1. Product Specifications
Core Architecture
- Product Family: Xilinx Spartan-3A DSP FPGA
- Part Number: XC3SD3400A-4FGG676CES
- Manufacturer: AMD (formerly Xilinx Inc.)
- Logic Elements: 53,712 logic cells
- System Gates: 3.4 million gates
- Technology: 90nm CMOS process technology
Performance Characteristics
- Operating Frequency: 667 MHz maximum
- Speed Grade: -4 (standard commercial grade)
- Supply Voltage: 1.2V core voltage
- Temperature Range: Commercial (0ยฐC to +85ยฐC)
Package Details
- Package Type: 676-pin Fine-pitch Ball Grid Array (FBGA)
- Package Code: FGG676
- I/O Count: 469 user I/O pins
- Mounting Type: Surface Mount Technology (SMT)
- Reflow Soldering: Compatible
DSP Features
- XtremeDSP DSP48A Slices: Enhanced DSP processing capabilities
- Block RAM: High-density memory blocks with enhanced performance
- Memory per Logic Ratio: Optimized for DSP applications
- Operating Speed: DSP blocks run at 250 MHz in -4 speed grade
Key Technical Specifications
- Logic Cells: 53,712 configurable logic blocks (CLBs)
- Distributed RAM: Extensive distributed memory resources
- Clock Management: Multiple clock domains support
- Configuration: SRAM-based configuration memory
- Power Consumption: Low-power 90nm technology
2. Price
Current Market Pricing (2025)
The XC3SD3400A-4FGG676CES pricing varies based on quantity, supplier, and current market conditions:
- Small Quantities (1-10 units): $200-350 USD per unit
- Medium Volumes (50-100 units): $180-280 USD per unit
- Large Volumes (500+ units): Contact for volume pricing
Price Factors
- Lead Time: Standard vs. expedited delivery
- Packaging: Tray vs. reel packaging options
- Certification: Commercial vs. industrial grade
- Market Availability: Current stock levels affect pricing
Note: Prices are subject to change based on market conditions, semiconductor availability, and global supply chain factors. Contact authorized distributors for current pricing and availability.
3. Documents & Media
Official Documentation
- Datasheet: Spartan-3A DSP FPGA Family Complete Datasheet (DS610)
- User Guide: Spartan-3A DSP FPGA User Guide
- Configuration Guide: Configuration User Guide
- PCB Design Guidelines: Package and PCB design recommendations
Development Resources
- Vivado Design Suite: AMD’s flagship FPGA design software
- ISE Design Suite: Legacy design tools (limited support)
- IP Core Library: Extensive intellectual property portfolio
- Reference Designs: Application-specific reference implementations
Technical Documentation
- Pin Mapping: Complete pinout and signal assignments
- Electrical Characteristics: DC and AC specifications
- Timing Reports: Setup and hold time requirements
- Power Consumption: Static and dynamic power analysis
Application Notes
- DSP Design Guidelines: Best practices for DSP implementations
- Clock Management: Clock distribution and timing closure
- Signal Integrity: High-speed design considerations
- Thermal Management: Heat dissipation strategies
4. Related Resources
Development Boards
- Spartan-3A DSP Starter Kit: Complete development platform
- Third-party Evaluation Boards: Various form factors available
- Custom Development Solutions: Partner ecosystem support
Compatible Components
- Configuration Devices: PROM and Flash memory options
- Clock Sources: Oscillators and clock generators
- Power Management: Voltage regulators and power sequencing
- Interfacing Components: Level shifters and I/O buffers
Software Tools
- Vivado HLS: High-Level Synthesis for C/C++ to HDL
- System Generator: DSP design using MATLAB/Simulink
- ChipScope Pro: Integrated logic analyzer
- PlanAhead: Floorplanning and constraint management
Application Areas
- Digital Signal Processing: Audio/video processing, communications
- Consumer Electronics: Set-top boxes, digital cameras
- Networking Equipment: Routers, switches, packet processing
- Industrial Automation: Motor control, sensor interfaces
- Medical Devices: Imaging systems, diagnostic equipment
Technical Support
- AMD Support Community: Online forums and knowledge base
- Application Engineering: Direct technical assistance
- Training Programs: FPGA design courses and workshops
- Partner Network: Authorized design service providers
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Fully compliant with RoHS directive 2011/65/EU
- REACH Regulation: Compliant with EU chemical safety requirements
- Conflict Minerals: Sourced from conflict-free suppliers
- Green Package: Lead-free and halogen-free packaging options
Temperature Classifications
- Commercial Grade (C): 0ยฐC to +85ยฐC junction temperature
- Industrial Grade (I): -40ยฐC to +100ยฐC junction temperature
- Extended Grade (E): -40ยฐC to +125ยฐC junction temperature
- Military Grade (M): -55ยฐC to +125ยฐC junction temperature
Moisture Sensitivity
- MSL Rating: Moisture Sensitivity Level 3
- Storage Conditions: โค30ยฐC/60% relative humidity
- Floor Life: 168 hours after bag opening
- Baking Requirements: 125ยฐC for 24 hours if exceeded
Export Control Classifications
- ECCN: Export Control Classification Number compliance
- Country of Origin: Manufacturing location disclosure
- Export Restrictions: Subject to applicable export regulations
- End-Use Applications: Controlled technology considerations
Quality Standards
- ISO 9001: Quality management system certification
- IATF 16949: Automotive quality management (where applicable)
- AS9100: Aerospace quality management (where applicable)
- Statistical Quality Control: Ongoing reliability monitoring
Packaging & Logistics
- Anti-Static Packaging: ESD-safe handling and storage
- Traceability: Full lot tracking and genealogy
- Shipping Classifications: Proper handling and transport requirements
- Customs Documentation: Complete export/import documentation
Buy XC3SD3400A-4FGG676CES from authorized distributors to ensure genuine parts, full warranty coverage, and technical support. This high-performance Spartan-3A DSP FPGA delivers exceptional value for cost-sensitive applications requiring advanced DSP processing capabilities and flexible programmable logic resources.
