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XC3SD3400A-1CSG484C Spartan-3A DSP FPGA – High-Performance Digital Signal Processing Solution

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Core Architecture Features

  • FPGA Family: Spartan-3A DSP Series
  • System Gates: 3.4 million gates
  • Logic Cells: 53,712 configurable logic cells
  • Maximum Operating Frequency: 667MHz
  • Process Technology: Advanced 90nm manufacturing process
  • Core Voltage: 1.2V for optimal power efficiency

Package and I/O Specifications

  • Package Type: 484-Pin LCSBGA (Low-profile Chip Scale Ball Grid Array)
  • User I/O Pins: 309 I/O pins
  • Operating Temperature Range: -40ยฐC to +100ยฐC (TJ) industrial grade
  • Supply Voltage Range: 1.14V to 1.26V
  • Mounting Type: Surface Mount

Advanced DSP Features

  • DSP Slices: XtremeDSP DSP48A slices for efficient multiply-accumulate operations
  • Block RAM: 2,322,432 bits of embedded memory
  • Enhanced Performance: DSP48A slices and block RAM run at 250 MHz in standard -4 speed grade
  • I/O Standards Support: LVTTL, LVCMOS, PCI, HSTL, SSTL, and differential signaling

Technical Capabilities

  • Logic Array Blocks (LABs): 5,968 CLBs for flexible logic implementation
  • Memory Interface: Multiple DDR, DDR2, and SRAM interfaces supported
  • Clock Management: Integrated Digital Clock Managers (DCMs) and Phase-Locked Loops (PLLs)
  • Configuration Options: Multiple configuration modes including JTAG, SelectMAP, and serial modes

2. Pricing Information

The XC3SD3400A-1CSG484C offers competitive pricing for high-performance FPGA solutions:

  • Small Quantity Pricing: Starting from $150-200 per unit (1-10 pieces)
  • Volume Pricing: $165-312 for quantities of 84+ units
  • Bulk Discounts: Volume discounts available for quantities of 168+, 336+, 504+, and 8400+ units
  • Lead Time: Typically 2-4 weeks for standard orders
  • Availability: Contact authorized distributors for current stock levels

Note: Prices may vary based on market conditions, quantity, and distributor. Contact authorized Xilinx distributors for current pricing and availability.

3. Documents & Media

Technical Documentation

  • Official Datasheet: AMD/Xilinx DS610 specification document
  • User Guide: Comprehensive architecture description and design guidelines
  • Application Notes: Design examples and best practices for DSP implementations
  • PCB Design Guidelines: Layout recommendations for optimal signal integrity
  • Package Information: Detailed mechanical drawings and pin assignments

Software and Development Tools

  • Vivado Design Suite: Complete FPGA design environment for synthesis and implementation
  • IP Core Libraries: Pre-verified intellectual property blocks for rapid development
  • Reference Designs: Proven implementations for common DSP applications
  • Simulation Models: VHDL and Verilog behavioral models for design verification

Additional Resources

  • 3D Package Models: Available for PCB design and mechanical verification
  • IBIS Models: For signal integrity analysis
  • Thermal Models: For thermal analysis and heat dissipation planning

4. Related Resources

Development Boards and Kits

  • Spartan-3A DSP evaluation boards featuring the XC3SD3400A
  • Reference design kits for specific applications
  • Educational development platforms for learning FPGA design

Compatible Products

  • Alternative Speed Grades: XC3SD3400A-4CSG484C, XC3SD3400A-5CSG484C
  • Different Package Options: XC3SD3400A-4FG676C (Fine-pitch BGA)
  • Family Variants: XC3SD1800A for lower gate count requirements

Application Areas

  • Digital Signal Processing: Broadband access, home networking, display/projection
  • Communications: Protocol processing and data conversion
  • Consumer Electronics: Digital television and multimedia processing
  • Industrial Control: Motor control and sensor interface applications
  • Embedded Systems: Custom logic implementation for specialized applications

Technical Support

  • Xilinx Community Forums for design assistance
  • Application engineering support from authorized distributors
  • Online training and certification programs
  • Technical webinars and design workshops

5. Environmental & Export Classifications

Regulatory Compliance

  • ECCN Classification: 3A991.d (Subject to U.S. Export Administration Regulations)
  • Harmonized Tariff Schedule:
    • US HTS Code: 8542390001
    • China HTS Code: 8542399000
    • TARIC Code: 8542399000

Environmental Standards

  • RoHS Compliance: Compatible with lead-free assembly processes
  • Quality Standards: Manufactured under ISO 9001 quality management systems
  • Moisture Sensitivity: MSL (Moisture Sensitivity Level) rating per JEDEC standards
  • ESD Protection: Electrostatic discharge sensitive device โ€“ proper handling required

Manufacturing Information

  • Country of Origin: Manufactured in qualified AMD/Xilinx facilities
  • Package Options: Available in tape and reel for automated assembly
  • Quality Assurance: 100% electrical testing and quality inspection

Lifecycle Status

  • Product Status: Active production (Note: Some variants may be in Last Time Buy phase)
  • Long-term Support: Continued support through AMD/Xilinx technical resources
  • Migration Path: Compatible upgrade paths to newer Spartan and Zynq families available

Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
Product Category: Field Programmable Gate Arrays (FPGAs)
Series: Spartan-3A DSP Family

The XC3SD3400A-1CSG484C represents the pinnacle of cost-effective FPGA technology, delivering unmatched DSP performance for next-generation embedded applications. Contact authorized distributors for detailed pricing, availability, and technical support.