1. Product Specifications
Core Architecture
- Family: Spartan-3A DSP FPGA
- Part Number: XC3SD3400A-FGG676I
- Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
- System Gates: 3.4 Million
- Logic Cells: 53,712
- Technology: 90nm CMOS process
- Supply Voltage: 1.2V core, 3.3V/5.0V I/O
Package Specifications
- Package Type: 676-Pin Fine-Pitch Ball Grid Array (FBGA)
- Package Code: FGG676
- Temperature Grade: Industrial (-40ยฐC to +85ยฐC)
- Speed Grade: Industrial grade
- Pin Count: 676 pins
- I/O Pins: 469 user I/O
Performance Characteristics
- Operating Frequency: Up to 250 MHz (DSP48A slices)
- XtremeDSP DSP48A Slices: Enhanced 18×18 multipliers with 48-bit accumulator
- Block RAM: Enhanced with output registers for faster operation
- Configuration Memory: Non-volatile configuration support
- Power Consumption: Optimized for low-power operation
Key Features
- XtremeDSP DSP48A Architecture: Advanced DSP processing capabilities
- Enhanced Block RAM: High-speed memory with output registers
- Proven 90nm Technology: Reliable and cost-effective manufacturing
- Industrial Temperature Range: Suitable for harsh operating environments
- Surface Mount Compatible: Designed for automated pick-and-place assembly
- Reflow Soldering Compatible: Standard manufacturing processes supported
2. Price
Current Market Pricing (2025)
The XC3SD3400A-FGG676I pricing varies based on quantity and distributor. Typical pricing ranges include:
- Small Quantities (1-10 units): $400-500 per unit
- Medium Volumes (40+ units): $430-435 per unit
- Large Volumes (80+ units): $400-405 per unit
- High Volume (160+ units): $340-350 per unit
- Production Volumes (400+ units): Contact for volume pricing
Note: Prices are subject to market fluctuations and distributor policies. Contact authorized distributors for current quotations and volume discounts.
Availability
- Lead Time: Typically 1-4 weeks for standard quantities
- Stock Status: Available from multiple authorized distributors
- Minimum Order: Varies by distributor (typically 1 unit minimum)
3. Documents & Media
Technical Documentation
- Primary Datasheet: Spartan-3A DSP FPGA Family Data Sheet (DS610)
- User Guide: XtremeDSP DSP48A for Spartan-3A DSP FPGAs User Guide (UG431)
- Configuration Guide: Spartan-3 Generation Configuration User Guide
- Package Information: Pinout descriptions and footprint diagrams
- Application Notes: DSP implementation guides and best practices
Design Resources
- Symbol Libraries: Available for Altium Designer, EAGLE, KiCad, and OrCAD
- PCB Footprints: Industry-standard footprint libraries
- 3D STEP Models: Mechanical design files for CAD integration
- Reference Designs: Sample implementations and starter projects
Software Tools
- ISE Design Suite: Complete FPGA development environment
- XtremeDSP System Generator: MATLAB/Simulink integration
- iMPACT Programming: Device configuration and programming
- ChipScope Pro: Real-time debugging and analysis
4. Related Resources
Compatible Development Boards
- Spartan-3A DSP Starter Kit: Complete development platform
- Custom Evaluation Boards: Third-party development solutions
- Reference Design Kits: Application-specific development platforms
Software Support
- Vivado Design Suite: Next-generation design tools (for newer devices)
- IP Core Libraries: Pre-verified intellectual property blocks
- Example Designs: Ready-to-use reference implementations
- Technical Support: Comprehensive documentation and community forums
Application Areas
- Digital Television: Video processing and broadcast equipment
- Broadband Access: Network infrastructure and communication systems
- Home Networking: Consumer router and gateway applications
- Display/Projection: Video processing and display controllers
- Consumer Electronics: Cost-sensitive high-performance applications
Alternative Products
- XC3SD1800A: Lower-density option in the same family
- Spartan-3A Family: Non-DSP variants for general-purpose applications
- Spartan-6 Family: Next-generation FPGA alternatives
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: RoHS 2011/65/EU compliant (lead-free)
- REACH Compliance: Compliant with EU REACH regulation
- Conflict Minerals: Compliant with conflict minerals regulations
- ISO 14001: Manufactured in ISO 14001 certified facilities
Operating Conditions
- Operating Temperature: -40ยฐC to +85ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- Thermal Resistance: Junction-to-ambient (ฮธJA) specified in datasheet
Export Classifications
- ECCN: 3A001.a.7 (US Export Administration Regulations)
- HTS Code: 8542.33.0001 (Harmonized Tariff Schedule)
- Country of Origin: Various (check specific lot markings)
- Export Restrictions: Standard semiconductor export controls apply
Quality Standards
- ISO 9001: Quality management system certified
- Automotive Grade: Industrial grade suitable for automotive applications
- Reliability Testing: Comprehensive qualification per JEDEC standards
- Traceability: Full lot traceability and quality documentation
Packaging and Handling
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) as specified
- ESD Sensitivity: Class 1 ESD sensitive device
- Packaging: Anti-static packaging with proper ESD protection
- Handling: Standard semiconductor handling procedures required
Keywords: XC3SD3400A-FGG676I, Spartan-3A DSP FPGA, 3.4M gates, 676-pin FBGA, industrial grade, digital signal processing, XtremeDSP, AMD Xilinx, programmable logic, embedded FPGA, 90nm technology
