Product Specifications
The XC3SD3400A-4FG676I features comprehensive specifications that position it as a premier solution for complex digital applications:
Core Architecture:
- Logic Cells: 3,400 system gates providing substantial processing capacity
- Speed Grade: -4 (high-performance grade for demanding applications)
- Package Type: FG676 (Fine-pitch Ball Grid Array)
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
- DSP Slices: Dedicated multiply-accumulate blocks for efficient signal processing
Memory and I/O Features:
- Block RAM: Configurable memory blocks for data storage and buffering
- Distributed RAM: Additional memory resources integrated within logic fabric
- I/O Standards: Support for multiple voltage levels and signaling standards
- User I/O Pins: Extensive connectivity options for system integration
Power and Performance:
- Low power consumption optimized for portable and embedded applications
- High-speed operation supporting demanding real-time processing requirements
- Advanced clock management units for precise timing control
The XC3SD3400A-4FG676I incorporates Xilinx’s proven FPGA technology, delivering reliable performance across industrial temperature ranges while maintaining excellent signal integrity.
Price
Pricing for the XC3SD3400A-4FG676I varies based on quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing information and volume discounts. The cost-effective nature of the Spartan-3A DSP family makes the XC3SD3400A-4FG676I an attractive option for both prototype development and volume production.
For accurate pricing and availability of the XC3SD3400A-4FG676I, consult with:
- Authorized electronic component distributors
- Xilinx direct sales representatives
- Online component marketplaces with verified suppliers
Documents & Media
Comprehensive technical documentation supports successful implementation of the XC3SD3400A-4FG676I:
Essential Documentation:
- Product datasheet with complete electrical specifications
- Spartan-3A DSP family user guide and architecture overview
- Package and pinout information for FG676 configuration
- Power consumption analysis and thermal management guidelines
Design Resources:
- Development board schematics and layout guidelines
- Reference designs demonstrating DSP applications
- Constraint files and timing analysis documentation
- PCB design guidelines for optimal signal integrity
Software Tools:
- Xilinx ISE Design Suite compatibility information
- IP core libraries optimized for Spartan-3A DSP architecture
- Simulation models and verification resources
The XC3SD3400A-4FG676I documentation package ensures designers have access to all necessary information for successful project implementation.
Related Resources
The XC3SD3400A-4FG676I ecosystem includes valuable resources that enhance development efficiency:
Development Tools:
- Xilinx ISE Design Suite for FPGA design and implementation
- ChipScope Pro for real-time debugging and analysis
- System Generator for DSP algorithm development
Evaluation Platforms:
- Spartan-3A DSP development boards featuring the XC3SD3400A-4FG676I
- Reference designs showcasing DSP capabilities
- Application notes for specific use cases
Technical Support:
- Xilinx technical support and community forums
- Training materials and webinars
- Third-party IP cores and design services
Compatible Products:
- Other Spartan-3A DSP family members for scalable solutions
- Complementary Xilinx FPGA families for system expansion
- Development tools and accessories
The comprehensive support ecosystem surrounding the XC3SD3400A-4FG676I accelerates development timelines and ensures successful project outcomes.
Environmental & Export Classifications
The XC3SD3400A-4FG676I meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant construction using lead-free materials
- REACH regulation compliance for European markets
- Industrial temperature grade operation (-40ยฐC to +100ยฐC)
- Moisture sensitivity level classification for proper handling
Quality Standards:
- ISO 9001 manufacturing quality systems
- Automotive-grade reliability testing where applicable
- Extended operating life specifications
- Comprehensive quality assurance testing
Export Classifications:
- Export control classification numbers (ECCN) as specified by regulations
- Country of origin marking for international shipping
- Compliance with international trade regulations
- Proper documentation for customs clearance
Package Information:
- Lead-free package construction
- Halogen-free materials where specified
- Recyclable materials supporting environmental sustainability
The XC3SD3400A-4FG676I environmental classifications ensure global compliance and support responsible electronics manufacturing practices.
The XC3SD3400A-4FG676I represents an excellent choice for engineers seeking high-performance FPGA solutions with integrated DSP capabilities. Its combination of processing power, cost-effectiveness, and comprehensive support makes it ideal for a wide range of applications from telecommunications to industrial automation.
