Product Specifications
Core Architecture
- Logic Cells: 53,712 logic elements providing extensive programmable capacity
- System Gates: 3.4 million gates for complex algorithm implementation
- Technology Node: Advanced 90nm CMOS process technology
- Operating Voltage: 1.2V core voltage with 3.3V/2.5V I/O support
- Speed Grade: -5 (industrial grade) for enhanced performance and reliability
Digital Signal Processing Features
- DSP Slices: 126 dedicated 18×18 multipliers optimized for high-speed arithmetic operations
- Maximum Frequency: Up to 770MHz system clock support
- Distributed RAM: 126 Kbits for flexible memory implementation
- Block RAM: 1,188 Kbits for efficient data storage and buffering
Package and Interface Details
- Package Type: 676-pin Fine-Pitch Ball Grid Array (FBGA)
- Part Number: XC3SD3400A-5FG676I
- I/O Pins: 469 user I/O pins for maximum connectivity
- Temperature Range: Industrial grade (-40°C to +85°C)
- Pin Configuration: FG676 package with industrial temperature rating (I suffix)
Key Performance Characteristics
- Clock Management: Advanced clock management with multiple PLLs
- Memory Interface: Support for various memory types including DDR, SRAM, and Flash
- Signal Integrity: Optimized for high-speed digital signal processing
- Power Efficiency: Low-power architecture suitable for portable applications
Price
The XC3SD3400A-5FG676I pricing varies based on quantity and distribution channel:
- Unit Price: Contact authorized distributors for current pricing
- Volume Discounts: Available for quantities exceeding 100 units
- Lead Time: Typically 2-12 weeks depending on availability
- Pricing Factors: Current market conditions, order quantity, and distribution channel
For the most accurate and up-to-date XC3SD3400A-5FG676I pricing information, we recommend contacting authorized AMD/Xilinx distributors such as:
- Digi-Key Electronics
- Mouser Electronics
- Avnet
- Arrow Electronics
Educational discounts may be available for qualifying academic institutions and research projects.
Documents & Media
Technical Documentation
- Primary Datasheet: Spartan-3A DSP FPGA Family Data Sheet (DS610)
- Package Documentation: FG676 package specifications and pinout diagrams
- Application Notes: DSP implementation guidelines and best practices
- Reference Manual: Comprehensive technical reference for system design
Design Resources
- PCB Footprints: Available for Altium Designer, EAGLE, KiCad, and OrCAD
- 3D STEP Models: Mechanical models for accurate PCB design
- Symbol Libraries: Schematic symbols for major EDA tools
- Layout Guidelines: PCB design recommendations for optimal performance
Software Support
- Development Tools: Compatible with Xilinx ISE Design Suite
- IP Cores: LogiCORE IP portfolio for accelerated development
- Programming Tools: JTAG configuration and debugging support
- Simulation Models: Behavioral and timing models for verification
Related Resources
Development Platforms
- Spartan-3A DSP Starter Kit: Complete development platform for rapid prototyping
- Evaluation Boards: Third-party development boards specifically designed for XC3SD3400A-5FG676I
- Reference Designs: Proven implementation examples for common applications
Compatible Products
- XC3SD3400A Family: Other speed grades (-4, -6) and package options
- Memory Interfaces: Compatible DDR, SRAM, and Flash memory solutions
- Clock Sources: Precision oscillators and clock generation circuits
- Power Management: Recommended power supply solutions
Technical Support
- AMD Answer Database: Comprehensive troubleshooting resources
- Community Forums: User groups and technical discussions
- Application Engineering: Expert support for complex design challenges
- Training Resources: Online courses and documentation for FPGA development
Software Tools
- Vivado Design Suite: Next-generation development environment
- IP Integrator: Graphical IP integration tool
- Logic Analyzer: Integrated debugging and analysis tools
- Timing Analyzer: Static timing analysis for performance optimization
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Fully compliant with Restriction of Hazardous Substances directive
- Lead-Free: Lead-free package construction meeting environmental standards
- REACH Compliance: Compliant with European REACH regulation requirements
- Conflict Minerals: Transparent reporting in accordance with regulations
Quality Standards
- Moisture Sensitivity: MSL-3 (Moisture Sensitivity Level 3) rating
- Operating Temperature: Industrial grade (-40°C to +85°C ambient)
- Storage Temperature: -65°C to +150°C for long-term storage
- Reliability Standards: Meets automotive, industrial, and commercial requirements
Export Control Information
- Export Control Classification Number (ECCN): 3A001.a.7
- Export Administration Regulations: Subject to U.S. EAR requirements
- License Requirements: May require export license for certain destinations
- Technology Transfer: Deemed export restrictions apply
- Country of Origin: Manufactured in accordance with international trade regulations
Packaging and Handling
- ESD Protection: Anti-static packaging for component protection
- Moisture Barrier: Sealed packaging to prevent moisture damage
- Traceability: Full lot traceability for quality assurance
- Handling Guidelines: Proper ESD precautions required during assembly
The XC3SD3400A-5FG676I represents the perfect balance of performance, features, and reliability for advanced digital signal processing applications. Its comprehensive DSP capabilities, combined with AMD’s proven FPGA architecture and extensive development ecosystem, make it the optimal choice for engineers developing next-generation electronic systems requiring high-performance programmable logic solutions.
