Product Specifications
The XC3SD3400A-5FGG484LI is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s Spartan-3A DSP family. This advanced FPGA delivers exceptional processing capabilities for digital signal processing applications while maintaining cost-effectiveness and power efficiency.
Key Technical Specifications
Core Architecture:
- Logic Capacity: 3.4 million system gates
- Logic Cells: 53,712 cells organized in 5,968 CLBs (Configurable Logic Blocks)
- Memory: 2,322,432 RAM bits integrated on-chip
- Maximum Operating Frequency: 770 MHz internal performance
- Technology Node: Advanced 90nm CMOS process technology
Power and Voltage:
- Core Voltage: 1.2V nominal (1.14V – 1.26V operating range)
- I/O Voltage: Supports multiple standards including LVTTL, LVCMOS, PCI, HSTL, SSTL
- Low Power Design: Optimized for power-sensitive applications
Package and I/O:
- Package Type: 484-pin Fine-pitch Ball Grid Array (FBGA)
- Package Code: FGG484 (484-pin FBGA)
- User I/O Pins: 309 configurable I/O pins
- Speed Grade: -5 (high performance grade)
- Temperature Grade: Industrial temperature range (-40ยฐC to +100ยฐC)
DSP Features:
- Integrated DSP48 Slices: Hardware-optimized for digital signal processing
- Multiplier Blocks: Dedicated 18×18 multipliers for high-speed arithmetic
- Block RAM: Configurable memory blocks for data buffering and storage
- Clock Management: Advanced clock distribution and management systems
Price
Current Market Pricing:
- Unit Price: Starting from $11.90 USD (quantities of 1+)
- Volume Pricing: Available for bulk orders (1,000+ units)
- Lead Time: Standard 2-4 weeks for production quantities
- Availability: In stock at major distributors including DigiKey, Mouser, and authorized partners
Note: Pricing subject to market fluctuations and quantity requirements. Contact authorized distributors for current pricing and volume discounts.
Documents & Media
Official Documentation
- Primary Datasheet: Spartan-3A DSP FPGA Family Data Sheet (DS610)
- User Guide: Spartan-3A DSP Development Board User Guide
- Application Notes: DSP implementation guides and reference designs
- Package Information: Mechanical drawings and thermal specifications
Design Resources
- PCB Footprints: Available for Altium Designer, EAGLE, KiCad, and OrCAD
- 3D Models: STEP files for mechanical design verification
- Symbol Libraries: Schematic symbols for major EDA tools
- Reference Designs: Example projects and IP cores
Software Tools
- ISE Design Suite: Complete development environment
- Vivado Design Suite: Next-generation design tools (limited support)
- IP Catalog: Pre-verified intellectual property cores
- Simulation Models: VHDL and Verilog behavioral models
Related Resources
Development Boards
- Spartan-3A DSP 3400A Starter Kit: Complete evaluation platform
- Custom Development Boards: Third-party solutions from Digilent and partners
- FMC Expansion Modules: FPGA Mezzanine Card compatible accessories
Compatible Components
- Memory Interfaces: DDR2, DDR, SRAM, Flash memory controllers
- Communication Interfaces: Ethernet, USB, RS-232, SPI, I2C
- Analog Components: ADCs, DACs, and mixed-signal interfaces
Application Areas
- Digital Signal Processing: Audio/video processing, communications
- Industrial Control: Motor control, automation systems
- Medical Devices: Imaging systems, diagnostic equipment
- Aerospace & Defense: Radar systems, electronic warfare
- Consumer Electronics: Set-top boxes, digital cameras
Technical Support
- Online Documentation: Comprehensive technical library
- Community Forums: User discussion and troubleshooting
- Application Engineering: Direct technical support
- Training Programs: Design methodology workshops
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free manufacturing process
- REACH Compliant: EU chemical regulation compliance
- Conflict Minerals: Responsible sourcing certification
- Green Package: Halogen-free packaging materials
Operating Environment
- Operating Temperature: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Shock/Vibration: Meets IEC standards for industrial applications
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Manufactured in various AMD Xilinx facilities
- Export Restrictions: Subject to U.S. export control regulations
Quality Standards
- ISO 9001: Quality management system certification
- ISO 14001: Environmental management compliance
- TS 16949: Automotive quality standards (where applicable)
- Reliability Testing: JEDEC standard qualification testing
Packaging and Handling
- ESD Sensitive: Class 1 electrostatic discharge sensitivity
- MSL Rating: Moisture Sensitivity Level 3
- Storage Requirements: Dry nitrogen environment recommended
- Handling Precautions: Anti-static procedures required
The XC3SD3400A-5FGG484LI represents a mature, proven FPGA solution ideal for demanding digital signal processing applications requiring high performance, reliability, and cost-effectiveness. Its comprehensive feature set and extensive development ecosystem make it an excellent choice for both prototyping and production deployment.
