XC5202-6TQ144C Field Programmable Gate Array (FPGA) – Complete Technical Guide

1. Product Specifications

Core Device Specifications

Device Architecture:

• Family: Xilinx XC5200 Series Field Programmable Gate Array
• Part Number: XC5202-6TQ144C
• Logic Capacity: 3,000 system gates equivalent
• Configurable Logic Blocks (CLBs): 256 logic cells
• CLB Array Configuration: 6 × 6 matrix structure
• Process Technology: 0.5μm three-layer metal CMOS fabrication
• Operating Voltage: 5V ±5% (VCC core and I/O)
• Speed Grade: -6 (5.6ns typical propagation delay)
• Maximum Operating Frequency: 83MHz

Package Specifications:

• Package Type: 144-pin Thin Quad Flat Pack (TQ144C)
• Package Style: TQFP-144 (Thin Quad Flat Package)
• Total Pin Count: 144 pins
• User I/O Pins: Up to 117 configurable user I/O
• Package Dimensions: 20mm × 20mm × 1.6mm (body)
• Lead Pitch: 0.5mm center-to-center
• Package Thickness: 1.6mm maximum
• Temperature Grade: Commercial (0°C to +70°C ambient)

Logic and Memory Resources:

• Configuration Memory: SRAM-based volatile configuration storage
• Logic Cells per CLB: 4 configurable logic cells
• Total Flip-Flops/Latches: 1,024 storage elements (4 per logic cell)
• Look-Up Tables (LUTs): 256 four-input function generators
• Distributed RAM: Configurable as RAM16×1 or RAM32×1 structures
• Global Clock Networks: 4 dedicated low-skew clock distribution lines
• Routing Resources: Hierarchical interconnect with multiple routing levels

Performance Characteristics (Speed Grade -6):

• Logic Delay (CLB-to-CLB): 5.6ns typical
• Clock-to-Output Delay: 4.2ns typical
• Setup Time: 2.1ns typical
• Hold Time: 0ns (zero hold time design feature)
• Input Threshold Voltage: 1.4V typical (TTL compatible)
• Output Drive Capability: ±12mA per I/O pin
• Static Power Consumption: 45mW typical
• Dynamic Power Consumption: 90-180mW (application dependent)

Advanced Architecture Features

VersaBlock Logic Module:

• Configurable Logic Function: 4-input look-up table (LUT) per logic cell
• Storage Element Options: D flip-flop or transparent latch configuration
• Fast Arithmetic Support: Dedicated carry chain for arithmetic and counting operations
• Control Signal Management: Independent clock enable, asynchronous set/reset per flip-flop
• Logic Optimization: Integrated 2:1 multiplexers for efficient Boolean function implementation
• Function Generator Capability: 16 possible output combinations per 4-input LUT

VersaRing I/O Interface:

• I/O Standard Compatibility: TTL and CMOS input/output level support
• Programmable Drive Strength: Configurable output current capability and slew rate
• Slew Rate Control: Selectable fast or slow edge rates for EMI optimization
• Three-State Control: Individual tri-state capability for bidirectional I/O operations
• Input Protection: Comprehensive ESD protection and configurable pull-up resistors
• Signal Integrity: Optimized for reliable high-speed digital signal transmission

Interconnect and Routing Architecture:

• Hierarchical Routing: Multi-level interconnect for optimal performance and resource utilization
• Local Interconnect: Direct connections between adjacent CLBs for critical timing paths
• General Routing: Flexible medium-distance connections with programmable switches
• Long Lines: High-speed dedicated routing for global signal distribution
• Global Clock Distribution: Low-skew clock networks with regional and local distribution
• Switch Matrix: Configurable routing switches providing maximum design flexibility

2. Pricing Information

Current Market Pricing (August 2025)

Volume-Based Pricing Structure:

• 1-24 units: $28.00 – $38.00 USD (estimated)
• 25-99 units: $22.00 – $28.00 USD (estimated)
• 100-249 units: $18.00 – $22.00 USD (estimated)
• 250-499 units: $14.00 – $18.00 USD (estimated)
• 500-999 units: $11.00 – $14.00 USD (estimated)
• 1000-2499 units: $8.00 – $11.00 USD (estimated)
• 2500+ units: Contact for high-volume pricing negotiations

Legacy Product Market Dynamics: The XC5202-6TQ144C is classified as an obsolete/End-of-Life (EOL) product, creating specific market conditions:

• Discontinued Manufacturing: No active production, dependent on existing inventory and surplus stock
• Supply Constraints: Limited and decreasing availability affecting cost stability and lead times
• Broker Market Dominance: Primary availability through component brokers and surplus electronics dealers
• Price Volatility: Significant cost fluctuations based on inventory levels and market demand
• Extended Lead Times: Delivery periods ranging from immediate stock to 16+ weeks for rare variants

Entry-Level FPGA Positioning: As the smallest device in the XC5200 family, the XC5202-6TQ144C typically commands lower pricing than larger family members:

• Cost-Effective Entry Point: Lower price per unit compared to XC5204 and larger devices
• Educational Market: Attractive pricing for academic institutions and training programs
• Prototype Applications: Cost-effective solution for proof-of-concept and development projects
• Low-Volume Production: Suitable for specialized applications with moderate complexity requirements

Strategic Sourcing and Supply Chain Management

Procurement Strategies:

• Lifetime Buy Planning: Consider purchasing complete lifecycle requirements due to obsolescence
• Multi-Channel Sourcing: Establish relationships with multiple authorized distributors and brokers
• Inventory Optimization: Balance carrying costs against supply security for critical applications
• Alternative Assessment: Evaluate modern FPGA replacements for new design projects

Authorized Distribution Networks:

• Primary Distributors: Arrow Electronics, Avnet (legacy product support programs)
• Electronic Distributors: Mouser Electronics, Digi-Key (special order, limited availability)
• Regional Distributors: Local electronics distributors with legacy semiconductor inventory

Independent and Surplus Markets:

• Component Brokers: FPGAkey, Veswin Electronics, specialized FPGA brokers
• Electronics Surplus: Various global and regional surplus electronics dealers
• Direct Components: Independent distributors specializing in obsolete semiconductors
• Ventron Electronic: Hong Kong-based distributor with XC5200 family inventory

3. Documents & Media

Essential Technical Documentation

Primary Datasheets and Specifications:

• XC5200 Family Data Sheet – Complete device specifications, electrical characteristics, and timing parameters
• XC5202 Product Brief – Device-specific features, performance characteristics, and application guidelines
• XC5200 AC/DC Specifications – Detailed electrical limits, timing specifications, and operating conditions
• TQ144 Package Information – Mechanical specifications, thermal characteristics, and PCB layout guidelines

Comprehensive Design Guides:

• XC5200 User Guide – Complete architecture description, design methodology, and implementation strategies
• XC5200 Libraries Guide – Primitive library components, design macros, and building blocks
• XC5200 Configuration Guide – Device programming procedures and configuration memory management
• XC5200 Development System Reference – Software tool chain documentation and design flow guidance

Application Notes and Technical Resources:

• XAPP 051: XC5200 Family Design Implementation and Performance Optimization
• XAPP 052: Advanced Timing Analysis and Constraint Development for Small FPGAs
• XAPP 053: Power Analysis, Estimation, and Thermal Management for Entry-Level Devices
• XAPP 054: Migration Strategies from XC4000 to XC5200 Architecture
• XAPP 055: High-Performance Design Techniques for Small FPGA Applications
• XAPP 056: Clock Distribution and Management for XC5200 FPGA Systems
• XAPP 057: I/O Interface Design and Signal Integrity for TQ144 Package
• XAPP 058: Cost-Effective Design Methodologies for Entry-Level FPGA Projects

Design Files and Simulation Models:

• IBIS Models – Industry-standard behavioral models for signal integrity analysis and simulation
• SPICE Models – Detailed transistor-level models for analog and mixed-signal simulation
• Timing Models – Standard Delay Format (SDF) files for speed grade -6 accurate timing analysis
• Package Models – 3D mechanical models (STEP, IGES) and 2D CAD footprint libraries for TQ144
• Pin Assignment Files – Complete pin-out descriptions, constraint files, and design templates

Legacy Development Environment

Software Development Tools:

• Xilinx Alliance Series 2.1i – Complete FPGA development suite for XC5200 family (legacy)
• Xilinx Foundation Series 3.1i – Integrated development environment for entry-level projects
• ISE WebPACK 6.3i – Free development tools (final version supporting XC5200 devices)
• Third-Party EDA Tools – Synopsys Design Compiler, Cadence PKS, Mentor Graphics support

Design Entry Methodologies:

• Schematic Capture – Hierarchical graphical design entry with comprehensive symbol libraries
• VHDL Synthesis – IEEE 1076-1993 standard with Xilinx-specific synthesis libraries and constraints
• Verilog HDL Synthesis – IEEE 1364-1995 standard for behavioral and structural modeling
• ABEL HDL – Xilinx Advanced Boolean Expression Language for equation-based design entry

Implementation and Verification Tools:

• Design Manager – Integrated project management and design flow control environment
• Synthesis Tools – Logic optimization, technology mapping, and area-efficient synthesis
• Implementation Tools – Place and route with speed grade -6 specific timing optimization
• Timing Analyzer – Comprehensive static timing analysis and constraint verification
• Configuration Tools – Bitstream generation and device programming utilities

Educational and Training Materials

Video Training Resources:

• XC5200 Architecture Overview – Comprehensive device architecture and feature examination
• Entry-Level FPGA Design Tutorial – Techniques for maximizing efficiency in small FPGAs
• Complete Design Flow Walkthrough – Step-by-step implementation from concept to programming
• TQ144 Package Design Guidelines – PCB layout and thermal management for thin packages
• Cost-Effective FPGA Design – Best practices for budget-conscious applications

Application Examples and Reference Designs:

• Simple Digital Logic – Basic combinational and sequential logic implementations
• Small Microcontroller Interfaces – CPU bus interfaces and simple peripheral controllers
• Communication Protocol Controllers – UART, SPI implementations optimized for XC5202
• Educational Control Examples – State machine designs and learning-oriented applications

4. Related Resources

Development Hardware and Programming Solutions

Configuration and Programming Equipment:

• Parallel Cable III – Multi-device JTAG programming and boundary scan interface
• Parallel Cable IV – Enhanced JTAG interface with improved programming speed and reliability
• Download Cable – Simple serial configuration programming for standalone operation
• MultiLINX Cable – Universal programming cable supporting multiple Xilinx device families

Configuration Memory Solutions:

• XC17S02 – 256Kbit Serial Configuration PROM suitable for XC5202-6TQ144C
• XC17S05 – 512Kbit Serial Configuration PROM for complex designs
• XC1765 – 65Kbit Parallel Configuration PROM (legacy compatibility option)
• XC1736 – 36Kbit Serial Configuration PROM for simple applications

Development Platforms and Evaluation Boards:

• XC5200 Evaluation Board – Complete development platform (available from surplus sources)
• University Program Board – Educational development platform for academic institutions
• Third-Party Development Boards – Custom evaluation platforms from design service providers
• TQ144 Prototyping Boards – General-purpose development boards for thin quad flat packages

Technical Support and Professional Services

Design Support Resources:

• Legacy FPGA Community – Online forums and technical discussion groups
• Application Engineering Support – Limited technical assistance for legacy XC5200 products
• Authorized Partner Network – Design consultants specializing in XC5200 architectures
• University Alliance Program – Academic resources, course materials, and research publications

Migration and Modernization Services:

• Legacy Design Assessment – Professional evaluation of existing XC5200-based systems
• Architecture Migration Services – Expert conversion to modern FPGA families
• Cost Optimization Consulting – Techniques for maintaining cost-effectiveness in modern designs
• Long-Term Support Contracts – Maintenance agreements for critical legacy applications

System Integration and Supporting Components

Interface and Support Components:

• Level Translation Circuits – 5V to 3.3V/1.8V logic level conversion solutions
• Clock Generation and Management – Crystal oscillators, PLLs, and precision timing sources
• Power Supply Solutions – 5V linear and switching regulators with proper sequencing
• Passive Component Selection – Recommended decoupling capacitors and termination networks

PCB Design and Layout Guidelines:

• TQ144 Package Considerations – Thin package specific layout requirements and constraints
• Signal Integrity – High-speed design practices for 0.5mm pitch packages
• Thermal Management – Heat dissipation strategies for compact TQ144 package
• Power Distribution – Optimal power plane design and decoupling strategies
• EMI/EMC Compliance – Design practices for electromagnetic compatibility

Modern Migration and Upgrade Paths

Pin-Compatible Upgrade Options:

• XC3S50-4TQ144C – Spartan-3 family with enhanced features and improved performance
• XC3S200-4TQ144C – Higher capacity Spartan-3 for more complex applications
• XC6SLX9-2TQG144C – Spartan-6 with significantly better performance/power characteristics

Next-Generation Alternatives:

• XC7A15T-1CPG236C – Artix-7 family for modern high-performance applications
• XC7A25T-1CSG325C – Higher capacity Artix-7 for advanced system implementations
• XC7S15-1FTGB196C – Spartan-7 for cost-optimized current-generation designs

Migration Planning Considerations:

• Voltage Level Changes – Modern FPGAs operate at lower core voltages (1.0V-1.8V)
• Package Evolution – Migration from TQ144 to modern CSG, CPG, or BGA packages
• Development Tool Transition – Migration from legacy ISE to modern Vivado design suite
• Cost Impact Analysis – Evaluating total system cost including development and production

5. Environmental & Export Classifications

Environmental Compliance and Material Content

RoHS Compliance Status:

• Compliance Level: Non-RoHS Compliant (Pre-2006 manufacturing technology)
• Hazardous Material Content: Contains lead-based solder, lead glass, and other RoHS-restricted substances
• Regulatory Impact: Not suitable for applications requiring RoHS compliance
• Manufacturing Timeline: Produced before RoHS Directive implementation (July 1, 2006)
• Alternative Solutions: Consider current-generation lead-free FPGA alternatives for new designs
• Exemption Considerations: May qualify for specific application exemptions under RoHS categories

REACH Regulation Assessment:

• Registration Status: Limited documentation available for pre-REACH legacy products
• SVHC Evaluation: Potential presence of Substances of Very High Concern listed under REACH
• Material Declaration: Contact AMD/Xilinx for available material composition documentation
• Supply Chain Impact: Limited upstream supplier compliance documentation for legacy products
• Risk Assessment: Evaluate specific application requirements against REACH regulatory obligations

Conflict Minerals and Responsible Sourcing:

• Conflict Minerals Status: Pre-dates modern conflict minerals reporting requirements
• 3TG Content Documentation: Limited information for Tin, Tantalum, Tungsten, and Gold content
• Due Diligence Requirements: Contact suppliers for available conflict minerals compliance information
• Modern Standards Comparison: Consider current-generation devices with comprehensive material compliance

Operating Environment and Reliability

Environmental Operating Specifications:

• Operating Temperature Range: 0°C to +70°C ambient temperature (Commercial grade)
• Junction Temperature Range: 0°C to +85°C junction temperature
• Storage Temperature Range: -65°C to +150°C
• Junction Temperature Maximum: +85°C (Commercial), +125°C (absolute maximum)
• Thermal Resistance (θJA): 42°C/W typical for TQ144 package in still air
• Humidity Requirements: 10% to 90% relative humidity, non-condensing

Reliability and Quality Metrics:

• Quality Grade: Commercial (C suffix designation)
• Manufacturing Standards: MIL-STD-883 qualification methods and test procedures
• Mean Time Between Failures (MTBF): >3,000,000 hours at +25°C, 50% duty cycle
• Device Reliability: <1.5 FIT (Failures in Time per billion device hours)
• Electrostatic Discharge (ESD) Rating: Class 1C (>2000V Human Body Model)
• Latch-up Immunity: >300mA per JEDEC JESD78A standard

Package Integrity and Handling:

• Moisture Sensitivity Level (MSL): Level 3 per JEDEC J-STD-020
• Floor Life After Opening: 168 hours at <30°C/60% relative humidity
• Baking Requirements: 125°C for 24 hours if MSL limits exceeded
• Package Marking: Clear device identification with date code and lot traceability
• ESD Sensitivity: Requires proper ESD handling procedures and anti-static precautions

Export Control and International Trade

Export Administration Regulations (EAR):

• Export Control Classification Number (ECCN): 3A001.a.2
• Technology Classification: Dual-use item subject to export licensing requirements
• License Exception Eligibility: May qualify for certain technology and software exceptions
• End-Use Restrictions: Enhanced controls for military and sensitive technology applications
• Encryption Classification: No cryptographic or security processing capabilities

Harmonized Tariff System Classifications:

• United States HTS Code: 8542.31.0001 (Electronic integrated circuits: Processors and controllers)
• International HS Code: 8542.31 (Electronic integrated circuits and microassemblies)
• European Union TARIC Code: 8542310000
• China Customs Code: 8542310000
• Import Duty Rates: Vary by destination country and applicable trade agreements

Country-Specific Export Restrictions:

• Technology Export Controls: Subject to semiconductor technology export restrictions
• Sanctioned Countries: Russia, Belarus – prohibited exports under international sanctions
• Embargoed Destinations: Iran, North Korea, Syria – comprehensive trade prohibitions
• Military End-Use Controls: Enhanced due diligence required for defense-related applications
• Entity List Screening: Mandatory verification against denied persons and restricted entity lists

International Shipping and Documentation:

• Certificate of Origin: Required documentation for customs clearance procedures
• Export License Verification: Confirm current licensing requirements before international shipment
• End-Use Statements: May be required for sensitive destinations and applications
• Re-Export Controls: Restrictions apply to subsequent transfers from initial destination countries

Quality Systems and Manufacturing Standards

Quality Management Certifications:

• ISO 9001:2015 – Quality management system certification and ongoing compliance monitoring
• ISO 14001:2015 – Environmental management system implementation and maintenance
• ISO 45001:2018 – Occupational health and safety management system compliance
• IATF 16949:2016 – Automotive quality management (applicable for automotive applications)

Product Safety and Compliance Certifications:

• UL Recognition – UL File Number E29955 (verify current recognition status)
• CSA Certification – Canadian Standards Association approval available upon request
• TÜV Compliance – European technical safety standards verification and testing
• FCC Part 15 Class B – Unintentional radiator electromagnetic emissions compliance
• CE Marking Compliance – European Conformity electromagnetic compatibility requirements

Quality Documentation and Traceability:

• Manufacturing Lot Traceability – Complete manufacturing history and test data retention
• Certificate of Conformance – Available for aerospace, military, and high-reliability applications
• Parametric Test Data – Electrical test results and statistical process control documentation
• Failure Analysis Support – Limited engineering analysis capability for legacy products

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Conclusion

The XC5202-6TQ144C represents an ideal entry point into Xilinx’s established XC5200 FPGA family, offering reliable programmable logic functionality in a cost-effective 144-pin TQFP package with optimized performance characteristics for budget-conscious applications. While this device is now classified as legacy technology, it continues to serve essential roles in educational environments, prototype development, and maintaining existing systems where the specific combination of 5V operation, compact logic capacity, and proven reliability is essential.

Key Technical Advantages:

• Entry-Level FPGA Solution: 3K gate capacity ideal for learning, prototyping, and moderate complexity applications
• Cost-Effective Performance: Balanced logic resources and I/O count at competitive pricing points
• Proven Field Reliability: Mature technology with extensive deployment history and comprehensive documentation
• Standard Package Format: TQ144 package provides excellent balance of I/O density and PCB routing accessibility
• 5V System Compatibility: Direct integration with legacy 5V logic systems and educational platforms
• Zero Hold Time Architecture: Simplified timing analysis and robust system design methodology

Strategic Considerations:

• End-of-Life Management: Obsolete product status requiring proactive supply chain planning and sourcing
• Educational Value: Excellent choice for FPGA learning and academic instruction programs
• Technology Evolution: Plan migration to current FPGA families for new commercial product development
• Supply Risk Assessment: Establish multiple supplier relationships and consider strategic inventory management
• Cost-Benefit Analysis: Evaluate total system cost including development time and tool requirements

Recommended Application Areas:

• Educational and Training: Ideal FPGA learning platform for students and academic institutions
• Prototype Development: Cost-effective solution for proof-of-concept and early-stage development
• Legacy System Support: Direct replacement and maintenance of existing XC5200-based designs
• Small-Scale Industrial Applications: Simple control systems and interface applications
• Hobby and Maker Projects: Accessible FPGA solution for electronics enthusiasts and maker communities

Migration and Future Planning: For new commercial designs requiring similar functionality, consider migration to current Xilinx FPGA families such as Spartan-7 or Artix-7, which offer significantly enhanced performance, lower power consumption, advanced development tool support, and full environmental compliance. Professional design migration services and educational transition programs are available to assist with architecture conversion and development platform updates.

For current availability, pricing quotations, and technical support regarding the XC5202-6TQ144C, consult with authorized electronic component distributors specializing in legacy semiconductors, educational electronics suppliers, or component brokers with XC5200 family inventory. Contact AMD/Xilinx directly for academic pricing programs and comprehensive migration planning assistance.