1. Product Specifications
Core Architecture
- Family: Spartan-3A DSP FPGA
- System Gates: 3.4 million gates
- Logic Elements/Cells: 53,712 cells
- Process Technology: 90nm CMOS
- Operating Voltage: 1.2V core supply
- Speed Grade: -5 (industrial grade)
Memory Architecture
- Block RAM: Up to 2,268 Kbits of fast block RAM with byte write enables
- Distributed RAM: Up to 373 Kbits of efficient distributed RAM
- Total RAM Bits: 2,322,432 bits
- Block RAM Performance: 280 MHz operation in standard -4 speed grade
DSP Capabilities
- XtremeDSP DSP48A Slices: 250 MHz operation
- Dedicated Multipliers: 18-bit by 18-bit multiplier
- Accumulator: 48-bit accumulator for MAC operations
- Pre-adder: Integrated 18-bit pre-adder
- Pipeline Stages: Available for enhanced performance up to 250 MHz
I/O and Package Details
- Package Type: 676-pin Fine-pitch Ball Grid Array (FBGA)
- Package Dimensions: 27mm ร 27mm
- I/O Pins: 469 user I/O pins
- Mounting Type: Surface Mount
- Temperature Range: 0ยฐC to 85ยฐC (TJ) – Industrial grade
Clock Management
- Digital Clock Managers (DCMs): 8 DCMs available
- Global Clock Networks: 8 low-skew global clock networks
- Additional Clocks: 8 additional clocks per half device
Advanced Features
- SelectIO Technology: Multi-voltage, multi-standard interface pins
- Drive Strength: Up to 24 mA per pin
- Configuration Options: x8 or x8/x16 BPI parallel NOR Flash PROM support
- Power Management: Suspend and Hibernate modes for reduced system power
- Hot Swap Compliance: Full 3.3V ยฑ 10% compatibility
2. Price Information
The XC3SD3400A-5FGG676I pricing varies based on quantity and supplier. Current market indicators show:
- Availability: In stock at multiple authorized distributors
- Pricing Structure: Volume-based pricing with significant discounts for bulk orders
- Lead Time: Typically 1-4 weeks depending on quantity and supplier
- Price Range: Contact authorized distributors for current pricing (RFQ basis)
Note: Pricing fluctuates based on market conditions and global supply chain factors. The RAYPCB search engine monitors the XC3SD3400A-5FGG676I inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data.
3. Documents & Media
Technical Documentation
- Primary Datasheet: Spartan-3A DSP FPGA Family Datasheet (DS610)
- User Guide: Spartan-3A DSP FPGA User Guide
- Configuration Guide: Configuration User Guide
- Packaging Information: Package specifications and pin assignment documentation
- Application Notes: DSP-specific implementation guides
Design Resources
- Pinout Information: Complete pin assignment and signal descriptions
- IBIS Models: Signal integrity simulation models
- Timing Models: Timing analysis and constraint files
- PCB Design Guidelines: Layout recommendations and footprint data
Development Tools
- Vivado Design Suite: Recommended design environment
- ISE Design Tools: Legacy support available
- IP Cores: Extensive library of pre-verified IP blocks
- Reference Designs: Sample implementations and example projects
4. Related Resources
Development Platforms
- Evaluation Boards: Spartan-3A DSP evaluation kits
- Development Boards: Third-party development platforms
- Starter Kits: Entry-level development solutions
Compatible Devices
- XC3SD1800A Series: Lower-density family members
- Configuration PROMs: Compatible flash memory devices
- Power Management: Recommended power supply solutions
Software and IP
- XtremeDSP Solutions: Optimized DSP IP cores
- Memory Controllers: DDR/DDR2 interface solutions
- Communication Interfaces: Ethernet, PCIe, and USB IP
- Signal Processing IP: FFT, FIR filters, and codec implementations
Technical Support
- Community Forums: Xilinx/AMD developer community
- Application Engineering: Direct technical support
- Training Resources: Online courses and documentation
- Design Services: Partner ecosystem for custom development
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with EU chemical regulation
- Green Package: Lead-free and halogen-free packaging available
- Conflict Minerals: Compliant with conflict minerals regulations
Operating Conditions
- Operating Temperature: 0ยฐC to +85ยฐC (TJ) – Industrial grade
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 85% RH non-condensing
- Shock and Vibration: MIL-STD-883 compliant
Export Classifications
- ECCN: Check current export control classification
- Country of Origin: Various manufacturing locations
- Trade Compliance: Subject to applicable export control regulations
- Documentation: Certificate of compliance available upon request
Quality Standards
- ISO Certification: Manufactured under ISO 9001 quality management
- Automotive Grade: XA automotive version available for automotive applications
- Quality Assurance: 100% tested devices with comprehensive quality controls
- Warranty: Industry-standard warranty coverage
Key Applications
The XC3SD3400A-5FGG676I excels in demanding applications including:
- Broadband Access Equipment
- Home Networking Solutions
- Display and Projection Systems
- Digital Television Processing
- Wireless Communication Infrastructure
- Industrial Control Systems
- Medical Imaging Equipment
- Test and Measurement Instruments
Why Choose XC3SD3400A-5FGG676I?
These Spartan-3A DSP FPGA enhancements, combined with proven 90 nm process technology, deliver more functionality and bandwidth per dollar than ever before, setting the new standard in the programmable logic and DSP processing industry. The device offers unmatched flexibility compared to traditional ASICs while providing field-upgradeable functionality and faster time-to-market advantages.
For technical specifications, pricing, and availability of the XC3SD3400A-5FGG676I, contact authorized AMD Xilinx distributors or visit the official AMD Xilinx website for the most current information.
