Product Specifications
The XC3SD1800A-FG676C features robust specifications that make it suitable for complex digital processing tasks. This FPGA contains 1,800,000 system gates with 84,672 logic cells, providing substantial processing power for sophisticated applications. The device includes 84 dedicated 18×18 multipliers optimized for DSP operations, along with 3.3 Mb of distributed RAM and block RAM memory.
Built on advanced 90nm process technology, the XC3SD1800A-FG676C operates at commercial temperature ranges from 0ยฐC to +85ยฐC. The device features a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0mm ball pitch, ensuring reliable connectivity and thermal performance. Power consumption is optimized with multiple voltage domains supporting 1.2V core voltage and 2.5V/3.3V I/O operations.
The XC3SD1800A-FG676C supports multiple I/O standards including LVDS, LVTTL, LVCMOS, and differential signaling options. With 372 user I/O pins available, this FPGA provides extensive connectivity options for interfacing with external components and systems.
Price
Pricing for the XC3SD1800A-FG676C varies based on quantity, packaging options, and distribution channels. Volume pricing is typically available for orders exceeding 100 units, with additional discounts for larger quantities. The device is available through authorized Xilinx distributors and electronic component suppliers worldwide.
For current pricing information and availability of the XC3SD1800A-FG676C, contact authorized distributors or visit the official Xilinx website. Educational discounts may be available for academic institutions and research organizations.
Documents & Media
Comprehensive documentation supports the XC3SD1800A-FG676C implementation and development process. The official datasheet provides detailed electrical specifications, timing parameters, and package information essential for design integration. Pin configuration diagrams and package drawings are available in multiple formats including PDF and CAD-compatible files.
Development resources include reference designs, application notes, and user guides specifically created for the Spartan-3A DSP family. The Xilinx ISE Design Suite provides complete development environment support for the XC3SD1800A-FG676C, including synthesis, place-and-route, and debugging tools.
Technical documentation covers power estimation guidelines, thermal management recommendations, and PCB design considerations. Migration guides are available for designers transitioning from previous FPGA generations or competing platforms.
Related Resources
The XC3SD1800A-FG676C ecosystem includes comprehensive development tools and support resources. Xilinx ISE WebPACK software provides free development environment access for smaller designs, while the full ISE Design Suite offers advanced features for complex implementations.
Evaluation boards and development kits accelerate prototyping and proof-of-concept development. Third-party IP cores expand functionality with pre-verified solutions for common applications including digital filters, communication protocols, and interface standards.
Training resources include online tutorials, webinars, and documentation covering FPGA design best practices. Community forums and technical support channels provide additional assistance for XC3SD1800A-FG676C implementation challenges.
Environmental & Export Classifications
The XC3SD1800A-FG676C meets stringent environmental compliance standards required for global market deployment. The device is RoHS compliant, ensuring lead-free manufacturing processes and environmental responsibility. REACH regulation compliance documentation is available for European market requirements.
Export classification information indicates appropriate handling for international shipping and trade compliance. The XC3SD1800A-FG676C falls under specific Export Control Classification Numbers (ECCN) that may require export licenses for certain destinations or applications.
Temperature cycling, moisture sensitivity, and mechanical stress testing ensure reliable operation across diverse environmental conditions. The device carries appropriate quality certifications for automotive, industrial, and commercial applications where the XC3SD1800A-FG676C deployment is planned.
Conflict minerals reporting and supply chain transparency documentation support responsible sourcing requirements. Environmental impact assessments and lifecycle analysis data assist with sustainable design practices and regulatory compliance for products incorporating the XC3SD1800A-FG676C.
