O Standards: TTL/CMOS compatible with 5V tolerance
- Input/Output Features: Programmable output slew-rate control for EMI reduction
- Timing: Zero Flip-Flop hold time for simplified system timing design
Advanced Features
- Industrial Temperature Range: Extended operating temperature for harsh environments
- Noise Immunity: Enhanced noise tolerance for industrial applications
- Signal Integrity: Optimized for high-speed digital signal processing
- Design Flexibility: Support for complex state machines and data path functions
- Reliability: Industrial-grade qualification for mission-critical applications
2. Pricing Information
Current Market Pricing
Based on current distributor data and market analysis:
- New Original Stock: Available with 1,370+ pieces in inventory
- Industrial Grade Premium: Higher pricing due to extended temperature range
- Volume Pricing: Competitive rates for bulk orders (contact distributors)
- Market Availability: Available through authorized Xilinx distributors worldwide
Pricing Structure
- Small Quantities (1-10): Premium pricing for industrial grade
- Medium Quantities (10-100): Volume discounts available
- Large Quantities (100+): Significant savings for production volumes
- Custom Packaging: Available for specialized applications
- Lead Time: Contact authorized distributors for current delivery schedules
Cost Considerations
- Industrial temperature grade commands premium over commercial variants
- Legacy product status may affect long-term availability
- Alternative sourcing through authorized surplus dealers
- Consider migration to newer FPGA families for new designs
- Extended temperature testing and qualification costs
Note: This product is marked as “NOT RECOMMENDED for NEW DESIGN” by Xilinx. Consider newer FPGA families for new projects while maintaining support for existing designs.
3. Documents & Media
Technical Documentation
- Datasheet: Complete XC5206-6PQG208I specifications and electrical characteristics
- User Manual: XC5200 Family comprehensive design and implementation guide
- Application Notes: Industrial design best practices and thermal considerations
- Pin Configuration: Detailed 208-pin pinout diagrams and signal descriptions
- Timing Analysis: Setup, hold, and propagation delay specifications at industrial temperatures
Design Resources
- Development Tools: Compatible with Xilinx ISE Design Suite (legacy support)
- HDL Support: Complete VHDL, Verilog HDL, and ABEL design entry support
- Synthesis Tools: Integration with major logic synthesis environments
- Simulation Models: Industrial-grade timing models and SPICE simulations
- Reference Designs: Industrial application examples and implementations
CAD Resources
- PCB Footprints: EDA/CAD symbols and land pattern libraries for 208-pin PQFP
- 3D Models: Mechanical drawings and detailed package models
- Thermal Design: Heat dissipation guidelines for industrial applications
- Package Specifications: Mechanical dimensions and tolerance specifications
Industrial Design Guidelines
- Thermal Management: Heat sink recommendations and thermal analysis
- Power Distribution: Industrial power supply design considerations
- EMC Compliance: Electromagnetic compatibility design guidelines
- Reliability Testing: Industrial qualification and stress testing procedures
4. Related Resources
Development Tools and Software
- Xilinx ISE Design Suite: Legacy development environment with industrial support
- Foundation Software: Entry-level tools for basic industrial implementations
- Alliance Series: Professional development tools for complex industrial designs
- Third-Party Tools: Compatibility with industrial-grade EDA platforms
Compatible Products and Migration Paths
- XC5200 Family: Commercial and automotive grade variants available
- Package Alternatives: Different pin counts within the same family
- Migration Options: Newer FPGA families for design updates and improvements
- Pin-Compatible Devices: Alternative sourcing options for existing designs
Technical Support Resources
- Industrial Design Services: Expert consultation for harsh environment applications
- Application Engineering: Specialized support for industrial implementations
- Reliability Engineering: Long-term support and obsolescence management
- Community Resources: Industrial user forums and knowledge sharing
Application Areas
- Industrial Control: Factory automation, process control, and machinery
- Automotive Systems: Engine control units, safety systems, and dashboard applications
- Harsh Environment: Military, aerospace, and oil & gas applications
- Telecommunications: Base station equipment and network infrastructure
- Medical Equipment: Diagnostic equipment and patient monitoring systems
Industrial Ecosystem
- Evaluation Platforms: Industrial-grade development and test boards
- Programming Solutions: Industrial programming and configuration tools
- IP Cores: Industrial-qualified intellectual property blocks
- System Integration: Complete industrial system design examples
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS non-compliant (legacy industrial product)
- Lead Content: Contains lead-based materials (pre-RoHS technology)
- Material Composition: Industrial-grade semiconductor materials and packaging
- Recycling: Compliant with electronic waste disposal regulations
Operating Environment
- Operating Temperature: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing relative humidity
- Altitude: Up to 3000m above sea level operation
- Shock and Vibration: Enhanced specifications for industrial applications
Export Classifications
- Export Control: Subject to U.S. export administration regulations (EAR)
- ECCN Classification: Industrial semiconductor technology classification
- Country of Origin: Manufactured under Xilinx industrial quality standards
- Trade Compliance: Industrial application export documentation
- Licensing Requirements: May require export licenses for sensitive applications
Quality and Reliability Standards
- Quality Standards: ISO 9001 quality management system compliance
- Reliability Testing: Extended qualification per JEDEC industrial standards
- Product Status: Legacy/Obsolete – industrial support maintained
- MTBF Rating: Mean Time Between Failure specifications for industrial use
- Warranty: Extended warranty terms for industrial applications
Industrial Packaging and Handling
- ESD Sensitivity: Class 1A electrostatic discharge sensitive device
- Moisture Sensitivity: Level 3 per IPC/JEDEC J-STD-020D
- Package Marking: Laser-marked industrial grade identification
- Handling Precautions: Industrial ESD handling and storage procedures
- Tray Packaging: Anti-static tray packaging for automated assembly
Regulatory Certifications
- Safety Standards: UL, CSA, and international industrial safety compliance
- EMC Compliance: Industrial electromagnetic compatibility certification
- FCC Part 15: Class A industrial equipment compliance
- International Standards: CE marking and industrial application certifications
Thermal Characteristics
- Thermal Resistance: Junction-to-case and junction-to-ambient specifications
- Power Dissipation: Maximum power ratings at industrial temperatures
- Thermal Design: Heat sink requirements and thermal interface materials
- Temperature Cycling: Industrial qualification temperature cycling specifications
Keywords: XC5206-6PQG208I, Xilinx FPGA, XC5200 family, industrial FPGA, field programmable gate array, 208-pin PQFP, 10K gates, 784 logic cells, industrial temperature, harsh environment, automotive FPGA, programmable logic, -40ยฐC to +100ยฐC operation
This product description is based on publicly available technical specifications and market data. The XC5206-6PQG208I is marked as “NOT RECOMMENDED for NEW DESIGN” by Xilinx. For new projects, consider current FPGA families. For existing designs and legacy support, consult authorized distributors for availability and technical documentation.
