Product Specifications
Core Architecture
- Family: Xilinx XC5200 Series FPGA
- Gate Count: 6,000 equivalent gates
- Logic Cells: 480 configurable logic blocks (CLBs)
- CLB Count: 120 configurable logic blocks
- Process Technology: Advanced 0.5ยตm three-layer metal CMOS
- Operating Frequency: Up to 83MHz maximum performance
- Supply Voltage: 4.75V to 5.25V (5V nominal)
Package Specifications
- Package Type: 160-Pin Plastic Quad Flat Pack (PQFP)
- Package Dimensions: 28mm x 28mm square footprint
- Package Thickness: 4.1mm maximum height
- Temperature Grade: Commercial (0ยฐC to +85ยฐC TJ)
- Speed Grade: -4 (enhanced performance grade)
- I/O Pins: 124 user I/O pins (maximum I/O density)
- Mounting Type: Surface mount technology
- Lead Pitch: 0.5mm fine pitch for high-density PCB layouts
Performance Features
- Enhanced Speed Grade: -4 speed grade for superior performance
- Maximum I/O Count: 124 user I/O pins for maximum connectivity
- SRAM-based reprogrammable architecture for unlimited design flexibility
- VersaBlock logic modules with optimized carry logic for arithmetic operations
- VersaRing I/O interface delivering exceptional logic-to-I/O ratio
- Zero flip-flop hold time eliminating hold time violations
- Programmable output slew-rate control for signal integrity optimization
- IEEE 1149.1 boundary scan support for comprehensive testability
- Internal configuration oscillator for autonomous startup
Electrical Characteristics
- Maximum Operating Frequency: 83MHz system clock
- Propagation Delay: Optimized for speed grade -4
- Setup/Hold Times: Enhanced for high-speed synchronous designs
- I/O Standards: 5V CMOS/TTL compatible interfaces
- Drive Capability: 8mA source/sink current per I/O pin
- Power Consumption: Optimized for commercial applications
- Logic Utilization: 480 logic elements with high routing efficiency
Price
Current Market Pricing for XC5204-4PQG160C:
| Quantity | Unit Price (USD) | Extended Price | Lead Time |
|---|---|---|---|
| 1-24 | Contact for Quote | – | 6-8 weeks |
| 25-99 | $22.50 | Starting at $562 | 4-6 weeks |
| 100-249 | $20.25 | Starting at $2,025 | 3-4 weeks |
| 250-499 | $18.75 | Starting at $4,688 | 2-3 weeks |
| 500-999 | $17.00 | Starting at $8,500 | 2-3 weeks |
| 1000+ | $15.50 | Starting at $15,500 | 1-2 weeks |
Pricing reflects premium for enhanced -4 speed grade and maximum I/O count. Legacy device pricing subject to availability fluctuations. Extended lead times due to end-of-life status. Contact authorized distributors for current stock levels and alternative sourcing options.
Value Proposition:
- Maximum I/O density in XC5200 family reduces external interface complexity
- Enhanced performance grade enables higher system clock frequencies
- Premium package option for applications requiring maximum connectivity
- Field-programmable flexibility eliminates ASIC development costs and time
Documents & Media
Technical Documentation
- XC5204-4PQG160C Datasheet (PDF): Complete electrical specifications and AC/DC characteristics
- XC5200 Family Architecture Guide: Comprehensive logic block and routing details
- 160-Pin PQFP Package Information: Mechanical drawings, thermal data, and handling guidelines
- Pin Configuration Guide: Detailed I/O assignments, power/ground distribution, and signal mapping
- Speed Grade Comparison: Performance benchmarks across different speed grades
Design Resource Files
- IBIS Simulation Models: High-speed signal integrity modeling files
- SPICE Models: Analog simulation models for circuit analysis
- PCB Layout Libraries: Footprint patterns for major CAD systems (Altium, Cadence, KiCad)
- 3D Package Models: STEP files for mechanical design verification
- Constraint File Templates: UCF files optimized for 160-pin PQFP implementation
Software Development Tools
- Xilinx ISE Design Suite: Legacy development environment with XC5200 support
- WebPACK Edition: Cost-effective development option for XC5200 family
- VHDL/Verilog Libraries: Pre-compiled simulation libraries and synthesis templates
- Timing Analysis Tools: Static timing analysis for performance optimization
- Configuration Tools: JTAG and parallel programming utilities
Application Resources
- Reference Designs: High I/O count application examples and best practices
- Migration Guides: Porting designs from other FPGA families
- Thermal Management: Heat dissipation calculations and cooling recommendations
- Signal Integrity Guidelines: High-speed PCB design considerations for 160-pin PQFP
- Power Distribution: Supply decoupling and power plane design recommendations
Related Resources
Development and Programming Tools
- XC5200 Evaluation Platforms: Development boards optimized for 160-pin PQFP devices
- JTAG Programming Cables: Configuration and real-time debugging interfaces
- Logic Analyzers: Signal capture and timing analysis tools
- Oscilloscopes: High-bandwidth instruments for signal integrity verification
- PCB Design Services: Professional layout services for 160-pin PQFP implementations
Package Alternatives and Variants
- XC5204-4TQ144I: Same logic capacity in industrial-grade 144-pin TQFP
- XC5204-4PQ160C: Standard PQFP variant (non-gold-plated leads)
- XC5204-5PQG160C: Lower performance -5 speed grade option
- XC5204-6PQG160C: Commercial speed grade with extended temperature range
- XC5204-4PG156C: Alternative ceramic PGA package for high-reliability applications
Capacity and Performance Variants
- XC5202-4PQG160C: Lower gate count (3,000 gates, 256 cells) in same package
- XC5206-4PQG160C: Higher capacity (10,000 gates, 784 cells) with enhanced features
- XC5210-4PQG160C: Maximum capacity option (16,000 gates, 1,296 cells)
- XC5215-4PQG160C: Premium variant with additional features and performance
Application Markets and Use Cases
- Telecommunications: High-speed data processing and protocol implementation
- Industrial Automation: Multi-channel I/O control and sensor interfacing
- Test & Measurement: High-channel-count data acquisition systems
- Aerospace & Defense: Mission-critical systems requiring maximum I/O
- Medical Equipment: Multi-parameter patient monitoring and diagnostic systems
- Automotive Electronics: Advanced driver assistance systems (ADAS)
Design Migration and Support Services
- Xilinx Migration Center: Guidance for transitioning to current FPGA families
- Design Consultation: Expert assistance for legacy system modernization
- Supply Chain Management: Long-term availability planning and obsolescence management
- Technical Training: FPGA design methodology courses and certification programs
- Field Application Engineering: Regional technical support and design optimization
Environmental & Export Classifications
Environmental Compliance and Standards
- RoHS Compliance: Contains lead / RoHS non-compliant (legacy device exemption)
- REACH Regulation: EU chemical safety compliance with substance declarations
- Conflict Minerals: Responsible sourcing compliance and documentation
- ISO 14001: Environmental management system certified manufacturing
- WEEE Directive: Electronic waste management and recycling guidelines
- Green Product Initiative: Xilinx environmental sustainability program participation
Operating Environmental Specifications
- Junction Temperature: 0ยฐC to +85ยฐC (TJ) commercial grade
- Ambient Operating Temperature: -40ยฐC to +70ยฐC (dependent on airflow)
- Storage Temperature: -65ยฐC to +125ยฐC non-operating
- Relative Humidity: 95% RH non-condensing maximum
- Altitude: Up to 3,000 meters operational
- Vibration Resistance: MIL-STD-883 Method 2007 compliant
- Thermal Shock: -55ยฐC to +125ยฐC per JEDEC JESD22-A106
Export Control and Trade Classifications
- ECCN Classification: 3A991.a.2 (Export Administration Regulations)
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule classification)
- Schedule B: 8542.31.0001 (US export statistical reporting)
- Country of Origin: Multiple manufacturing locations worldwide
- Export License Requirements: May require authorization for restricted destinations
- ITAR Status: Not controlled under International Traffic in Arms Regulations
- Dual-Use Technology: Subject to Bureau of Industry and Security oversight
Quality Assurance and Reliability
- Quality Management: ISO 9001:2015 certified manufacturing processes
- Reliability Standards: MIL-STD-883 and JEDEC qualification protocols
- Quality Grade: Commercial temperature and voltage specifications
- MTBF Rating: >750,000 hours at 25ยฐC ambient with proper thermal management
- Burn-in Testing: Optional extended reliability screening available
- Statistical Process Control: Six Sigma manufacturing quality metrics
Package Handling and Storage
- MSL Rating: Moisture Sensitivity Level 3 (168 hours at 30ยฐC/60% RH)
- Baking Requirements: 125ยฐC for 24 hours if MSL limits exceeded
- ESD Classification: Class 1A (>1,000V Human Body Model minimum)
- Package Marking: Full traceability with date codes, lot codes, and speed grade
- Handling Precautions: ESD-safe environment required for all operations
- Storage Conditions: Sealed moisture barrier bag with desiccant and humidity indicator
Regulatory Certifications and Approvals
- UL Recognition: Component recognition for use in listed equipment
- CE Marking: European Conformity when integrated in compliant systems
- FCC Part 15: Class B digital device emission compliance capability
- ICES-003: Canadian interference-causing equipment standard
- VCCI: Japanese voluntary control council electromagnetic compatibility
- KCC: Korean communications commission electromagnetic interference compliance
Supply Chain and Lifecycle Management
- Authorized Distributors: Global network of certified electronics distributors
- Lifecycle Status: Obsolete – not recommended for new designs
- Last Time Buy: Final procurement opportunities through authorized channels
- Alternative Recommendations: Migration path to current AMD Xilinx FPGA families
- Long-term Support: Limited technical support for existing applications
- Counterfeit Protection: Secure supply chain verification and authentication services
Critical Design Notice: The XC5204-4PQG160C represents the premium performance tier of Xilinx’s legacy XC5200 family, offering maximum I/O count and enhanced -4 speed grade performance. While this device provides exceptional capabilities for its generation, it is classified as obsolete and not recommended for new designs. Current applications should consider migration to modern AMD Xilinx FPGA families that offer superior performance, lower power consumption, advanced features, and long-term roadmap support.
Recommended Modern Alternatives: For new designs requiring similar I/O counts and performance, consider current Spartan, Artix, or Kintex FPGA families that provide equivalent or superior functionality with contemporary features, development tool support, and multi-decade availability guarantees.
All specifications are subject to change without notice. For critical applications, verify all parameters through official AMD Xilinx documentation and authorized distributors.
