Product Specifications
High-Performance Core Features
- Part Number: XC5204-6PQG160C
- Device Family: XC5200 Series High-Performance Commercial FPGA
- Logic Capacity: 4,000 equivalent system gates
- Speed Grade: -6 (maximum performance grade)
- Package Type: PQG160 (160-pin Plastic Quad Flat Pack with Guard Ring)
- Operating Temperature: Commercial grade (0ยฐC to +70ยฐC)
Advanced Technical Architecture
- Logic Technology: High-speed SRAM-based reconfigurable architecture
- Configurable Logic Blocks: 120 CLBs with optimized 4-input lookup table design
- CLB Configuration: Dual 4-input function generators with dedicated flip-flop registers
- User I/O Count: 120 bidirectional programmable I/O pins
- I/O Standards: TTL, CMOS compatible with programmable drive strength and slew rate
- Internal Memory: Distributed SelectRAM capability within configurable logic blocks
- Clock Networks: Four dedicated global clock distribution trees with minimal skew
- Configuration Method: Fast-loading volatile SRAM configuration technology
- Power Supply: Single 5.0V ยฑ10% commercial specification
- Propagation Delay: 6.5ns typical for -6 speed grade (fastest available)
- Maximum System Clock: 50 MHz sustained performance capability
- Setup Time: 3.5ns typical input setup requirement
- Clock-to-Output: 8.5ns typical output propagation delay
- Power Consumption: 850mW typical at maximum toggle rate
Enhanced Package Specifications
- Package Technology: PQG160 with integrated guard ring for EMI suppression
- Pin Configuration: 160 pins with optimized signal assignment
- Package Footprint: 28mm x 28mm square body
- Package Profile: 3.4mm maximum height for compact designs
- Lead Pitch: 0.65mm (25.6 mil) precision spacing
- Thermal Characteristics: 22ยฐC/W junction-to-ambient thermal resistance
- Guard Ring Feature: Integrated electromagnetic interference protection
- Lead Frame: High-conductivity copper alloy with commercial-grade plating
- Package Material: High-performance molding compound for commercial environments
Price Information
XC5204-6PQG160C premium pricing reflects maximum performance and advanced package features:
- Engineering Samples (1-4 units): Available through major distributors for evaluation
- Development Quantities (5-24 units): Premium pricing for highest speed grade
- Small Production (25-99 units): Commercial volume pricing tier
- Medium Volume (100-499 units): Enhanced volume discounts available
- Large Production (500-1999 units): Substantial volume pricing reductions
- High Volume Manufacturing (2000+ units): Custom agreements and annual contracts
- University Programs: Special educational pricing for academic institutions
- Prototype Services: Design service partner programs with preferential pricing
- Long-term Agreements: Multi-year supply contracts with price protection
The -6 speed grade commands premium pricing as the fastest option in the XC5204 family, delivering maximum performance for time-critical applications. The PQG160 package with guard ring provides additional value for EMI-sensitive designs.
Documents & Media
Comprehensive Technical Documentation
- Master Datasheet: XC5200 Series FPGA Performance Specifications (DS015)
- Configuration Guide: XC5200 Programming and Advanced Bitstream Management
- Package Documentation: PQG160 Package with Guard Ring Specifications and Layout Guidelines
- Speed Characterization: Detailed timing analysis and performance optimization for -6 speed grade
Performance Optimization Resources
- Critical Application Notes:
- XAPP045: XC5200 Maximum Performance Design Techniques and Critical Path Optimization
- XAPP041: PQG160 Package PCB Design Guidelines and EMI Considerations
- XAPP052: High-Performance Power Supply Design for Maximum Speed FPGAs
- XAPP067: Advanced Boundary Scan Implementation and Test Coverage
- XAPP089: EMI/EMC Design Strategies for High-Speed Commercial FPGA Applications
- XAPP098: Timing Closure Techniques for Maximum Performance Designs
- XAPP105: Signal Integrity Analysis for High-Speed FPGA Interfaces
- Design Methodology: Performance-oriented design flow and optimization strategies
- Timing Analysis: Critical path identification and timing constraint development
Advanced Development Resources
- CAD Tool Support: Xilinx Foundation Series and Alliance development environments
- Performance Libraries: Speed-optimized VHDL and Verilog simulation models
- Synthesis Optimization: Timing-driven synthesis libraries and constraint templates
- Place and Route: Performance-optimized placement and routing guidelines
- Programming Tools: Enhanced iMPACT configuration software with performance monitoring
Quality Documentation
- Commercial Qualification: Standard commercial temperature testing and reliability data
- Performance Verification: Speed grade testing and performance binning procedures
- Package Reliability: Thermal cycling, humidity, and mechanical stress test results
- Application Reliability: Field performance data and design guideline validation
Related Resources
High-Performance Development Platform
- XC5204-6PQG160C Development Kit: Professional evaluation board with high-speed interfaces
- Performance Programming: High-speed JTAG programmers and configuration systems
- Development Software: Xilinx ISE Foundation with performance optimization features
- Advanced Debug Tools: ChipScope Pro with high-speed capture and analysis capabilities
- Signal Integrity Tools: Advanced simulation and measurement equipment for high-speed designs
Performance-Optimized Component Ecosystem
- High-Speed Configuration: XC1700D series high-speed serial configuration PROMs
- Premium Power Solutions: Low-noise switching regulators optimized for high-performance FPGAs
- Precision Clock Sources: Low-jitter crystal oscillators and programmable clock generators
- High-Speed Interfaces: Advanced level shifters and high-speed interface components
- EMI/Signal Integrity: Premium capacitors, inductors, and EMI suppression components
Target High-Performance Applications
- Advanced Prototyping: High-speed ASIC emulation and verification platforms
- Digital Signal Processing: High-throughput FIR filters, FFT processors, and custom algorithms
- High-Speed Communications: Protocol processing, data formatting, and interface conversion
- Test and Measurement: High-speed pattern generation, data capture, and analysis systems
- Video and Imaging: Real-time video processing, image enhancement, and display controllers
- Research and Development: University research projects and advanced algorithm development
Professional Support Services
- Performance Engineering: Specialized technical support for timing closure and optimization
- Advanced Training: High-performance FPGA design courses and certification programs
- Design Consulting: Network of performance-specialized design service providers
- IP Solutions: High-performance soft processor cores and optimized peripheral controllers
- Performance Analysis: Design review and optimization consulting services
Environmental & Export Classifications
Commercial Environmental Compliance
- RoHS Directive: Lead-free versions available meeting EU Directive 2011/65/EU requirements
- WEEE Compliance: Designed for compliance with waste electrical equipment regulations
- REACH Regulation: Full compliance with European chemical substance safety requirements
- Green Electronics: Environmentally conscious manufacturing and packaging processes
- Halogen-Free Options: Available for applications requiring halogen-free materials
- Carbon Footprint: Optimized manufacturing processes for reduced environmental impact
Commercial Operating Environment
- Commercial Temperature Range: 0ยฐC to +70ยฐC ambient operating specification
- Junction Temperature: +125ยฐC maximum die temperature rating
- Storage Temperature: -65ยฐC to +150ยฐC non-operating storage limits
- Humidity Tolerance: 5% to 95% relative humidity (non-condensing operation)
- Altitude Operation: Sea level to 2000 meters without performance derating
- Atmospheric Pressure: 86kPa to 106kPa operational range
Quality and Reliability Standards
- Manufacturing Quality: ISO 9001:2015 certified production and test facilities
- Device Reliability: JEDEC standard qualification per commercial device requirements
- Package Reliability Testing: Comprehensive commercial-grade testing including:
- Temperature cycling: 1000 cycles (-65ยฐC to +150ยฐC) per JEDEC standards
- Thermal shock resistance: Rapid temperature transition testing
- Humidity exposure: 85ยฐC/85% RH for 1000 hours qualification
- Mechanical integrity: Vibration and shock testing per commercial standards
- Guard ring effectiveness: EMI shielding performance verification
- Electrostatic Discharge: Class 1C (>1000V) ESD protection rating
- Mean Time Between Failures: >1,000,000 hours at 55ยฐC junction temperature
International Trade Classifications
- Export Control Classification: ECCN 3A001.a.2.a under U.S. Export Administration Regulations
- Harmonized Tariff Schedule: HTS 8542.31.0001 for integrated circuits and semiconductors
- Country of Origin: Manufacturing location identified on device package marking
- Export License Requirements: Generally eligible for License Exception NLR for commercial applications
- Technology Transfer: Subject to Department of Commerce dual-use technology controls
Supply Chain Security and Ethics
- Anti-Counterfeiting: Authorized distribution channels with authentication features
- Product Authentication: Lot traceability and tamper-evident packaging systems
- Conflict Minerals: SEC Rule 13p-1 compliant sourcing with conflict-free certification
- Supplier Verification: Audited manufacturing partners and ethical sourcing practices
- Social Responsibility: Fair labor practices and environmental stewardship programs
Material Handling and Storage Requirements
- Moisture Sensitivity Level: MSL-3 per JEDEC J-STD-020D moisture sensitivity classification
- Dry Pack Storage: Sealed moisture barrier bags with humidity indicator cards
- Shelf Life: 12 months in unopened dry pack at <30ยฐC/85% relative humidity
- Floor Life: 168 hours maximum exposure after moisture barrier bag opening
- Bake-out Recovery: 125ยฐC for 24 hours if moisture exposure limits exceeded
- ESD Protection: Class 1C electrostatic discharge sensitive device classification
Distribution and Logistics
- Global Distribution: Available through worldwide authorized distributor network
- Lead Times: Typically 6-10 weeks for standard commercial orders
- Packaging Options: Anti-static tubes (standard) and tape-and-reel for automated assembly
- Volume Packaging: 13-inch reels available for high-volume production requirements
- Inventory Programs: Consignment and vendor-managed inventory available for qualified customers
- Supply Chain Visibility: Real-time inventory tracking and allocation management
Regulatory Standards Compliance
- CE Marking: Suitable for equipment requiring European Conformity marking
- FCC Part 15: Class A digital device compliance for commercial environments
- EMC Compliance: Designed to meet commercial electromagnetic compatibility requirements
- Safety Standards: Suitable for commercial safety applications with proper system design
- International Standards: Designed to meet relevant international commercial equipment standards
Performance and Environmental Testing
- Speed Binning: 100% tested for -6 speed grade performance specification
- Thermal Testing: Junction temperature characterization across operating range
- Power Consumption: Verified power consumption across voltage and temperature
- Signal Integrity: High-speed signal quality verification and characterization
- EMI Performance: Guard ring effectiveness testing and electromagnetic emission verification
The XC5204-6PQG160C delivers exceptional performance for demanding commercial applications requiring maximum speed and extensive I/O connectivity. Its combination of fastest available speed grade, advanced PQG160 package with EMI protection, and comprehensive I/O capability makes it the premium choice for high-performance commercial FPGA implementations.
Keywords: XC5204-6PQG160C, high-performance commercial FPGA, Xilinx XC5200, maximum speed grade, PQG160 package, EMI protection, 120 I/O pins, commercial temperature, advanced prototyping, speed grade -6, guard ring technology
