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XC4VFX60-FF1152DGQ – High-Performance Virtex-4 FX FPGA

Original price was: $20.00.Current price is: $19.00.

The XC4VFX60-FF1152DGQ is a cutting-edge Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx), designed to deliver exceptional performance for demanding applications. This Virtex-4 FX family device combines advanced silicon technology with embedded PowerPC processors, making it ideal for high-speed data processing, digital signal processing, and complex system-on-chip implementations.

Product Specifications

Core Features

  • Logic Cells: 56,880 configurable logic cells
  • Package Type: 1152-pin Fine-Pitch Ball Grid Array (FC-BGA)
  • Technology Node: 90nm CMOS process technology
  • Operating Voltage: 1.2V core voltage
  • I/O Count: 576 user I/O pins
  • Speed Grade: Various speed grades available (-10, -11, -12)

Advanced Capabilities

  • Embedded PowerPC Processors: Dual PowerPC 405 cores with APU interface
  • DSP Slices: Dedicated 18×18 multipliers for high-performance signal processing
  • Block RAM: Configurable memory blocks for data storage and buffering
  • Clock Management: Digital Clock Managers (DCMs) with advanced timing features
  • High-Speed Serial Transceivers: Multi-gigabit transceivers (622 Mb/s to 6.5 Gb/s)
  • Tri-Mode Ethernet MACs: Integrated Ethernet controllers

Physical Specifications

  • Package Dimensions: 35mm x 35mm
  • Pin Pitch: 1.0mm
  • Package Material: Lead-free, RoHS compliant
  • Thermal Characteristics: Enhanced thermal performance with flip-chip technology

Performance Characteristics

  • Maximum Frequency: Up to 400MHz system clock
  • Power Consumption: Optimized low-power design
  • Temperature Range: Commercial (0ยฐC to +85ยฐC) and Industrial (-40ยฐC to +100ยฐC) variants
  • Supply Voltage Range: 1.14V to 1.26V

Price Information

The XC4VFX60-FF1152DGQ pricing varies based on several factors:

Pricing Factors

  • Quantity: Volume discounts available for orders over 100 units
  • Speed Grade: Higher speed grades command premium pricing
  • Temperature Range: Industrial temperature variants typically cost more
  • Distributor: Authorized distributors offer competitive pricing
  • Market Conditions: Semiconductor market fluctuations affect pricing

Availability

  • Stock Status: Available from multiple authorized distributors
  • Lead Time: Typically 2-12 weeks depending on quantity and specifications
  • Minimum Order: Varies by distributor, typically 1-25 pieces
  • Sample Availability: Engineering samples available through AMD

For current pricing and availability, contact authorized AMD distributors or request a quote through official channels. Volume pricing tiers are available for production quantities.

Documents & Media

Technical Documentation

  • Datasheet: Complete electrical and functional specifications
  • User Guide (UG070): Comprehensive Virtex-4 FPGA implementation guide
  • Packaging Specification (UG075): Detailed package and pinout information
  • Application Notes: Design guidelines and best practices
  • Errata: Known issues and workarounds

Development Resources

  • Vivado Design Suite: Modern FPGA development environment
  • ISE Design Suite: Legacy development tools (fully supported)
  • IP Core Library: Extensive collection of verified IP blocks
  • Reference Designs: Proven implementations for common applications
  • Simulation Models: IBIS and SPICE models for signal integrity analysis

Software Support

  • Development Tools: Synthesis, place-and-route, and debugging software
  • PowerPC Tool Chain: Embedded processor development environment
  • ChipScope Pro: Integrated logic analyzer for real-time debugging
  • System Generator: MATLAB/Simulink integration for DSP applications

Related Resources

Development Platforms

  • Evaluation Boards: ML402 and ML403 development platforms
  • Starter Kits: Entry-level development systems
  • Custom Boards: Third-party development platforms available

Compatible Products

  • Power Management: Dedicated power supply solutions
  • Configuration Memory: PROM and Flash memory devices
  • Interface Components: Level shifters and signal conditioning circuits
  • Heat Sinks: Thermal management solutions for high-power applications

Educational Resources

  • Training Courses: Online and instructor-led FPGA design training
  • Webinars: Regular technical presentations and updates
  • Design Examples: Extensive library of reference implementations
  • Community Forums: Active user community and technical support

Application Areas

  • Telecommunications: Base station processing and network acceleration
  • Aerospace & Defense: Radar processing and mission-critical systems
  • Industrial Automation: High-speed control and monitoring systems
  • Medical Devices: Real-time signal processing and imaging
  • Test & Measurement: High-performance instrumentation

Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliance: Fully compliant with RoHS Directive 2011/65/EU
  • Lead-Free: Pb-free package construction meets environmental standards
  • REACH Regulation: Compliant with European chemical safety requirements
  • Conflict Minerals: Reporting compliant with SEC regulations
  • Green Package: Environmentally responsible packaging options available

Operating Conditions

  • Commercial Temperature: 0ยฐC to +85ยฐC ambient operating range
  • Industrial Temperature: -40ยฐC to +100ยฐC for extended applications
  • Humidity: 10% to 90% relative humidity (non-condensing)
  • Altitude: Sea level to 3,000 meters operational altitude

Quality Standards

  • ISO Compliance: Manufactured under ISO 9001 quality management
  • Reliability Testing: Extensive qualification including temperature cycling
  • ESD Protection: Class 1C ESD handling classification
  • Moisture Sensitivity: MSL Level 3 for proper storage and handling

Export Classifications

  • ECCN: Export Control Classification Number per U.S. regulations
  • HS Code: Harmonized System code for international trade
  • Country of Origin: Manufactured in qualified semiconductor facilities
  • Export Licensing: May require export licenses for certain destinations

Handling Requirements

  • Storage: Dry pack storage recommended for moisture-sensitive devices
  • Assembly: Lead-free compatible reflow soldering profiles
  • Rework: Specialized rework procedures for BGA packages
  • Inspection: X-ray inspection recommended for assembly verification

The XC4VFX60-FF1152DGQ represents a mature, proven FPGA solution that combines high-performance capabilities with comprehensive development support and regulatory compliance, making it an excellent choice for production systems requiring reliable, high-performance programmable logic capabilities.


For the latest technical specifications, pricing information, and availability, consult the official AMD documentation or contact authorized distributors.