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XC4VSX35-11FF668C: High-Performance Virtex-4 SX FPGA Solution

Original price was: $20.00.Current price is: $19.00.

The XC4VSX35-11FF668C represents a powerful solution in Xilinx’s Virtex-4 SX family, delivering exceptional processing capabilities for demanding digital signal processing and high-performance computing applications. This advanced FPGA combines dedicated DSP slices with flexible logic resources to meet the requirements of sophisticated embedded systems.

Product Specifications

The XC4VSX35-11FF668C features robust specifications designed for high-performance applications:

Core Architecture:

  • Logic Cells: 34,560 system gates equivalent
  • Configurable Logic Blocks (CLBs): 1,728 slices
  • DSP48 Slices: 192 dedicated multiply-accumulate blocks
  • Block RAM: 1,728 Kb total distributed across 48 blocks
  • Speed Grade: -11 (high-performance variant)

Package & I/O:

  • Package Type: FF668 (Fine-pitch Ball Grid Array)
  • Total I/O Pins: 488 user I/O pins
  • Package Dimensions: 27mm ร— 27mm
  • Ball Pitch: 1.0mm

Performance Characteristics:

  • Operating Frequency: Up to 550 MHz internal clock
  • Power Consumption: Optimized for balance between performance and efficiency
  • Temperature Range: Commercial grade (0ยฐC to +85ยฐC)

The XC4VSX35-11FF668C integrates seamlessly with Xilinx’s development ecosystem, supporting advanced design methodologies and IP integration for accelerated time-to-market.

Pricing Information

Pricing for the XC4VSX35-11FF668C varies based on quantity, supplier, and market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities, with pricing structures designed to accommodate both prototyping and high-volume manufacturing requirements.

Documents & Media

Essential documentation for the XC4VSX35-11FF668C includes:

Technical Documentation:

  • Virtex-4 SX Family Data Sheet
  • Package and Pinout Specifications
  • Power and Thermal Design Guidelines
  • Configuration User Guide

Design Resources:

  • Reference designs and application notes
  • Timing and constraint templates
  • Power estimation spreadsheets
  • Package thermal models

Software Support:

  • ISE Design Suite compatibility
  • ChipScope Pro debugging support
  • IP Core Generator libraries
  • Constraint editor templates

These resources ensure comprehensive support throughout the design cycle, from initial concept through production deployment.

Related Resources

The XC4VSX35-11FF668C ecosystem includes complementary products and development tools:

Development Boards:

  • ML405 evaluation platform
  • Custom carrier boards from third-party vendors
  • Prototyping solutions for rapid development

Compatible IP Cores:

  • DSP algorithms and filters
  • Communication protocol stacks
  • Video and image processing libraries
  • Mathematical function libraries

Design Tools Integration:

  • MATLAB/Simulink system-level design
  • System Generator for DSP workflows
  • Embedded Development Kit (EDK) support
  • Third-party synthesis and simulation tools

These resources create a comprehensive development environment optimized for XC4VSX35-11FF668C implementations.

Environmental & Export Classifications

The XC4VSX35-11FF668C meets stringent environmental and regulatory standards:

Environmental Compliance:

  • RoHS compliant lead-free package
  • REACH regulation compliance
  • Halogen-free package materials available
  • Conflict minerals reporting available

Export Classifications:

  • ECCN (Export Control Classification Number): 3A001.a.7
  • HTS (Harmonized Tariff Schedule): 8542.39.0001
  • Country of Origin: Varies by manufacturing facility
  • Export license requirements may apply for certain destinations

Quality Standards:

  • ISO 9001 certified manufacturing
  • Automotive AEC-Q100 qualified variants available
  • Industrial temperature grade options
  • Extended reliability testing documentation