Product Specifications
The XC3SD3400A-4CGS484I delivers exceptional performance through its comprehensive feature set:
Core Architecture:
- System gates: 3,400,000 equivalent gates
- Logic cells: 53,712 configurable logic blocks
- Distributed RAM: 595 Kb capacity
- Block RAM: 2,268 Kb total memory
- Dedicated DSP48 slices: 126 multipliers for signal processing
Package Configuration:
- Package type: CSBGA (Chip Scale Ball Grid Array)
- Pin count: 484 pins in CSG484 package
- Speed grade: -4 (high-performance variant)
- Operating temperature: Industrial grade (-40ยฐC to +100ยฐC)
I/O Capabilities:
- User I/O pins: 372 configurable inputs/outputs
- Differential I/O pairs: 186 pairs available
- Voltage standards: Multiple I/O standards supported including LVTTL, LVCMOS, LVDS
Clock Management:
- Digital Clock Managers (DCMs): 8 units
- Phase-Locked Loops (PLLs): Advanced clock synthesis
- Maximum frequency: Up to 550 MHz internal clock rates
Price Information
The XC3SD3400A-4CGS484I pricing varies based on quantity and supplier. Contact authorized distributors for current pricing on the XC3SD3400A-4CGS484I, as semiconductor prices fluctuate with market conditions. Volume discounts are typically available for production quantities, making the XC3SD3400A-4CGS484I cost-effective for both prototyping and mass production applications.
Documents & Media
Essential documentation for the XC3SD3400A-4CGS484I includes:
Technical Documentation:
- Complete datasheet with electrical specifications
- Spartan-3A DSP family user guide
- Configuration and programming guides
- Package and pinout diagrams for CSG484 package
Design Resources:
- Reference designs and application notes
- Timing analysis documentation
- Power consumption guidelines
- PCB layout recommendations for XC3SD3400A-4CGS484I implementation
Software Tools:
- Vivado Design Suite compatibility information
- ISE Design Suite legacy support documentation
- Programming file formats and procedures
Related Resources
The XC3SD3400A-4CGS484I ecosystem includes various supporting components and tools:
Development Boards:
- Spartan-3A DSP evaluation platforms
- Starter kits featuring the XC3SD3400A-4CGS484I
- Custom development boards from third-party vendors
Companion ICs:
- Configuration memory devices (SPI Flash, PROM)
- Power management solutions optimized for Spartan-3A DSP
- Clock generation and distribution components
Design Software:
- Xilinx development environments
- Third-party synthesis and simulation tools
- IP core libraries compatible with XC3SD3400A-4CGS484I architecture
Application Areas: The XC3SD3400A-4CGS484I excels in digital signal processing applications including wireless communications, video processing, industrial automation, and aerospace systems where high-performance FPGA capabilities are essential.
Environmental & Export Classifications
The XC3SD3400A-4CGS484I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Industrial temperature range: -40ยฐC to +100ยฐC
- Moisture sensitivity level (MSL): Level 3
Export Classifications:
- Export Control Classification Number (ECCN): 3A001.a.7
- Harmonized Tariff Schedule (HTS): 8542.31.0001
- Country of origin: Various manufacturing locations
Quality Standards:
- ISO 9001 certified manufacturing
- Automotive grade variants available (AEC-Q100 qualified)
- Military and aerospace screening options
Package Environmental Data:
- Halogen-free package options available
- Pb-free soldering compatibility
- Electrostatic discharge (ESD) protection rating
The XC3SD3400A-4CGS484I represents a proven solution for high-performance digital signal processing applications, combining robust specifications with comprehensive development support. Its balanced feature set makes the XC3SD3400A-4CGS484I suitable for both cost-sensitive and performance-critical applications across diverse industries.
