1. Product Specifications
Core Architecture
- Logic Capacity: 1.8 million system gates with 37,440 logic cells
- Process Technology: 90nm CMOS technology for optimal power efficiency
- Operating Voltage: 1.2V core voltage
- Maximum Frequency: 667MHz operating frequency in industrial grade
DSP Performance Features
- XtremeDSP DSP48A Slices: 250 MHz performance with dedicated 18-bit by 18-bit multipliers
- Enhanced Pipeline Stages: Minimum 250 MHz performance in standard -4 speed grade
- MAC Operations: 48-bit accumulator for multiply-accumulate operations
- Integrated Arithmetic: Integrated adder for complex multiply or multiply-add operations with 18-bit pre-adder
Memory Architecture
- Block RAM: Up to 2,268 Kbits of fast block RAM with byte write enables
- Distributed RAM: Up to 373 Kbits of efficient distributed RAM
- Enhanced Performance: Registered outputs on block RAM with operation of at least 280 MHz
I/O Capabilities
- Package Type: 676-pin Fine-pitch Ball Grid Array (FBGA)
- I/O Pins: Up to 519 I/O pins or 227 differential signal pairs
- SelectIO Interface: Multi-voltage, multi-standard SelectIO interface pins
- Supply Flexibility: Dual-range VCCAUX supply simplifies 3.3V-only design
Power Management
- Power Optimization: Suspend and Hibernate modes reduce system power consumption
- Low-Power Option: Reduces quiescent current for battery-powered applications
2. Pricing
Current Market Pricing
Based on current market data, the XC3SD1800A-FGG676I pricing structure varies by quantity:
- 40+ units: $274.02 per unit
- 80+ units: $254.17 per unit
- 160+ units: $214.45 per unit
- 240+ units: $194.60 per unit
- 320+ units: $176.33 per unit
- 400+ units: $154.88 per unit
- 4000+ units: $145.35 per unit
Pricing subject to change based on market conditions and availability. Contact authorized distributors for current quotes and volume discounts.
Cost-Effectiveness
The Spartan-3A DSP family delivers more functionality and bandwidth per dollar than ever before, setting the new standard in the programmable logic and DSP processing industry. FPGAs avoid the high initial cost, lengthy development cycles, and the inherent inflexibility of conventional ASICs.
3. Documents & Media
Technical Documentation
- Datasheet: Spartan-3A DSP FPGA Family Datasheet (Document Type: Data Sheets, July 13, 2020)
- PCB Design Files: Symbol, PCB footprint, and 3D STEP models available for Altium Designer, EAGLE, KiCad, and OrCAD
Development Tools
- Design Software: Xilinx Vivado Design Suite – user-friendly synthesis and implementation tools, easier to use than ISE design tools
- Programming Support: Complete pinout information, programming tools, and starter kit resources available
Application Resources
- Reference Designs: Available for broadband access, home networking, display/projection, and digital television applications
- Technical Support: FPGA technical engineering support for pinout information, replacement guidance, and programming assistance
4. Related Resources
Development Platforms
Popular development boards include ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, and Digilent Arty S7
Compatible Products
- XC3SD3400A Series: Higher-density options within the same Spartan-3A DSP family
- Alternative Packages: CSG484 and other package variants available for different PCB requirements
Application Areas
Spartan-3A DSP FPGAs are ideally suited to a wide range of consumer electronics applications, such as broadband access, home networking, display/projection, and digital television. The Spartan-3A DSP family is a superior alternative to mask programmed ASICs.
Design Advantages
FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs
5. Environmental & Export Classifications
Environmental Compliance
- Process Technology: Manufactured using environmentally conscious 90nm CMOS process
- Lead-Free: Compatible with lead-free soldering processes
- RoHS Status: Please contact manufacturer for current RoHS compliance status
Export Classifications
- Manufacturer: Xilinx Inc. (now part of AMD)
- Country of Origin: Manufactured in qualified facilities meeting international standards
- Export Control: Subject to export control regulations – consult current export documentation
Quality Standards
- Industrial Grade: -I suffix indicates industrial temperature range operation
- Reliability: Proven 90nm process technology with extensive qualification testing
- Availability: Long-term product availability supported by established manufacturing processes
Package Information
- Package Type: 676-pin Fine-pitch Ball Grid Array (FBGA)
- Halogen-Free: Please verify current environmental specifications with manufacturer
- Moisture Sensitivity: Handle according to industry standard MSL (Moisture Sensitivity Level) requirements
Note: The XC3SD1800A-FGG676I represents a mature, cost-effective FPGA solution that balances high performance, comprehensive features, and competitive pricing for demanding DSP applications. Contact authorized Xilinx distributors for current availability, pricing, and technical support.
