Product Specification
The XC3SD3400A-5FG676C is a cutting-edge field-programmable gate array (FPGA) from Xilinx’s Spartan-3A DSP family, engineered to deliver exceptional digital signal processing capabilities for demanding applications. This advanced FPGA combines high-performance processing with cost-effective design, making it an ideal choice for telecommunications, automotive, industrial automation, and consumer electronics applications.
Key Technical Features
The XC3SD3400A-5FG676C features approximately 3.4 million system gates with integrated DSP48A slices that provide dedicated multiply-accumulate functionality. This FPGA incorporates 126 DSP48A slices, enabling efficient implementation of complex digital signal processing algorithms including FIR filters, FFTs, and digital up/down converters.
The device includes 189,000 distributed RAM bits and 1,728 Kbits of block RAM, providing flexible memory options for data buffering and storage requirements. With 712 user I/O pins available in the 676-ball fine-pitch BGA package, the XC3SD3400A-5FG676C offers extensive connectivity options for complex system integration.
Operating at a speed grade of -5, this FPGA delivers fast signal processing performance with clock frequencies up to 550 MHz on dedicated clock networks. The device supports various I/O standards including LVDS, SSTL, and HSTL, ensuring compatibility with modern high-speed interfaces.
Price
The XC3SD3400A-5FG676C is competitively priced within the high-performance FPGA market segment. Pricing varies based on order quantity, packaging options, and supplier relationships. For current pricing information and volume discounts, contact authorized Xilinx distributors or visit the official Xilinx website. Educational institutions and qualifying organizations may be eligible for special academic pricing programs.
Documents & Media
Technical Documentation
Comprehensive documentation is available for the XC3SD3400A-5FG676C including detailed datasheets, user guides, and application notes. The Spartan-3A DSP FPGA User Guide provides complete specifications, timing characteristics, and design guidelines. Package and pinout information is available in the official packaging documentation.
Design Resources
Xilinx provides extensive design resources including reference designs, IP cores, and development tools. The ISE Design Suite supports the XC3SD3400A-5FG676C with synthesis, implementation, and debugging capabilities. ChipScope Pro analyzer enables real-time signal analysis and debugging for deployed designs.
Application Notes
Specialized application notes cover DSP implementation techniques, power management strategies, and high-speed I/O design considerations specific to the XC3SD3400A-5FG676C architecture.
Related Resources
Development Boards
Several development platforms support the XC3SD3400A-5FG676C including the Spartan-3A DSP Starter Kit and third-party evaluation boards. These platforms provide immediate access to FPGA capabilities with pre-built examples and tutorials.
Software Tools
The XC3SD3400A-5FG676C is fully supported by Xilinx ISE Design Suite, providing complete design flow from HDL entry through bitstream generation. MATLAB and Simulink integration enables model-based design workflows for DSP applications.
IP Cores
Extensive IP core libraries are available including DSP functions, communication protocols, and interface controllers optimized for the Spartan-3A DSP architecture. LogiCORE IP provides tested and verified building blocks for rapid system development.
Technical Support
Xilinx offers comprehensive technical support through online forums, application engineers, and training programs. Regular webinars and workshops provide ongoing education on advanced FPGA design techniques and emerging applications.
Environmental & Export Classifications
Environmental Compliance
The XC3SD3400A-5FG676C meets stringent environmental standards including RoHS compliance for lead-free manufacturing. The device is manufactured using halogen-free materials and packaging, supporting green electronics initiatives and environmental sustainability requirements.
Operating Conditions
This FPGA operates reliably across commercial temperature ranges from 0ยฐC to +85ยฐC, with extended temperature variants available for industrial applications. The device supports core voltages of 1.2V with I/O voltage compatibility from 1.2V to 3.3V.
Export Classifications
The XC3SD3400A-5FG676C is subject to U.S. export administration regulations and may require export licenses for certain international shipments. Classification codes and export control information are available through official Xilinx channels and authorized distributors.
Quality Standards
Manufacturing follows ISO 9001 quality management standards with comprehensive testing and qualification procedures. The device meets automotive AEC-Q100 standards when specified, ensuring reliability for safety-critical applications.
The XC3SD3400A-5FG676C represents a powerful solution for developers requiring high-performance DSP capabilities in a cost-effective FPGA platform, backed by comprehensive development tools and extensive technical support resources.
