Product Specifications
Core Features
- Part Number: XC5206-3PQ160C
- Device Series: XC5200 Commercial Grade FPGA
- Logic Density: 6,000 equivalent system gates
- Speed Grade: -3 (economy performance grade)
- Package Type: PQ160 (160-pin Plastic Quad Flat Pack)
- Operating Temperature: Commercial range (0ยฐC to +70ยฐC)
Technical Architecture Details
- Configuration Technology: SRAM-based volatile programmable logic
- Logic Block Count: 196 Configurable Logic Blocks (CLBs)
- CLB Architecture: 4-input lookup tables with dedicated flip-flops
- User I/O Pins: 120 bidirectional programmable I/O pins
- Internal Memory: Distributed SelectRAM capability within CLBs
- Clock Distribution: Four dedicated global clock networks
- Configuration Storage: Volatile SRAM configuration memory
- Power Supply Requirements: Single 5.0V ยฑ10% rail
- Typical Propagation Delay: 12ns for -3 speed grade
- Maximum System Frequency: 30 MHz sustained operation
- Static Power Consumption: 200mW typical (no switching activity)
Package Physical Specifications
- Package Style: PQFP (Plastic Quad Flat Pack)
- Total Pin Count: 160 pins
- Package Footprint: 28mm x 28mm square body
- Package Height: 3.4mm maximum profile
- Lead Pitch: 0.65mm (25.6 mil) spacing
- Lead Width: 0.22mm nominal
- Thermal Characteristics: 25ยฐC/W junction-to-ambient thermal resistance
Price Information
XC5206-3PQ160C offers the most economical pricing in the XC5206 family:
- Engineering Samples (1-4 units): Available for evaluation through distributors
- Development Quantities (5-24 units): Competitive prototype pricing
- Low Volume Production (25-99 units): First commercial price break
- Medium Volume (100-499 units): Enhanced volume discounts
- High Volume Production (500-1999 units): Substantial cost reductions
- Mass Production (2000+ units): Lowest cost tier with annual agreements
- Educational Institutions: Special academic pricing and sample programs
- Long-term Contracts: Custom pricing for multi-year commitments
The -3 speed grade represents the most cost-effective option in the XC5206 portfolio, optimized for applications prioritizing low cost over maximum performance. Pricing varies with market conditions and silicon availability.
Documents & Media
Core Technical Documentation
- Master Datasheet: XC5200 Series FPGA Comprehensive Specifications (DS015)
- Configuration Manual: XC5200 Programming and Bitstream Generation Guide
- Package Documentation: PQ160 Mechanical Specifications and PCB Layout Guidelines
- Electrical Specifications: DC characteristics, AC timing parameters, and power analysis
Design Implementation Resources
- Application Notes Collection:
- XAPP045: XC5200 Timing Optimization and Performance Tuning
- XAPP041: PQ160 Package PCB Design and Thermal Management
- XAPP052: Power Supply Design and Decoupling for XC5200 FPGAs
- XAPP067: Implementing JTAG Boundary Scan in XC5200 Devices
- XAPP085: Cost Optimization Techniques for Commercial FPGA Designs
- Design Methodology Guide: XC5200 Architecture Overview and Implementation Flow
- Migration Documentation: Design porting from XC4000 and competitive devices
Software Development Support
- CAD Tool Compatibility: Xilinx Foundation Series and Alliance development environments
- Simulation Libraries: Complete VHDL and Verilog device models
- Synthesis Support: Optimized libraries for major synthesis tools
- Constraint Templates: User Constraint File (UCF) examples and timing guidelines
- Programming Utilities: iMPACT configuration software and cable drivers
Quality Assurance Documentation
- Reliability Data: Commercial qualification test results and failure analysis
- Package Qualification: Environmental stress testing and long-term reliability
- Application Guidelines: Best practices for commercial environment deployment
- Errata Documentation: Known device limitations and recommended workarounds
Related Resources
Development Infrastructure
- XC5206-3PQ160C Development Kit: Complete evaluation platform with example designs
- Programming Hardware: Xilinx Parallel Cable IV and compatible JTAG programmers
- Design Software: Xilinx ISE Foundation Suite with device-specific optimization
- Debug Tools: ChipScope Pro embedded logic analyzer for system verification
- Simulation Platform: ModelSim integration and behavioral simulation support
Complementary Component Solutions
- Configuration Memory: XC1700L series low-cost serial configuration PROMs
- Power Management: Cost-effective 5V switching regulators and LDO solutions
- Clock Sources: Low-cost crystal oscillators and ceramic resonator modules
- Interface Devices: Standard logic level shifters and bus interface components
- Passive Components: Recommended decoupling capacitors and EMI filtering solutions
Primary Application Markets
- Consumer Electronics: Set-top boxes, gaming accessories, and home automation
- Industrial Control: Basic automation, sensor interfaces, and motor control
- Communication Equipment: Simple protocol conversion and data buffering
- Educational Systems: University laboratory equipment and student projects
- Test Instrumentation: Basic pattern generation and response measurement
- Prototype Development: Early-stage ASIC emulation and concept validation
Design Support Ecosystem
- Technical Support: Xilinx applications engineering and online knowledge base
- Training Resources: FPGA fundamentals courses and XC5200-specific tutorials
- Design Services: Network of qualified third-party implementation partners
- IP Portfolio: Cost-effective soft processor cores and peripheral controllers
- Community Support: User forums, design contests, and technical conferences
Environmental & Export Classifications
Environmental Regulatory Compliance
- RoHS Directive: Lead-free variants available meeting EU Directive 2011/65/EU
- WEEE Directive: Compliant design for end-of-life recycling requirements
- REACH Compliance: Full adherence to European chemical safety regulations
- California Proposition 65: Compliant materials and packaging
- China RoHS: Meets Chinese restriction of hazardous substances requirements
- Halogen-Free Options: Available for applications requiring halogen-free materials
Commercial Operating Environment
- Ambient Temperature Range: 0ยฐC to +70ยฐC continuous operation
- Junction Temperature Limits: +125ยฐC maximum die temperature
- Storage Temperature: -65ยฐC to +150ยฐC non-operating storage
- Humidity Tolerance: 5% to 95% relative humidity (non-condensing)
- Altitude Operation: Sea level to 2000 meters without derating
- Vibration Resistance: 2G acceleration per commercial standards
Quality and Reliability Metrics
- Manufacturing Standards: ISO 9001:2015 certified production facilities
- Device Qualification: JEDEC solid state reliability standards compliance
- Package Reliability Testing:
- Temperature cycling: 1000 cycles (-65ยฐC to +150ยฐC)
- Thermal shock resistance: 100 cycles rapid temperature transition
- Humidity exposure: 1000 hours at 85ยฐC/85% relative humidity
- Mechanical shock: Drop test and vibration qualification
- Electrostatic Discharge: Class 1C (>1000V) ESD protection rating
- Device Lifetime: >100,000 hours MTBF at 55ยฐC junction temperature
International Trade Classifications
- Export Control Classification Number: ECCN 3A001.a.2.a (Export Administration Regulations)
- Harmonized Tariff Schedule: HTS 8542.31.0001 for integrated circuits
- Country of Origin: Manufacturing location identified on device marking
- Export License Requirements: Generally eligible for license exception NLR
- Dual-Use Technology: Subject to Department of Commerce export controls
Supply Chain Security and Ethics
- Conflict Minerals Compliance: SEC Rule 13p-1 compliant sourcing practices
- Supplier Code of Conduct: Verified ethical manufacturing practices
- Anti-Counterfeiting Program: Authorized distribution channels only
- Product Authenticity: Serialized tracking and tamper-evident packaging
- Social Responsibility: Fair labor practices and environmental stewardship
Material Handling and Storage
- Moisture Sensitivity Level: MSL-3 per JEDEC J-STD-020D standard
- Dry Pack Requirements: Sealed moisture barrier bags with desiccant
- Shelf Life: 12 months in unopened dry pack at <30ยฐC/85% RH
- Floor Life: 168 hours maximum exposure after bag opening
- Bake-out Recovery: 125ยฐC for 24 hours if moisture limits exceeded
- ESD Protection Category: Class 1C electrostatic discharge sensitive
Packaging and Distribution Options
- Standard Packaging: Anti-static tubes for prototype and small volume orders
- Volume Packaging: Tape and reel (13-inch reels) for automated assembly
- Custom Packaging: Special requirements accommodated for large orders
- Global Distribution: Available through worldwide authorized distributor network
- Lead Time: Typically 6-8 weeks for standard commercial orders
- Inventory Management: Consignment and vendor-managed inventory programs available
Environmental Impact and Sustainability
- Carbon Footprint: Manufacturing process optimization for reduced emissions
- Recyclable Materials: Package design facilitates end-of-life material recovery
- Energy Efficiency: Low power consumption reduces operational environmental impact
- Sustainable Packaging: Minimal packaging using recyclable materials
- Green Logistics: Optimized shipping methods to reduce transportation impact
The XC5206-3PQ160C delivers exceptional value for commercial applications requiring reliable programmable logic at the lowest possible cost. Its proven architecture, extensive I/O capability, and economy speed grade make it the optimal choice for cost-sensitive designs and high-volume production.
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